List of Other semiconductors products
- classification：Other semiconductors
241～255 item / All 2676 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Silicone-based materials are not used, and electronic components (sensors) and electronic substrates that are susceptible to outgassing are thoroughly protected under a chemical atmosphere.
- Other semiconductors
It has a slew rate of over 200 kV/μs and can also be used for insulation testing!
- switch
- Other semiconductors
It is the 'Smart LCDC', an easy-to-understand and easy-to-use LCD controller that allows LCD display via RS-232C.
- Other semiconductors
It is an easy-to-understand and easy-to-use LCD controller 'Smart LCDC' that allows LCD display via RS-232C.
- Other semiconductors
Sales of the new LCD controller IC for WQVGA LCD Smart LCDC have begun.
We have started selling the new LCD controller IC "KS-WQCT-I1" compatible with the "Smart LCDC" series WQVGA LCD. 【Features of KS-WQCT-I1】 〇 The command system is fundamentally the same as that of the WVGA LCD controller ICs "KS-WVCT-I1" and "KS-WVCT-I2," allowing for a smooth transition from existing systems. 〇 Compared to the conventional WQVGA LCD controller IC "KS-430CT-I2," the drawing speed has significantly increased. 【Compatible LCDs】 4.3-inch WQVGA LCD → "S043HWQ50EG-DR12" (manufactured by CDTech) 5-inch WQVGA LCD → "AWY-480272T50P05" (manufactured by Maihai)
It is a "development tool" that allows you to master the basics of LCD and drawing methods in a short time.
- Other semiconductors
We always have over 1,000 types of SOI wafers in stock! We accept orders for stock SOI wafers starting from one piece.
- Other semiconductors
Round pin fin heat sink with large size and high heat dissipation performance.
- Other semiconductors
Thin design high thermal conductivity round pin fin heat sink compatible with forced air cooling.
- Other semiconductors
Φ50 round pin fin heat sink that exhibits high heat dissipation through forced air cooling.
- Other semiconductors
High thermal dissipation round pin fin heat sink ideal for forced air cooling of small machinery.
- Other semiconductors
45mm diameter x 30mm height round pin fin heat sink (Al99.5)
- Other semiconductors
2035 Strategy Interpreted from Implementation, Regulation, and Economic Security!
- Technical and Reference Books
- Other semiconductors
10/2 Web Seminar "Fundamentals of Semiconductor Manufacturing Processes and Materials"
■Title: "Manufacturing Process of Semiconductors (ICs) and Basic Information on Semiconductor Components" ~ Introduction: Semiconductor Manufacturing and Components - From Pre-Process to Implementation ~ This seminar systematically explains the overall picture of semiconductor manufacturing, from the IC manufacturing process to the implementation on circuit boards. Participants will learn about the flow of pre-process, post-process, and implementation processes, as well as the roles and necessities of the components used in each stage. Attendees will acquire basic information on semiconductor manufacturing and gain knowledge useful for the development of semiconductor components and the expansion of their own technologies. 【Knowledge Gained from the Seminar】 - Basic information on semiconductor manufacturing - Technical information on Japanese technologies active in the semiconductor field - Potential for expanding one's own technologies into the semiconductor field 【Target Audience for the Seminar】 - Individuals interested in basic technical information about semiconductor (IC) manufacturing - Individuals interested in the components used in IC manufacturing - Individuals interested in Japanese technologies (equipment, components) active in IC manufacturing
By combining a hollow heat sink with dimensions of 92mm in width, 93mm in height, and 150mm in length with a DC 24V axial fan, efficient heat dissipation is achieved.
- Other semiconductors
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Overcoming thermal displacement has been a bottleneck for achieving high precision. This is an excellent casting material developed to eliminate those bottlenecks!
- Other optical parts
- Other machine tools
- Other semiconductors
A systematic explanation from the basics of semiconductor backend processes and packaging technology to 2.5D/3D packaging and chiplet technology.
- Other semiconductors
- Other semiconductor manufacturing equipment
- Technical Seminar