List of Other semiconductors products
- classification：Other semiconductors
496～540 item / All 2346 items
One-stop solution from design to manufacturing of power semiconductors!
- Other semiconductors
Nikkankogyo Shimbun - Award-winning products of the Excellent New Technology and New Products Award! Eliminated the need for external shielding.
- Other semiconductors
We offer semiconductor products primarily featuring Toshiba semiconductors, as well as LCDs and electronic components!
- Other semiconductors
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
We will comprehensively respond to our customers' needs, from consulting on requirements specifications to chip replacement!
- Other semiconductors
FPGA capable of high-speed and real-time processing.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
![[Problem Solving Case] Stacking Pin...](https://image.mono.ipros.com/public/product/image/532/2001503934/IPROS57835443135270624340.png?w=280&h=280){kind=small}
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
![[Problem Solving Case] Metal Substr...](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280){kind=small}
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
![[Problem Solving Example] Connectio...](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280){kind=small}
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d94/2001503941/IPROS18645158648223924469.png?w=280&h=280){kind=small}
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
![[Problem Solving Case] Terminals fo...](https://image.mono.ipros.com/public/product/image/3fb/2001503943/IPROS40703930758582890534.png?w=280&h=280){kind=small}
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d65/2001503949/IPROS52565932286896864440.png?w=280&h=280){kind=small}
A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!
- Other semiconductors
![[Problem Solving Case] Conversion A...](https://image.mono.ipros.com/public/product/image/918/2001503950/IPROS92696088421676517031.png?w=280&h=280){kind=small}
Solved with a conversion adapter! Here are some products that contributed to solving customer problems.
- Other semiconductors
![[Problem Solving Example] Only the ...](https://image.mono.ipros.com/public/product/image/ab2/2001503955/IPROS88625087893079940690.png?w=280&h=280){kind=small}
By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!
- Other semiconductors