List of Wafer processing/polishing equipment products
- classification:Wafer processing/polishing equipment
61~120 item / All 1010 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
We will flatten metals and polymers with high precision.
- Wafer processing/polishing equipment
A lineup including tube skimmers, disc skimmers, and optional quick attachment devices!
- Wafer processing/polishing equipment
- Other processing machines
Automation of rough to finish machining of complex shapes without robot teaching! Contributing to labor reduction, time savings, and increased productivity in the polishing process. Test machining cur...
- Wafer processing/polishing equipment
We offer polishing processing services for various glass materials.
- Glass
- Processing Contract
- Wafer processing/polishing equipment
Air bearing cylinder with zero friction resistance.
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!
- Hand polishing and filing
- Grindstone
- Wafer processing/polishing equipment
Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!
- drill
- Wafer processing/polishing equipment
Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.
- drill
- Wafer processing/polishing equipment
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
- drill
- Wafer processing/polishing equipment
Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!
- Other surface treatment equipment
- Wafer processing/polishing equipment
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
- Wafer processing/polishing equipment
- Tap
Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Good hole processing is possible! You can regrind the brooch and reduce purchase costs.
- Wafer processing/polishing equipment
Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
The grinding stone is CBN #150! A precision end mill grinder capable of sharpening the tip and side edges.
- drill
- Wafer processing/polishing equipment
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
It is a polishing method that finishes the wrapped processed pear ground into a flat mirror surface.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
We will finish to your desired surface roughness using two methods: wrapping processing and polishing processing (mirror polishing method)!
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
Processing of large-diameter materials and thick plates, which are difficult to process with a multi-wire saw, is possible! This significantly reduces processing loss of expensive materials.
- Processing Contract
- Wafer processing/polishing equipment
- Circuit board processing machine
From ceramics to metals, glass, and single crystals, we accommodate a wide range of materials! Introducing our processing technology.
- Ceramics
- Other metal materials
- Wafer processing/polishing equipment
Both overall and individual load polishing is possible! We offer a variety of interchangeable polishing discs tailored to your needs.
- Wafer processing/polishing equipment
- Other abrasives
We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.
- Wafer processing/polishing equipment
Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly / IMT Corporation
IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A comprehensive production system from design to assembly in-house - Speedy response: Detailed and prompt service *For more details, please download the materials or contact us directly.
This is a new silicon wafer edge polishing device developed with the concept of space-saving and high throughput.
- Wafer processing/polishing equipment
Perfect for creating high-precision samples! We are currently giving away a technical book that reveals the best polishing conditions, leading to process reduction and improved accuracy!!
- Wafer processing/polishing equipment
High-Spec Dedicated Load Grinding Device
- Wafer processing/polishing equipment
A final polishing compound that enables the achievement of the highest level of polished surface when used in conjunction with the polishing cloth "Silica Final"!
- Wafer processing/polishing equipment
- Other abrasives
Particle size 0.045μm! A polishing agent that is difficult to agglomerate and settle, and can be dispersed in various organic solvents such as alcohol!
- Wafer processing/polishing equipment
- Other abrasives
Meticulous work unique to Japanese manufacturers! Detailed follow-up visits by sales representatives even after installation.
- Wafer processing/polishing equipment
I'm graduating from hand polishing!
- Wafer processing/polishing equipment
I'm graduating from hand polishing!
- Wafer processing/polishing equipment