List of Other semiconductors products
- classification：Other semiconductors
451～465 item / All 2653 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Heat sink for surface mount devices measuring W8mm x H6mm x L8mm.
- Other semiconductors
Chemical reactions caused by dilute gases can also be considered!
- CVD Equipment
- Wafer
- Other semiconductors
Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!
- Technical and Reference Books
- Other semiconductors
7/3 Webinar on Backend Processes, Assembly, and Design in Semiconductor Manufacturing
■Title "Fundamentals of Backend Processes, Packaging, and Design in Semiconductor Manufacturing" This seminar offers a systematic learning experience about backend processes and packaging technologies that support the high performance and functionality of semiconductors, covering everything from the basics to the latest trends. Experienced instructors will clearly explain the history of semiconductor package evolution, various package types, packaging processes, encapsulation technologies, and evaluation and analysis techniques. Additionally, the latest trends in advanced packaging technologies such as 2.5D/3D packaging, CoWoS, chiplets, hybrid bonding, and optoelectronic integration technologies that support the AI era will also be introduced. This content is recommended for engineers and researchers in fields such as chemistry, electronic components, and the automotive industry who wish to learn semiconductor packaging technology from the ground up. ■Event Details Date and Time: July 3, 2026 (Friday) 13:30–16:30 Instructor: Yosuke Hirumuta (Hirumuta Engineering Office, Quality and Technology Consultant) Participation Fee: 44,000 yen (tax included) Newsletter Member Price: 39,600 yen (tax included) Delivery Format: Live streaming via Zoom
Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)
- Other semiconductors
1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.
- Other metal materials
- Other semiconductors
Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.
- Other semiconductors
- stainless
In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.
- Other semiconductors
- aluminum
Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.
- Other semiconductors
- Other metal materials
You can arrange and secure four transistors to the heat sink.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors