List of Bonding Equipment products
- classification：Bonding Equipment
16～30 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Wedge bonder equipped with a direct drive motion system and a high-performance image recognition system, achieving high productivity and reliability.
- Other processing machines
- Bonding Equipment
- Other semiconductor manufacturing equipment
Techno Alpha is the Japanese distributor of K&S wire bonders, which boasts a top-class global share in wire bonding, as well as consumables for wire bonders.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.
- Bonding Equipment
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!
- Bonding Equipment
High-precision coating formation is possible on rectangular workpieces! It demonstrates high productivity for medium to large sizes.
- Bonding Equipment
A single YAG laser can be switched to a maximum of five optical output ports, achieving flexibility and space-saving throughout the entire process.
- Bonding Equipment
With the experimental equipment available, ideal metal bonding can be achieved through solid-phase joining using ultrasonic vibrations, resulting in a clean and low-loss process.
- Bonding Equipment
ASMPT is a backend equipment manufacturer based in Singapore.
- Bonding Equipment
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
Close and intimate engineering support! Application of a uniquely designed efficient manufacturing process! Wedge bonding type wire bonder.
- Bonding Equipment
Recommended for those who get scratches on chips with metal collets and feel that rubber collets lack strength.
- Bonding Equipment