List of Bonding Equipment products
- classification：Bonding Equipment
61～75 item / All 142 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
- Bonding Equipment
- Reflow Equipment
- Soldering Equipment
Solving issues such as storage and supply stability, wettability, and heat resistance! Next-generation environmental compatibility!
- Reflow Equipment
- Evaporation Equipment
- Bonding Equipment
The AD830Plus is an ultra-fast epoxy die bonder with a cycle time of 0.16 seconds per chip.
- Bonding Equipment
Responding to the challenges of assembly!
- Bonding Equipment
- Other services
Easy operation! Results such as wire trajectories are displayed visually!
- Bonding Equipment
Supporting the ever-evolving semiconductor applications!
- Other semiconductor manufacturing equipment
- Bonding Equipment
Tabletop manual wire bonder Model 626. It can be used for prototyping and development.
- Bonding Equipment
You can perform the entire series of operations from applying adhesive, bonding, to UV spot curing with a single piece of equipment!
- dispenser
- Bonding Equipment
A device that performs a series of processes from slit coating to vacuum lamination.
- Other assembly machines
- Bonding Equipment
Supports high-precision stacked packages such as NAND flash.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Bonding Equipment
Ideal for bonding small pin ICs such as QFN.
- Other semiconductors
- Bonding Equipment
It is a high-quality, high thermal capacity device-compatible die bonder for Dpak, To220 to To3p, and IGBT.
- Bonding Equipment