List of Other electronic parts products
- classification:Other electronic parts
8326~8370 item / All 8581 items
We provide comprehensive support from design to manufacturing and maintenance!
- Contract manufacturing
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
Quality inspection, assembly, packaging
- Other electronic parts
- Other services
- Processing Contract
Nano-coating treated heat dissipation plate for LED lighting
- Other electronic parts
Advanced implementation evaluation TEG (test) chip
- Other electronic parts
- others
- Processing Contract
Glass chip for observing underfill entrapment voids.
- Other electronic parts
- others
- Processing Contract
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 2 chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
LED Bar Module [High Brightness White LED 3 Chips]
- Other electronic parts
Selling ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm.
Well Co., Ltd. (Location: Shinagawa-ku, Tokyo; CEO: Naoyuki Eda), a next-generation semiconductor implementation solution company centered around test chips, will sell ultra-thin flexible LED bar modules with a substrate thickness of 0.5mm. Thanks to the ultra-thin flexible substrate and 3M adhesive tape, installation is easy in curved areas and tight spaces. You can use it starting from a minimum size of 30mm (with 3 LEDs). Choose from red, yellow, blue, green, white, or RGB for the mounted LEDs. <Introduction Homepage> http://well-led.jp/led_flexibemodule.aspx <Inquiries regarding this matter> Well Co., Ltd. LED Division 2-2-25 Higashi-Shinagawa, Shinagawa-ku, Tokyo 140-0002, Sunwood Shinagawa Tennozu Tower 2F Tel: 03-5715-3501 Fax: 03-5715-3502 info@welljp.co.jp http://well-led.jp/led_inspectionsystem.aspx
Metal base CCL substrate for high-power LEDs
- Other electronic parts
Test chip with next-generation solder bumps.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch WB/FC mounting evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating Cu bonding with Cu bumps.
- Other electronic parts
- others
- Processing Contract
Test chip [Large general-purpose]
- Other electronic parts
- others
- Processing Contract
Test chip 【Ultra-small chip size 0.55mm】
- Other electronic parts
- others
- Processing Contract
Test chip for evaluating LCD driver implementation.
- Other electronic parts
- others
- Processing Contract
Test chip for thermal resistance and stress measurement.
- Other electronic parts
- others
- Processing Contract
Test chip for ultra-fine pitch wire bonding evaluation.
- Other electronic parts
- others
- Processing Contract
Test chip with solder bumps
- Other electronic parts
- others
- Processing Contract
Test chip with solder bumps
- Other electronic parts
- others
- Processing Contract
Removal of special solder and low-temperature solder.
- Other electronic parts
Supply of high-performance, low-cost products is possible.
- Other electronic parts
Available for ultra-wideband use from 10 MHz to 10 GHz.
- High frequency/microwave parts
- Other electronic parts
By using heat shrink tubing, it can also become a simple insulated connector.
- Other electronic parts
This is an introduction to the logic circuit training equipment handled by Iwatō Keisoku Co., Ltd.
- Other electronic parts
This is an introduction to the pulse circuit training equipment handled by Iwatsu Measurement Co., Ltd.
- Other electronic parts
Ultra-stable, high-precision crystal oscillator device
- Other electronic parts
It is a tube for the protection and insulation of wiring harnesses, cables, etc.
- Other electronic parts
Ideal for surface modification with TiN, CrN, TiAlN, etc.!
- Other electronic parts
- Other Auto Parts
At OES, we handle a variety of processed products for heat exchangers.
- Other machine elements
- Other electronic parts
At OES of the heat exchanger, we handle various extrusion and press products.
- Other machine elements
- Other electronic parts
At OES, we handle a variety of material products for heaters.
- Other machine elements
- Other electronic parts
We take full responsibility for providing consistent service.
- Other electronic parts
It is a circuit formation method using hot stamping.
- Other electronic parts
We take full responsibility for providing consistent service.
- Other electronic parts