List of Other semiconductor manufacturing equipment products
- classification:Other semiconductor manufacturing equipment
136~180 item / All 1978 items
Continuous manufacturing process of single micron particles (wet adjustment method)
- Lithium-ion battery
- Capacitor
- Other semiconductor manufacturing equipment
1μm filtration! Contributing to improved yield in semiconductor manufacturing.
- Grinding Machine
- Wafer processing/polishing equipment
- Other semiconductor manufacturing equipment
Achieving stable slurry supply! GEMU slurry supply application case for semiconductor manufacturing.
- valve
- Other semiconductor manufacturing equipment
All-fluoropolymer durable pressure gauge!!
- Pressure
- CMP Equipment
- Other semiconductor manufacturing equipment
Custom-made modular type! Easy maintenance and flexible combinations realized by the customer!
- valve
- Other semiconductor manufacturing equipment
We propose a solution for pressure relief valves related to semiconductor chemical supply in a new form! It can be selected for a wide range of applications.
- valve
- Other semiconductor manufacturing equipment
Introducing the mechanism of "silent degradation" that leads to the destruction of electronic devices without being noticed!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductors and ICs
Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'
"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.
A detailed explanation of specific approaches to surface treatment that are key to maximizing the quality of semiconductor resin encapsulation!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductors and ICs
Before the resin encapsulation of semiconductors." "A page has been added on 'Why did the 'Quiet Evolution' occur?'
"Before the resin encapsulation of semiconductors." We have added a page to the technical document titled "Why Did the 'Silent Evolution' Occur?" The article provides a detailed explanation of the basic concepts of semiconductor resin encapsulation, as well as specific approaches to surface treatment that are key to maximizing quality. Additionally, the technical document systematically organizes the mechanisms behind the deterioration of insulation and the instability of resin bonding strength, and explains advanced insights into surface design and cleaning technologies that are essential for high-reliability devices. We encourage you to read it.
Covers everything from low-frequency vibrations to mechanical vibrations in one.
- Other machine tools
- Piping Materials
- Other semiconductor manufacturing equipment
Store the carrier as is or in a case.
- Other semiconductor manufacturing equipment
We can design and manufacture cleaning solutions for all types of fixtures, including cassettes and quartz fixtures, according to your needs. Stainless steel options are also available.
- Other semiconductor manufacturing equipment
Compatible with high aspect ratio TGV/TSV. The world's largest chamber size for ALD (1000mm□).
- Other semiconductor manufacturing equipment
- Plasma surface treatment equipment
- Surface treatment contract service
It is said to be difficult in ALD, but it is possible to form a powder film at low temperature (room temperature) and atmospheric pressure!
- Plasma surface treatment equipment
- Surface treatment contract service
- Other semiconductor manufacturing equipment
Dicing ring (frame) cleaning device available in two types: jet cleaning type (non-contact) and scrub cleaning type (contact).
- Other semiconductor manufacturing equipment
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) GHB-6755
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) G130
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
A wide variety of options are available, including types that maintain cleanliness levels below Class 100 and those compatible with large glass substrates.
- Other conveying machines
- Other semiconductor manufacturing equipment
Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) PG-V3-1180-1860
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
All-in-one case for substrate transport (Alpoly case)
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
Non-contact up to G8! Our "Case Management System" allows for Eco Mark acquisition, making storage and maintenance convenient.
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
Substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL) GHB-8868
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
Bag-type substrate transport case for LCD (Liquid Crystal Display) and OLED (Organic EL).
- Other conveying machines
- Other semiconductor manufacturing equipment
- Packaging materials
Disco SPR-101 Robot System Modification
- Other semiconductor manufacturing equipment
A valve compatible with an integrated gas system that can be used with various gases in high-temperature environments (up to 200°C).
- Other semiconductor manufacturing equipment
- valve
- Pipe Fittings
Introducing fittings that ensure reliable fastening power through our unique structure! Designed for ease of use, they can be detached and reattached even after piping installation.
- Other semiconductor manufacturing equipment
- valve
- Pipe Fittings
High-speed opening and closing with high response stability! Capable of accommodating special face-to-face dimensions, valve shapes, and corrosion-resistant material bodies.
- Other semiconductor manufacturing equipment
- valve
- Pipe Fittings
Features stable solder ball mounting and improves productivity through an inline system.
- Other semiconductor manufacturing equipment
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
- Assembly Machine
- Other semiconductor manufacturing equipment
A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].
- High pressure cleaner
- Other semiconductor manufacturing equipment
- Resist Device
Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.
We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!
I will explain in detail the differences between Teflon and fluoropolymer, which are often confused.
- Other semiconductor manufacturing equipment
I will explain the differences between fluororesin and Teflon.
- Other semiconductor manufacturing equipment
[Presentation of Materials] We will introduce the differences in features between Teflon fluoropolymer "PTFE" and "PFA" resins and coatings.
- Other semiconductor manufacturing equipment
100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].
- Other semiconductor manufacturing equipment
Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)
Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.
A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.
- Other semiconductor manufacturing equipment
Notice of Participation in "Semicon Japan 2018"
We will be exhibiting at "SEMICON Japan 2018," which will be held at Tokyo Big Sight in December 2018! We will be participating in the "SEMICON Japan 2018 (Back-End & General Zone)." ▼ Exhibited Products - "Ultrasonic Cutting Device CSX-400 Series" - "Chip 6-Sided Appearance Inspection Device CI-4000" - "Ultra-Low Load Compatible Flip Chip Bonder CB-600" - "Tabletop LED Light Source UV Irradiation Device" We sincerely invite you to visit our booth during this opportunity. 【Date】 December 12 (Wednesday) - 14 (Friday), 2018 10:00 AM - 5:00 PM 【Venue】 Tokyo Big Sight, East Exhibition Hall, Conference Hall 【Booth Number】 2009
A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.
- Other semiconductor manufacturing equipment
A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.
- Other semiconductor manufacturing equipment
TGV Glass Microfabrication Technology LIDE (Laser Induced Deep Etching)
- Other semiconductor manufacturing equipment
Invitation to Exhibit at the Microwave Exhibition 2025
Microwave Exhibition 2025 Exhibition Overview 【Dates】November 26 (Wednesday) - 28 (Friday), 2025, 10:00-17:00 【Venue】Pacifico Yokohama Exhibition Hall 【Our Booth】Exhibition Hall D M-08 ■ Products from LPKF Laser & Electronics ■ 【Exhibits】 - High-frequency application circuit board processing machine "LPKF ProtoMat S104" A specialist for high-frequency and microwave applications. It is equipped with all the functions necessary for PCB prototyping. - LPKF glass micro-processing LIDE technology "Vitrion series" processing samples Micro-hole drilling of glass using LIDE technology = The LIDE method modifies the glass with a laser and then generates holes through an etching process, achieving a safe method without micro-cracks or chipping. Please click the related link below for pre-registration ☟ *Pre-registration is required for attendance. Feel free to reach out for technical consultations. We sincerely look forward to your visit. October 2025 Brooks Japan Co., Ltd. Contact: Toyama, Isobe
You can individually or simultaneously switch the negative pressure of the airway ON/OFF.
- Vacuum Equipment
- Sealing
- Other semiconductor manufacturing equipment
We provide repair and improvement services with extensive experience in peripheral equipment for semiconductor manufacturing devices.
- Other semiconductor manufacturing equipment
Minimize the footprint within the device! But with excellent high pressure and flow capacity! Fluororesin valve.
- valve
- Other semiconductor manufacturing equipment