List of Other semiconductor manufacturing equipment products
- classification：Other semiconductor manufacturing equipment
1726～1740 item / All 1996 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
The transfer from the wafer maker's carrier to the process carrier can be easily done manually.
- Other semiconductor manufacturing equipment
Standard support for COF and COG substrates with one unit! A semi-automatic flip chip bonder that achieves the industry's smallest installation space and low cost.
- Bonding Equipment
- Other semiconductor manufacturing equipment
High-performance flip chip bonder for multi-variety cell production lines.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Cell production support. Capable of handling everything from multi-variety production applications to process and material development!
- Bonding Equipment
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production purposes
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Elimination of coating unevenness and nozzle clogging with a unique nozzle.
- spray
- Circuit board processing machine
- Other semiconductor manufacturing equipment
IC bonding device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Tabletop semi-automatic machine for cell production use.
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
LCD substrate terminal cleaning device
- Other semiconductor manufacturing equipment
- Surface treatment contract service
Implementation Solution Service
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Notice of Participation in the 22nd Fine Tech Japan - Low Power Atmospheric Pressure Plasma Device with Reduced Ozone and Nitrogen Oxide Emissions
Well, Inc. (Location: Shinagawa, Tokyo; CEO: Naoyuki Eda), a provider of advanced semiconductor packaging solutions centered around test chips, will exhibit at the 22nd Fine Tech Japan, which will be held at Tokyo Big Sight from April 11 (Wednesday) to April 13 (Friday), 2012. Well's atmospheric pressure plasma equipment is characterized by its environmental friendliness, featuring low power consumption (CO2 reduction) while suppressing the generation of ozone and nitrogen oxides. Additionally, it does not require a vacuum chamber like conventional equipment, combining low capital investment with low running costs, which is its greatest economic advantage. On the day of the event, we will conduct a demonstration using the compact tabletop MyPL-Auto150, allowing you to experience actual large-area plasma irradiation. We sincerely look forward to your visit. 【Contact Information for Inquiries】 Well, Inc. Packaging Solutions Sales Department Tel: 03 (5715) 3501 Email: info@welljp.co.jp http://well-plasma.jp/
Real-time monitoring system for semiconductor packaging process anomalies
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Dispenser & UV irradiation device
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Ultrasonic flip chip bonder
- Bonding Equipment
- Circuit board processing machine
- Other semiconductor manufacturing equipment
Binary code signal input MP3 127ch audio playback board
- Other semiconductor manufacturing equipment
It is a 16-channel contact control type board compliant with RoHS.
- Other semiconductor manufacturing equipment