List of Semiconductors and ICs products
- classification：Semiconductors and ICs
946～990 item / All 4843 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
![[For Base Stations] SiCSBD Module](https://image.mono.ipros.com/public/product/image/388894/IPROS13165741284962301912.png?w=280&h=280){kind=small}
For high frequency and high current applications! SiCSBD module contributing to miniaturization.
- diode
SiC SBD modules contributing to high efficiency and miniaturization.
- diode
You can arrange and secure five transistors to the heat sink.
- Other semiconductors
High reliability and stable supply! Thyristor diode module
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
Contributing to the lightweighting of aerospace equipment through high-frequency operation of high-output power supplies.
- diode
Contributing to the improvement of safety in robot control! High-efficiency, compact SiC SBD module.
- diode
SiC SBD modules that contribute to high efficiency and miniaturization.
- diode
Contributing to high efficiency and miniaturization! Also effective against overvoltage and surge currents!
- diode
We propose coating equipment (spray coater) that can meet our customers' needs, utilizing years of prototype coating technology and a database.
- Other electronic parts
- Prototype Services
- Wafer
The only option to prevent "positioning failure." An SDR receiver for next-generation satellite constellations equipped with independent L5 signal capture and radiation resistance.
- Other semiconductors
- Dedicated IC
- Embedded Board Computers
A professional in the transportation of precision equipment that supports power supply for data centers.
- others
- Other semiconductors
Efficient heat dissipation is possible with an aluminum heat sink, axial fan, and airflow chamber.
- Other semiconductors
We propose the optimal transportation route for display manufacturing, where temperature management is crucial.
- others
- Other semiconductors
Achieving safe transportation of precision machinery. We propose delivery schedule management and optimal routes.
- Wafer
![[For Power Modules] Axial Flow Fan ...](https://image.mono.ipros.com/public/product/image/2049780/IPROS11447802576667341115.jpg?w=280&h=280){kind=small}
Efficient heat dissipation is possible with a W259mm x H121mm hollow-type heat sink, axial fan, and airflow chamber.
- Other semiconductors
![[For Power Module] Axial Fan Heat S...](https://image.mono.ipros.com/public/product/image/2049780/IPROS5639149101619974518.jpg?w=280&h=280){kind=small}
Lengths are available in 100, 150, 200, 250, and 300mm, and fan types can be selected from DC24V and AC230V.
- Other semiconductors
Achieved a high-speed cycle time and access time of 35ns! For replacing SRAM with battery backup.
- Memory
Solderable heat sink for surface mount devices measuring W13.5mm x H15.24mm x L19mm.
- Other semiconductors
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
High-frequency, high-current module contributing to the improvement of EV charging efficiency.
- diode
If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.
- Other semiconductor manufacturing equipment
- Resist Device
- Wafer
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
September 29 Webinar "Semiconductor Packaging and Encapsulation Technology"
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" --- This seminar systematically explains encapsulation materials that correspond to evolving semiconductor packages such as chiplets and 3D packages, covering everything from raw materials like epoxy resins, hardeners, and additives to design and evaluation. It will also introduce technological trends for next-generation encapsulation materials, including low dielectric, high thermal conductivity, and optoelectronic integration. 【Knowledge Gained from the Seminar】 - Types of semiconductor packages and the latest trends - Characteristics of wire bond, flip chip, wafer level, and advanced packages - Molding methods such as transfer and compression molding - Raw materials like epoxy resins, hardeners, and inorganic fillers - Required properties of encapsulation materials and material design techniques - Design for heat resistance, moisture resistance, and low stress - Evaluation techniques for moisture absorption reflow, heat cycles, and high temperature/high humidity - Next-generation encapsulation materials for low dielectric, high thermal conductivity, and optoelectronic integration 【Target Audience for the Seminar】 - Engineers involved in the design and use of semiconductor encapsulation materials - Designers of epoxy resins and hardeners for semiconductor encapsulation materials - Individuals interested in semiconductor packages and encapsulation materials
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors
Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!
- Wafer
Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.
- Wafer
- Taping Machine
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.
- Other metal materials
- Other semiconductors
Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.
- Other semiconductors
- stainless
In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.
- Other semiconductors
- aluminum
Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.
- Other semiconductors
- Other metal materials
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
You can arrange and secure four transistors to the heat sink.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors