List of Contract measurement products

  • classification:Contract measurement

241~255 item / All 2156 items

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

  • Other semiconductors
  • Processing Contract
  • Wafer

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Scanning Microwave Microscopy

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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SRA:Spreading Resistance Analysis

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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OBIRCH is a method that utilizes the change in resistance caused by the heat generated at defect locations when light is applied, to identify abnormal areas.

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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The lock-in thermal analysis method detects slight temperature increases in the current path.

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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DSC can evaluate the physical properties of a sample based on the heat changes that occur during heating.

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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High-performance liquid chromatography (HPLC) is a method that separates and detects components in a liquid by utilizing the differences in interactions between the stationary phase and the mobile pha...

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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The Karl Fischer titration method is a technique that uses chemical reactions to quantify the moisture content in a sample.

  • 打ち合わせ.jpg
  • セミナー.jpg
  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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Capable of evaluating the distribution and structure of active materials in secondary batteries in three dimensions.

  • 3Dレンダリング像.png
  • 2D断面像.png
  • 粒子サイズのヒストグラム.png
  • C0617_サムネ.png
  • Contract measurement

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Separation of components in the Cu spectrum, quantification, and calculation of film thickness.

  • スペクトル1.png
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  • Contract measurement

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It is possible to analyze the structure of complex organic compounds with overlapping peaks.

  • img_B0304_1.jpg
  • img_B0304_2.jpg
  • img_B0304_3.jpg
  • Contract Analysis
  • Contract measurement

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Evaluation of component and depth direction distribution is possible.

  • Contract measurement

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We evaluate the durability of electronic components and devices when repeatedly exposed to high and low temperatures.

  • Impact Test
  • Contract measurement

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We will evaluate the impact of thermal stress on electronic components in the implementation process.

  • Contract measurement

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