List of Other electronic parts products
- classification：Other electronic parts
7891～7920 item / All 8165 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Easy-to-connect crimp connections can be made with crimping tools that comply with JIS C 9711.
- Other electronic parts
We manufacture and assemble various special specifications of parts according to needs.
- Other electronic parts
- Contract manufacturing
Function Block integrated to capture signals to a workstation and business monitor.
- Other electronic parts
For in-vehicle devices and more. We create future light systems.
- Other electronic parts
A small electronic buzzer that serves two functions; it can be used as a speaker.
- Sound Parts
- Oscillator
- Other electronic parts
Quality inspection, assembly, packaging
- Other electronic parts
- Other services
- Processing Contract
Nano-coating treated heat dissipation plate for LED lighting
- Other electronic parts
Advanced implementation evaluation TEG (test) chip
- Other electronic parts
- others
- Processing Contract
Glass chip for observing underfill entrapment voids.
- Other electronic parts
- others
- Processing Contract
![LED Bar Module [Full Color LED]](https://image.mono.ipros.com/public/product/image/b8b/135151043/IPROS_11976752171271250000.JPG?w=280&h=280){kind=small}
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 2 chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 3 Chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
Metal base CCL substrate for high-power LEDs
- Other electronic parts
Test chip with next-generation solder bumps.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating Cu bonding with Cu bumps.
- Other electronic parts
- others
- Processing Contract
![Test chip [Large general-purpose]](https://image.mono.ipros.com/public/product/image/232/135151026/IPROS_18202600641364791000.gif?w=280&h=280){kind=small}
Test chip [Large general-purpose]
- Other electronic parts
- others
- Processing Contract
Test chip 【Ultra-small chip size 0.55mm】
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating LCD driver implementation.
- Other electronic parts
- others
- Processing Contract
Test chip for thermal resistance and stress measurement.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch wire bonding evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip with solder bumps
- Other electronic parts
- others
- Processing Contract