List of Semiconductors and ICs products
- classification：Semiconductors and ICs
1756～1800 item / All 4824 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Fischer Elektronik manufactured high-performance heat sink for forced air cooling (hollow type) W200mm x H84mm
- Other semiconductors
Clip-type heatsink for TO-220 package semiconductors that can be mounted without screws.
- Other semiconductors
54mm diameter round LED heat sink
- Other semiconductors
Insulated clamp parts for TO-247 package power transistors
- Other semiconductors
Round Pin Heat Sink "ICK S R 140 x 70"
- Other semiconductors
Efficient heat dissipation is possible with a W129mm x H66mm hollow-type heat sink and axial fan.
- Other semiconductors
A clip that can securely make contact with a TO-220 package transistor and a heat sink.
- Other semiconductors
98 mm diameter x 50 mm height round pin fin heat sink (Al99.5)
- Other semiconductors
This is a black anodized heat sink for BGA with a width of 45 mm, a length of 42.5 mm, and a height of 6 mm.
- Other semiconductors
200mm diameter, 40mm height round LED heat sink
- Other semiconductors
Efficient heat dissipation is possible with a W66mm x H66mm hollow-type heat sink and an axial fan.
- Other semiconductors
Axial flow heat sink with axial flow fan for AC230V
- Other semiconductors
Heat sink for DIP IC (14, 16 contacts)
- Other semiconductors
High-performance heat sink for forced air cooling (hollow type) W400mm x H88mm, 31 fins
- Other semiconductors
With a pressing force of 55N, the transistor in the TO-220 and TO-3P packages can be reliably brought into contact with the heat sink.
- Other semiconductors
With a pressing force of 59N, it is possible to ensure that transistors in TO-248 and TO-218 packages make reliable contact with the heat sink.
- Other semiconductors
A pressing force of 20N can reliably ensure that the TO-220 package transistor makes contact with the heat sink.
- Other semiconductors
Zener diode combined with a transistor or MOSFET!
- Transistor
Built-in resistance allows for miniaturization of the set and reduction of component count due to the compact surface mount design!
- Transistor
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
Output current values can be adjusted according to the duty ratio of the pulse input signal!!
- ASIC
LED driver with adjustable light output now features additional protection functions, including open and short circuit detection!
- ASIC
You can download and view the latest flyers and catalog data distributed at the exhibition held in November 2024!
- Memory
- Other semiconductors
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
Achieving a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line! *Samples available upon request.
- Other semiconductors
Achieved a product pitch of ±0.03mm tailored to the specifications of the automatic assembly line!
- Other semiconductors
Achieves low RDS(on) to maximize the effective use of package space.
- Other semiconductors
Introducing our unique package and DioMOS technology fusion module!
- Other semiconductors
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
- Other semiconductors
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
- Other semiconductors
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
6/2 Webinar "AI Data Center Heat Dissipation/Cooling Technology"
■ Title: "Heat Dissipation/Cooling Technologies for AI Data Centers" ―― The rapid increase in data center power due to the expansion of generative AI. How to address PUE targets and high-heat GPUs. A practical overview from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling. A strategic course to master thermal issues. ■ Date and Time: June 2, 2026 (Tuesday) 10:30 AM - 4:30 PM ■ Zoom Streaming (Archive available for missed sessions with materials) 【Knowledge Gained from the Seminar】 - Basic knowledge of heat transfer - Heat dissipation knowledge in component and circuit board design - Common thermal design methods for forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc. 【Target Audience for the Seminar】 Electronic device designers (assembly design, mechanical design, circuit design, circuit board design), heat dissipation device/material developers, quality assurance, and quality control departments.
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
![[Problem Solving Case] Stacking Pin...](https://image.mono.ipros.com/public/product/image/532/2001503934/IPROS57835443135270624340.png?w=280&h=280){kind=small}
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
![[Problem Solving Case] Metal Substr...](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280){kind=small}
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
![[Problem Solving Example] Connectio...](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280){kind=small}
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d94/2001503941/IPROS18645158648223924469.png?w=280&h=280){kind=small}
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
![[Problem Solving Case] Terminals fo...](https://image.mono.ipros.com/public/product/image/3fb/2001503943/IPROS40703930758582890534.png?w=280&h=280){kind=small}
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors