List of Other semiconductors products
- classification：Other semiconductors
496～540 item / All 2617 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Aluminum extruded heat sink with a width of 33 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
Covering the latest trends in the AI semiconductor and memory markets, you can also check advanced technology information and market forecasts! Sign up for free on the site to receive the latest infor...
- Other semiconductors
HI-6120/6121 is optimized for MIL-STD-1553 remote terminals.
- Other semiconductors
Aluminum extruded heat sink with a width of 33 mm and a height of 6 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 31 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
The HI-6110 is the world's smallest message processor with remarkably low power consumption.
- Other semiconductors
This is a device related to the treatment of CMP wastewater (including CMP slurry). If you are having trouble with wastewater treatment, please take a look.
- Other semiconductors
Considering optimal designs for filters to remove various chemical pollutants in the air, such as acidic, alkaline, and organic gases, tailored to the customer's environment.
- Other semiconductors
Did you know that CMP slurry can be regenerated as CMP slurry?
- Ceramics
- Other semiconductors
Aluminum extruded heat sink with a width of 31 mm and a height of 6 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 30 mm and a height of 17.5 mm - available in length variations.
- Other semiconductors
Materials used in automobiles, semiconductors, and solar panels, as well as packaging materials, also utilize Goyo Paper's laminated products.
- Other electronic parts
- Other semiconductors
- Paper and pulp products
Aluminum extruded heat sink with a width of 30 mm and a height of 7.5 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 25 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 29 mm and a height of 11.5 mm - available in various lengths.
- Other semiconductors
We will comprehensively respond to our customers' needs, from consulting on requirements specifications to chip replacement!
- Other semiconductors
FPGA capable of high-speed and real-time processing.
- Other semiconductors
A thorough explanation of semiconductor packaging from the basics to applications!
- Other semiconductors
- others
- Technical and Reference Books
5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"
■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)
Aluminum extruded heat sink with dimensions of 27.95 mm wide x 15.24 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 12.5 mm - available in length variations.
- Other semiconductors
Aluminum extruded heat sink with a width of 27.95 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!
- Other semiconductors
- Other semiconductor manufacturing equipment
- Semiconductor inspection/test equipment
Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17
■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――As chipletization and 3D packaging advance in semiconductors, more sophisticated material design for encapsulants is required than ever before. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulants. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: - Trends in semiconductor packaging - Knowledge about raw materials for semiconductor encapsulation materials - Design techniques for semiconductor encapsulation materials and evaluation techniques for semiconductor encapsulation materials
Aluminum extruded heat sink with dimensions 27 mm wide x 22 mm high - available in various lengths.
- Other semiconductors
Clip-type rail mount that allows for quick attachment of heat sinks, cases, etc. to DIN rails compliant with TS35 standards.
- Other semiconductors
Aluminum clip for fixing heat sink and aluminum case to DIN rail.
- Other semiconductors
We offer silicon wafers such as particle management wafers and dummy mirror wafers!
- Wafer
- Other semiconductors
We continue to supply many electronic materials, starting with semiconductors.
- Other semiconductors
Our company, which has a product range of surfactants, glycol ethers, and amines, proposes original industrial cleaning agents tailored to meet our customers' needs!
- Cleaning agents
- Other semiconductors
- Other Auto Parts
Notice of Participation in the 17th Kawasaki International Environmental Technology Exhibition
We will be exhibiting the following items at the "17th Kawasaki International Environmental Technology Exhibition." When you visit, please stop by our booth. 【Exhibition Name】 17th Kawasaki International Environmental Technology Exhibition Official Website URL: https://www.kawasaki-eco-tech.jp/ 【Venue】 Kaltz Kawasaki, SDGs Contribution Zone D-8 【Dates】 November 13 (Wednesday) - November 14 (Thursday), 2024 【Visitor Registration】 Free visitor registration is required. For more details, please check the information on the official website above. 【Exhibited Items】 <Panel Display> ◆ Customized Industrial Cleaning Agents - Minemal Series ◆ Introduction of Environmentally Friendly Products ◆ Ionic Liquids for Cellulose Dissolution <Presentation Lecture> November 13 (Wednesday) at 11:30 AM "Introduction to Japanese Emulsifiers - Environmentally Friendly Products that Solve Social Issues" We look forward to your visit.
In the manufacturing processes of electronic materials such as semiconductors and liquid crystals, they are widely used as solvents such as photoresists, stripping agents, cleaning agents, and etchant...
- Other semiconductors
- Chemicals
- Cleaning agents
Our company's initiatives were featured in the "Amines Special" on page 6 of the Chemical Industry Daily on October 8, 2024.
Japanese emulsifiers are used by customers in many industries and fields. Depending on your application, we can also introduce grades that are not listed in the catalog. Please feel free to contact us. The materials can be downloaded from Ipros, and they are also introduced on our official website. - Amino alcohol-based, morpholine-based, piperazine-based - Electronic materials glycol ether and amine "Metarify series" - Industrial cleaning agents "Minemal series" - Gas absorbents and neutralizers "Amino alcohol"
Easy-to-understand explanation with manga! Company overview and workplace introduction.
- Chemicals
- Cleaning agents
- Other semiconductors
![[Exhibition Information] Nepcon Jap...](https://image.mono.ipros.com/public/product/image/a7d/2001509224/IPROS11198764246538117902.png?w=280&h=280){kind=small}
We exhibited the following items at the 39th NePCON Japan. Thank you for visiting.
- Other semiconductors
High Purity Solvent Metlify Series
- Other semiconductors
- Chemicals
- Cleaning agents
Our company's efforts were featured on page 6 of the Chemical Industry Daily on October 8, 2025, in the "Amines Special Feature."
Japanese emulsifiers are used by customers in many industries and fields. Depending on your application, we can also introduce grades that are not listed in the catalog. Please feel free to contact us. Materials can be downloaded from Ipros, and they are also featured on our official website. - Amino alcohol-based, morpholine-based, piperazine-based - Gas absorbents and neutralizers "Amino Alcohol" - Glycol ethers and amines for electronic materials "Metallify Series" - Industrial cleaning agents "Minemal Series"
Compatible with sensors and medical devices. It has built-in amplification and temperature compensation circuits, eliminating the need for circuit design and characteristic adjustment.
- Sensors
- Sensors
- Other semiconductors
Aluminum extruded heat sink with a width of 27 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with dimensions of 27 mm width x 14 mm height - available in length variations.
- Other semiconductors
Aluminum extruded heat sink measuring 27 mm wide x 10 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 27 mm and a height of 6 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 25.8 mm and a height of 8 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with dimensions 24.2 mm wide x 12.3 mm high - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 23 mm and a height of 12.3 mm - available in various lengths.
- Other semiconductors
LED string voltage 4-40V! PWM dimming can also be performed via the I2C interface.
- Other electronic parts
- Other semiconductors
Aluminum extruded heat sink with a width of 23 mm and a height of 10 mm - available in various lengths.
- Other semiconductors
Aluminum extruded heat sink with a width of 23 mm and a height of 6 mm - available in various lengths.
- Other semiconductors