List of Other semiconductors products
- classification：Other semiconductors
991～1035 item / All 2653 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.
- Other semiconductors
- Database
- EAI/ETL/WEB application server
6/2 Webinar "AI Data Center Heat Dissipation/Cooling Technology"
■ Title: "Heat Dissipation/Cooling Technologies for AI Data Centers" ―― The rapid increase in data center power due to the expansion of generative AI. How to address PUE targets and high-heat GPUs. A practical overview from air cooling to liquid cooling, cold aisle, water cooling in-row, and immersion cooling. A strategic course to master thermal issues. ■ Date and Time: June 2, 2026 (Tuesday) 10:30 AM - 4:30 PM ■ Zoom Streaming (Archive available for missed sessions with materials) 【Knowledge Gained from the Seminar】 - Basic knowledge of heat transfer - Heat dissipation knowledge in component and circuit board design - Common thermal design methods for forced air cooling and natural air cooling equipment - Thermal design methods for heat sinks, etc. 【Target Audience for the Seminar】 Electronic device designers (assembly design, mechanical design, circuit design, circuit board design), heat dissipation device/material developers, quality assurance, and quality control departments.
A new style heat sink with lower thermal resistance than the popular FK244 series.
- Other semiconductors
By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.
- Other semiconductors
Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!
- Composite Materials
- Other semiconductors
- Generators and transmission motors
We will exhibit at the 2nd Power Device & Module EXPO!
We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!
Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.
- Other semiconductors
Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.
- Other semiconductors
- Wafer processing/polishing equipment
![[Problem Solving Case] Pitch Conver...](https://image.mono.ipros.com/public/product/image/4cc/2001503929/IPROS78349843531622306344.png?w=280&h=280){kind=small}
An example of connecting different pitches through a pitch conversion adapter linked by a pattern!
- Other semiconductors
![[Problem Solving Case] SMT Conversi...](https://image.mono.ipros.com/public/product/image/413/2001503932/IPROS39276812336088411411.png?w=280&h=280){kind=small}
An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!
- Other semiconductors
![[Problem Solving Case] Stacking Pin...](https://image.mono.ipros.com/public/product/image/532/2001503934/IPROS57835443135270624340.png?w=280&h=280){kind=small}
A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.
- Other semiconductors
![[Problem Solving Case] Metal Substr...](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280){kind=small}
A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!
- Other semiconductors
![[Problem Solving Example] Connectio...](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280){kind=small}
Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d94/2001503941/IPROS18645158648223924469.png?w=280&h=280){kind=small}
A case where installation man-hours were reduced with a pin header consolidated into a single base!
- Other semiconductors
![[Problem Solving Case] Terminals fo...](https://image.mono.ipros.com/public/product/image/3fb/2001503943/IPROS40703930758582890534.png?w=280&h=280){kind=small}
An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
- Other semiconductors
![[Problem Solving Case] Reduction of...](https://image.mono.ipros.com/public/product/image/d65/2001503949/IPROS52565932286896864440.png?w=280&h=280){kind=small}
A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!
- Other semiconductors
![[Problem Solving Case] Conversion A...](https://image.mono.ipros.com/public/product/image/918/2001503950/IPROS92696088421676517031.png?w=280&h=280){kind=small}
Solved with a conversion adapter! Here are some products that contributed to solving customer problems.
- Other semiconductors
![[Problem Solving Example] Only the ...](https://image.mono.ipros.com/public/product/image/ab2/2001503955/IPROS88625087893079940690.png?w=280&h=280){kind=small}
By implementing plate terminals on pads that require gold plating, we can reduce extra costs during circuit board manufacturing!
- Other semiconductors
![[Problem Solving Case] PCB Level Co...](https://image.mono.ipros.com/public/product/image/823/2001503957/IPROS93003875297794627196.png?w=280&h=280){kind=small}
Connect the circuit boards using a pin header with spring characteristics designed for card edge with pin terminals!
- Other semiconductors
![[Problem-Solving Case] Reflow Heat ...](https://image.mono.ipros.com/public/product/image/6d7/2001503927/IPROS29173269770606501274.png?w=280&h=280){kind=small}
A case where a custom socket was mounted on the circuit board, and after reflow, components were attached to the socket!
- Other semiconductors
![[Problem Solving Case] Board-to-Boa...](https://image.mono.ipros.com/public/product/image/8c4/2001503938/IPROS40604732200448737640.png?w=280&h=280){kind=small}
A relay board with terminals that eliminates the wire soldering process by connecting the terminals to the module board and the relay board to the connector.
- Other semiconductors
![[Case Study] Heat Dissipation of Me...](https://image.mono.ipros.com/public/product/image/b52/2001503946/IPROS00694419965055911874.png?w=280&h=280){kind=small}
Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.
- Other semiconductors
![[Problem Solving Case] Daughterboar...](https://image.mono.ipros.com/public/product/image/27e/2001503953/IPROS95910517399822186989.png?w=280&h=280){kind=small}
A pin header with a spring action on one side to hold the daughterboard!
- Other semiconductors
![[Problem Solving Case] Base Shape N...](https://image.mono.ipros.com/public/product/image/de9/2001503931/IPROS28320549847222015401.png?w=280&h=280){kind=small}
A pin header with a circular arc-shaped base that ensures an effective area and reduces the size of the substrate!
- Other semiconductors
![[Problem Solving Case] Breakaway Pi...](https://image.mono.ipros.com/public/product/image/05d/2001503959/IPROS87733959945932962429.png?w=280&h=280){kind=small}
An example where a pin header with a break-off section was soldered to a circuit board, leaving only the break-off terminals after removing the base.
- Other semiconductors
![[Problem Solving Case] Stress Reduc...](https://image.mono.ipros.com/public/product/image/36a/2001503961/IPROS10309697965413181013.png?w=280&h=280){kind=small}
A case where stress was reduced and challenges were solved with a wave pin header!
- Other semiconductors
W389mm x H121mm Hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
W259mm x H121mm hollow-type heat sink with axial fan enables efficient heat dissipation.
- Other semiconductors
W129mm x H121mm hollow type heat sink + axial fan enables efficient heat dissipation.
- Other semiconductors
Transistors in TO-218, TO-220, TO-247, TO-248, and SIP-Multiwatt packages can be clipped.
- Other semiconductors
Extruded heat sink with solder pins that can secure the transistor with clips.
- Other semiconductors
Solder pin attached extrusion heat sink (transistor screw mounting)
- Other semiconductors
Extruded heat sink with M3 screw hole for transistor fixation and solder pin (for TO-220, SOT32 package)
- Other semiconductors
Extruded heat sink with M3 screw holes for fixing TO220 package transistors and M3 screw holes for mounting on the board.
- Other semiconductors
Supports high precision and high-frequency signals! It has received high trust from users.
- Other electronic parts
- Other semiconductors
Controls conductivity in the range of 10E4 to 11Ω. A tray that excels in low dust generation and static prevention. Material suggestions suitable for the usage environment are also possible.
- Other semiconductors
Introducing the exhibition content for the event held from September 25 (Wednesday) to September 26 (Thursday), 2024!
- Other semiconductors
Heat sink with axial fan for AC230V axial fan
- Other semiconductors
Small aluminum heat sink measuring W15.3 x H8 x L15.3mm.
- Other semiconductors
Small aluminum heat sink measuring W19 x H4.8 x L5mm.
- Other semiconductors
Pursuing safety and reliability, we provide high-quality electronic components that meet our customers' needs!
- Other semiconductors
- Other electronic parts
![[2024 SEMICON JAPAN] Information ab...](https://image.mono.ipros.com/public/product/image/989/2001489307/IPROS16122157514222388212.jpg?w=280&h=280){kind=small}
Nine South Korean semiconductor-related companies are exhibiting!
- Other semiconductors
Pin heat sink, black anodized treatment, thermal resistance value 9.3 - 2 K/W
- Other semiconductors
Extruded heat sink that can be screw-mounted to a horizontally mounted TO218 package transistor.
- Other semiconductors
Small heat sink for TO-5 package, 12.7 x 6mm.
- Other semiconductors
Standard type aluminum extruded heat sink with a width of 300mm and a height of 40mm.
- Other semiconductors
Standard type aluminum extruded heat sink with a width of 200mm and a height of 25mm.
- Other semiconductors