List of Bonding Equipment products
- classification：Bonding Equipment
31～60 item / All 142 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Wire bonder for various applications such as automobiles, electric vehicles (EVs), and semiconductors, using the wedge bonding method.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with a wide range of wire and ribbon sizes! Wedge bonding type wire bonder.
- Bonding Equipment
Adjust the height of the work holder to improve flexibility! Compatible with copper wire bonding! Wedge bonding type wire bonder.
- Bonding Equipment
Easily switch between wedge/ball settings! Compatible with copper bonding. *Over 9,000 units delivered worldwide.
- Bonding Equipment
Adjustable work holder height. Supports copper wire bonding. *24-hour online support available.
- Bonding Equipment
The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
Equipped with a comprehensive inspection feature! It is possible to check the quality before and after bonding.
- Bonding Equipment
Anode bonding support device
- Semiconductor inspection/test equipment
- Bonding Equipment
Multi-Wafer Handling Die Bonder (Auto)
- Bonding Equipment
Eagle AERO is a high-throughput wire bonding device.
- Bonding Equipment
CoS (Chip on Submount) is a high-precision die/flip chip bonder.
- Bonding Equipment
It is a flip chip bonder capable of bonding dies to wafers/dies/substrates with ultra-high precision of ±0.3μm at 3σ.
- Bonding Equipment
AFC Plus is a flip chip bonder capable of bonding dies to wafers/substrates/dies with high precision.
- Bonding Equipment
Nova plus is a flip chip bonder capable of high-speed bonding of dies to wafers/substrates/dies.
- Bonding Equipment
Utilizing ultra-precision machining to demonstrate excellent bonding properties.
- Bonding Equipment
Achieving stable tension force using a unique ceramic nozzle.
- Bonding Equipment
High-quality bonding capillary made in Japan. It is possible to design and manufacture according to bonding specifications using high-quality materials.
- Bonding Equipment
We can widely design and provide EFO torches for wire bonders used by various companies in the semiconductor industry.
- Bonding Equipment
- Other semiconductor manufacturing equipment
It can be customized for use with electronic equipment manufacturing devices from other companies. We actively conduct meetings before the design phase to deliver products that align with your company...
- Other semiconductor manufacturing equipment
- Bonding Equipment
No more worries about epoxy application! Designing the optimal solution. Superior application stability compared to genuine parts associated with the equipment.
- Other semiconductor manufacturing equipment
- Bonding Equipment
We provide support to carry out the semiconductor manufacturing backend processes more efficiently and accurately.
- Bonding Equipment
- Other semiconductor manufacturing equipment
Flexibly respond to the manufacturer's discontinuation of bonding products.
- Bonding Equipment
Surface modification, cleaning, hydrophilicity treatment, and adhesion enhancement with excellent low-temperature charge damage-free performance! Pen-type atmospheric pressure plasma device!
- Other semiconductor manufacturing equipment
- Bonding Equipment
- Circuit board processing machine
The flip chip bonder is ideal for small-scale production and development, perfect for high-precision assembly required for optical devices and more.
- Bonding Equipment
Ultra-high precision bonders that achieve both submicron accuracy and mass production capability.
- Bonding Equipment