List of Visual Inspection Equipment products
- classification:Visual Inspection Equipment
31~45 item / All 1389 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
[Exhibition at Nepcon Japan 2026] CoaXPress camera that does not require a fan or heat sink. With a low heat generation design, you no longer have to worry about heat management.
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
Japan Bo Pixel Product Comprehensive Catalog
[Latest] Japan Bo-Pixel Product Comprehensive Catalog [2025.08.A] You can download it from the bottom of this page > Related Catalogs. ■ Japan Bo-Pixel's CoaXPress Cameras High-speed and high-resolution, yet compact and fanless CoaXPress cameras. By adopting "next-generation key devices," we are addressing the traditional issue of heat generation, leveraging the advantages unique to latecomer manufacturers to take a new approach. [Contents] ■ CoaXPress Area Scan Camera ■ CoaXPress Line Scan Camera ■ CameraLink ■ 3D Camera ■ DLP Projector *For detailed information and specifications, please contact us.
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
We exhibited at NEPCON Japan 2026 (digest version materials available).
◇◆We exhibited at the 40th InterNepcon Japan◆◇ ーーーーーーーーーーーーーーーーーーーーーーーーーー Thank you for your continued support. This is Japan Bopixel. The "40th InterNepcon Japan," held from January 21 to 23, recently concluded successfully. We sincerely thank everyone who visited us. 【Highlights of this exhibition】 - 105MP/245MP ultra-high-resolution sensor-equipped CoaXPress area scan cameras - 10MP/14MP/21M ultra-high-speed CoaXPress area scan cameras - 8k TDI 1MHz CoaX over Fiber 100G line scan cameras - 2k & 4k CoaXPress line scan cameras ▼ You can download the PDF materials of the new products introduced at the exhibition from the "Related Materials" section at the bottom of this page. Related Materials > Exhibition Digest_Japan Bopixel.pdf We also welcome requests for individual explanations! Please feel free to contact us. Japan Bopixel Corporation, Sales Department
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
- Monochrome camera
- Technical and Reference Books
- Visual Inspection Equipment
[Free Imaging Test] Imaging and inspecting the outer circumference and inner surface of cylindrical products!
- Visual Inspection Equipment
Synchronize the control of the work rotation and camera position! Capable of handling elliptical shapes.
- Visual Inspection Equipment
Synchronize the control of the work rotation and the camera position! Capable of handling eccentric shapes.
- Visual Inspection Equipment
I would like to briefly introduce the successful exhibition content of FPC.
- Printed Circuit Board
- Visual Inspection Equipment
- Transport and handling robots
Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan
Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.
Here is a brief introduction to the successful exhibition content.
- Printed Circuit Board
- Visual Inspection Equipment
- Transport and handling robots
Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan
Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.
Power semiconductor applications, appearance inspection of ceramic substrates detected with rule-based + AI technology! Efficiency improvement in the verification process with AI technology!
- Visual Inspection Equipment
Cycle time of 1 second, high-precision image inspection of 6 sides! Introducing a case where production efficiency has dramatically improved.
- Visual Inspection Equipment
Inspection processes that require speed, volume, and accuracy! Achieving improvements in quality and efficiency while reducing the burden on the site.
- Visual Inspection Equipment