List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

856~900 item / All 4818 items

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Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!

  • PRエリア.png
  • Other conveying machines

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Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!

  • Cooling system

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April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024

Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.

Contributing to high efficiency and miniaturization! Also effective against overvoltage and surge currents!

  • diode

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We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.

  • Other electronic parts
  • Prototype Services
  • Wafer

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The only option to prevent "positioning failure." An SDR receiver for next-generation satellite constellations equipped with independent L5 signal capture and radiation resistance.

  • Other semiconductors
  • Dedicated IC
  • Embedded Board Computers

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A professional in the transportation of precision equipment that supports power supply for data centers.

  • others
  • Other semiconductors

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Efficient heat dissipation is possible with an aluminum heat sink, axial fan, and airflow chamber.

  • la_v_hb1.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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We propose the optimal transportation route for display manufacturing, where temperature management is crucial.

  • others
  • Other semiconductors

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Achieving safe transportation of precision machinery. We propose delivery schedule management and optimal routes.

  • Wafer

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Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.

  • la_v_hb2.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.

  • la_v_hb3.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Ultra-hard alloy pins and shafts optimal for spindles that achieve micron precision.

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Introducing guide pins manufactured with micron to sub-micron precision grinding technology!

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Ultra-hard alloy rings for bearings that achieve micron-level precision.

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Supporting semiconductor manufacturing with micron to sub-micron precision grinding technology!

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Support for improving connector quality with micron to sub-micron precision grinding technology!

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Micron to submicron precision! Contributing to the miniaturization and high performance of medical devices.

  • Other Auto Parts
  • Other semiconductors
  • Processing Jig

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Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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High-frequency, high-current module contributing to the improvement of EV charging efficiency.

  • diode

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If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.

  • Other semiconductor manufacturing equipment
  • Resist Device
  • Wafer

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Chemical reactions caused by dilute gases can also be considered!

  • CVD Equipment
  • Wafer
  • Other semiconductors

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Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

  • Technical and Reference Books
  • Other semiconductors

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7/3 Webinar on Backend Processes, Assembly, and Design in Semiconductor Manufacturing

■Title "Fundamentals of Backend Processes, Packaging, and Design in Semiconductor Manufacturing" This seminar offers a systematic learning experience about backend processes and packaging technologies that support the high performance and functionality of semiconductors, covering everything from the basics to the latest trends. Experienced instructors will clearly explain the history of semiconductor package evolution, various package types, packaging processes, encapsulation technologies, and evaluation and analysis techniques. Additionally, the latest trends in advanced packaging technologies such as 2.5D/3D packaging, CoWoS, chiplets, hybrid bonding, and optoelectronic integration technologies that support the AI era will also be introduced. This content is recommended for engineers and researchers in fields such as chemistry, electronic components, and the automotive industry who wish to learn semiconductor packaging technology from the ground up. ■Event Details Date and Time: July 3, 2026 (Friday) 13:30–16:30 Instructor: Yosuke Hirumuta (Hirumuta Engineering Office, Quality and Technology Consultant) Participation Fee: 44,000 yen (tax included) Newsletter Member Price: 39,600 yen (tax included) Delivery Format: Live streaming via Zoom

Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)

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  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!

  • Wafer

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Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.

  • Wafer
  • Taping Machine

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.

  • Other metal materials
  • Other semiconductors

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Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.

  • Other semiconductors
  • stainless

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In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.

  • Other semiconductors
  • aluminum

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Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.

  • Other semiconductors
  • Other metal materials

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.

  • diode

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You can arrange and secure four transistors to the heat sink.

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1401-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1501-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1701-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.

  • JBHAE1801-2D.jpg
  • logo JARO Thermal.png
  • Other semiconductors

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