List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
391～405 item / All 1008 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.
With wrapping processing technology, high-precision finishing is possible. It has low polishing drive power and features an energy-saving design that also considers the environment. [Exhibited at the ...
- Processing Contract
- Wafer processing/polishing equipment
- Other machine tools
Starting from January 23, it will be featured in a precision machining special!
If you are experiencing issues such as "the grinding machine cannot achieve flatness" or "the surface roughness cannot be cleared," please contact us directly. 【Features of Lapping Processing】 ○ Wet processing minimizes thermal distortion to the workpiece, resulting in less machining distortion. ○ Since the workpiece is processed without being chucked, it is less likely to introduce machining stress, leading to minimal changes in precision over time after processing. ○ Flatness that could not be achieved through turning, machining, or grinding can be attained with lapping processing. ○ By performing lapping on the reference surface before precision finishing processes (grinding, machining), high-performance finishing can be achieved.
We will introduce a case study of a customer who is facing the issue of grinding processing delivery times taking over a month!
- Wafer processing/polishing equipment
[Grinding Processing Case Studies] Grinding of carbide cutters from other companies and overseas is also possible.
We would like to introduce a case study that addresses the concerns of customers who are experiencing delivery times of over a month for grinding processing. ■Concern In previous transactions, when requesting grinding processing, the delivery time took over a month, and in urgent situations, it was not possible to meet deadlines, necessitating the maintenance of a larger inventory. Even then, when it was still not possible to meet deadlines, the only option was to stop the production line, which was problematic. ■Proposal Shortening the delivery time for grinding processing. ■Result Three days after sending the urgent grinding processing request, we were able to receive the items back, allowing us to quickly restore the halted production line. The inventory also improved to the minimum necessary quantity, making management easier. ■Case Summary - Issue: Delivery times were over a month, and when deadlines were missed, it was necessary to stop the production line. - Key points of the proposed service: Quick response tailored to the customer's needs.
![[Equipment Introduction] Deburring ...](https://image.mono.ipros.com/public/product/image/e65/2000872322/IPROS00930159113461217929.png?w=280&h=280){kind=small}
It is possible to uniformly grind large quantities of workpieces up to 1000mm wide! It excels in R chamfering processing.
- Other processing machines
- Wafer processing/polishing equipment
Automating polishing operations with robots. By combining a 3D camera and automatic path generation software, let the robot handle the polishing tasks!
- Wafer processing/polishing equipment
Exhibition at Cobot Expo Japan hosted by Universal Robots.
We plan to mainly exhibit a presentation of Nordbo products at the online exhibition "Cobot Expo Japan Autumn" hosted by Universal Robots.
Buff polishing of the inner surface of pipes is also possible! With our unique polishing machine and years of experience, we can appropriately respond to niche needs.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
Uniformly polish a large number of fine parts at once! Adopted in various fields such as precision components and kitchen equipment.
- Surface treatment contract service
- Other surface treatment equipment
- Wafer processing/polishing equipment
A 12-inch compatible wafer expander using a motor drive system. Support for up to 8 inches is also available.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
An air cylinder is used for driving the extension stage. The simple design achieves maintenance-free operation.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
Semi-automatic tabletop type wafer mounter for up to 8 inches.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Manual wafer mount for pre-cut tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
Auto-lamination without bubbles under preset pasting conditions.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter
A device that can accommodate both pre-cut tape and normal tape.
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
- Mounter