List of Semiconductors and ICs products

For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

• Work gloves

Maximum output is 50W! Wavelength can be selected from 405nm to 1920nm.

• Other semiconductors
• Laser Components

We offer products in the wavelength ranges of 630-1650nm, 800-1650nm, and 1000-1650nm!

• diode

Heat sink combining an aluminum heat sink (W129 x H115mm) with an AC230V axial fan and air flow chamber.

• Other semiconductors

High-performance radiator with 3 AC230V axial fans + airflow chamber + aluminum heat sink.

• Other semiconductors

Powerful forced air cooling radiator combining AC230V axial fan, airflow chamber, and aluminum heat sink.

• Other semiconductors

CZ method/FZ method, we can provide single crystal silicon ingots up to a maximum diameter of Φ600mm!

• Other semiconductors

The misalignment of measures is due to the shallow exploration of the causes. By repeatedly asking questions, the essence becomes clear.

• Other semiconductors

Semiconductor parts microfabrication. We accept processing from 1 to 100 pieces per month.

• Other semiconductors

W190mm x H66mm hollow type heat sink with axial fan enables efficient heat dissipation.

• Other semiconductors

In addition to high-purity SiC for semiconductor device components, overseas SiC wafers, and refractory SiC, we also offer contract services for laser processing that is compatible with SiC components...

• Wafer
• Oxidation/Diffusion Device

Low power consumption radio tuner IC designed for disaster situations.

• Dedicated IC

Achieves angle accuracy of ±0.1°, comparable to optical types, with a magnetic encoder that is easy to assemble! No dust-proof measures are necessary! (Many successful switches from optical types have...

• Sensors
• Other semiconductors

A low-heat current sensor that contributes to the miniaturization of substrates!

• Other semiconductors
• Sensors

High-reliability 4Gb DDR3 memory series with built-in ECC.

• Memory

RAMXEED's RF communication and analog circuit technology for AD converters have been adopted by Seed Corporation's smart contact lenses!

• Memory

The wisdom of Japanese manufacturing × the abundant supply capacity of China

• Other semiconductors
• Other contract services

Maintains high stability even beyond the operating temperature in a compact size (2.0X1.6mm)!

• Other semiconductors

Environmentally resistant specifications supported! A SCSI-compatible memory drive is available as a replacement in case of failure. Comprehensive catalog and case study materials are currently being ...

• Memory

New SiC-SBD (low VF), compact surface mount package! AEC-Q101 compliant (planned).

• diode

Achieving the world's highest level of low loss! Samples are also available.

• Other semiconductors

Adopted by major domestic customers in FA, industrial machinery, and robot devices!

• Other semiconductors

Achieving world-class ultra-low VF! We would like to introduce our featured products.

• diode

Ultra-fast FRD, reducing recovery current by 40%! Low noise (reduction of noise countermeasure components)

• Other semiconductors

Overwhelming capacity of 800 machine tools! We will introduce processing examples of NC lathes (including multi-tasking machines).

• Processing Contract
• Other semiconductors

Socia's insulation panels are effective in manufacturing plants for semiconductors, precision machinery, pharmaceuticals, and food processing, as the temperature, humidity, and cleanliness do not fluc...

• Other semiconductors

SUS tank inside semiconductor manufacturing equipment

• Other semiconductors

[Factory Security] No software installation required

• Wafer
• controller
• Other inspection equipment and devices

Memory-focused company under the Chinese major television brand KONKA Group.

• Memory

Genuine adoption in various manufacturing equipment! It is also useful for repairs of manufacturing equipment.

• Other semiconductors
• Metal bearings

You can investigate the changes in degassing intensity while maintaining the temperature.

• Contract Analysis
• Memory

The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

• Contract Analysis
• Transistor

The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

• Contract Analysis
• magnet
• Memory

Microscopic structural analysis of amorphous films is possible through simulation.

• Contract Analysis
• Memory

It is possible to confirm the stress distribution in the sample cross-section.

• Contract Analysis
• Wafer

It is possible to evaluate trace metals in ppm orders.

• Contract Analysis
• Ceramics
• Wafer

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

• Contract Analysis
• Transistor
• Power storage device

Non-destructive three-dimensional observation of the internal structure of a discrete package.

• Contract Analysis
• Other semiconductors

Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

• Contract Analysis
• Other semiconductors

Evaluation of microscopic atomic structures is possible through computational simulation.

• Contract Analysis
• Other semiconductors

Reverse engineering of DRAM on the product's internal substrate.

• Contract Analysis
• Memory