List of Contract Analysis products
- classification:Contract Analysis
631~675 item / All 2066 items
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- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Measurement targeting microdomains is possible.
- Contract Analysis
Technical information "Raman 3D mapping of organic multilayer films" and three other items have been released.
We have published the following three analysis case studies on the MST website: - Raman 3D mapping of organic multilayer films - Evaluation of metal and organic contamination on wafer surfaces - Foreign substance analysis on metal components using Raman For more details, please visit the MST website. http://www.mst.or.jp/
Depth direction analysis will be conducted to a depth of several micrometers.
- Contract Analysis
- Contract manufacturing
We will evaluate the internal structure of the device in a comprehensive manner.
- Contract Analysis
- Other electronic parts
Evaluation of GFRP is possible according to the purpose.
- Contract Analysis
- Contract measurement
It is possible to analyze the deformation behavior of nanomaterials in response to environmental changes (pressure and temperature).
- Contract Analysis
Observation of SIM images is possible with high resolution (accelerating voltage 30kV: 4nm).
- Contract Analysis
- Contract measurement
- Contract Inspection
Reduce the impact of foreign object surrounding information with appropriate sampling.
- Contract Analysis
Lattice image analysis using the FFTM method
- Contract Analysis
Capable of observing large-area surface shapes.
- Contract Analysis
X-ray reflectivity measurement (XRR) allows for non-destructive analysis of film thickness and density.
- Contract Analysis
Evaluation of nitrogen in SiON with a film thickness of approximately 1 nm is possible.
- Contract Analysis
Measurement avoiding the effects of surface irregularities and high concentration layers using SSDP-SIMS.
- Contract Analysis
Evaluation of dopant distribution and junctions is possible even in extremely shallow regions.
- Contract Analysis
Waveform analysis and evaluation of the depth distribution of bonding states by Ar sputtering.
- Contract Analysis
We have compiled frequently asked questions regarding your order in an FAQ format.
- Contract Analysis
Reduce the impact of foreign matter surrounding information through appropriate sampling and microscopic measurement.
- Contract Analysis
A lineup of AlGaN standard samples with various Al compositions.
- Contract Analysis
Visualization of pharmaceutical components using TOF-SIMS.
- Contract Analysis
Evaluation of the top surface of modified layers of polymers, resins, and films using TOF-SIMS is possible.
- Contract Analysis
Quantitative analysis of interstitial oxygen and carbon concentration non-destructively using infrared absorption method.
- Contract Analysis
Quantitative analysis of main components and trace components is possible.
- Contract Analysis
Verification of the luminous characteristics of the chip and phosphor in white LEDs.
- Contract Analysis
Evaluation of the composition and distribution of impurities in polymer materials using XRF.
- Contract Analysis
Measurement examples of cleaning residues using TOF-SIMS.
- Contract Analysis
It is possible to evaluate the depth distribution of B, Al, N, P, and As in SiC with high sensitivity.
- Contract Analysis
Imaging SIMS enables the evaluation of localized elements.
- Contract Analysis
Imaging SIMS allows for the evaluation of localized elements.
- Contract Analysis
It is possible to identify the components of each layer of PET bottles using TOF-SIMS.
- Contract Analysis
Cool the sample and evaluate the shape of the separator more accurately.
- Contract Analysis
- Contract measurement
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract Analysis
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract Analysis
It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.
- Contract Analysis
Estimation of film thickness using the average free path of photoelectrons.
- Contract Analysis
Evaluation of localized elements is possible with imaging SIMS.
- Contract Analysis
Evaluation of activation rate is possible through composite analysis.
- Contract Analysis
The coordinate linkage function with the foreign object inspection device allows for the evaluation of specific foreign objects.
- Contract Analysis
Evaluate film thickness, density, and bonding state.
- Contract Analysis
Capable of evaluating the composition of the main elemental components of GaN-based LEDs in the depth direction.
- Contract Analysis
It is possible to obtain the impurity profile in the GaN-based LED structure from the backside.
- Contract Analysis
Capable of highly sensitive evaluation of the distribution of additives at the ppm level.
- Contract Analysis
Capable of evaluating the composition of the main elemental components of compound semiconductors in the depth direction.
- Contract Analysis
Evaluation of melamine concentration in infant formula milk powder
- Contract Analysis
Capable of structural analysis at the nanoscale and evaluation of nanoparticle size.
- Contract Analysis
It is possible to evaluate the film thickness of the degraded layer using the GCIB (Ar cluster).
- Contract Analysis
ICP-MS: Inductively Coupled Plasma Mass Spectrometry
- Contract Analysis
Technical Information "Analysis of Trace Metal Elements in the Environment (B0231)" Released
We have published the following analysis case on the MST website: - Trace metal element analysis in the environment (B0231) For more details, please visit the MST website. http://www.mst.or.jp/