List of Manufacturing and processing machinery products
- classification：Manufacturing and processing machinery
1～45 item / All 101505 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Ideal for micro-machining! Achieves deburring of holes and double-sided machining in one pass, which was difficult with conventional tools!
- Other machine tools
We will be exhibiting at Mecatronics Tech Japan 2021 from October 20 (Wednesday) to October 23 (Saturday)!
Our company will exhibit at "Mechatrotech Japan 2021," which will be held at Portmesse Nagoya from Wednesday, October 20 to Saturday, October 23, 2021. We will introduce our tools, including the 'Bar Off Tool' capable of chamfering and deburring from a diameter of 0.8 mm, and the 'FEM' tool breakage detection device that reliably detects breakage. We look forward to your visit. (Booth number: 2B12)
Compact and space-saving! Ideal for organic thin film development, all processes such as deposition, sputtering, and annealing can be seamlessly performed within the glove box.
- Evaporation Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
Flexible configuration available upon request for processes such as evaporation, sputtering, and EB. Adopts a tall chamber with a height of 570mm, contributing to improved uniformity during evaporatio...
- Evaporation Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
Plasma CVD equipment compatible with wafer sizes of Φ3 inch and Φ4 inch. Rapid synthesis of clean, high-quality graphene while suppressing impurities.
- CVD Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
Two thin-film experimental devices are connected with a load-lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load-lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as sputtering, EB (electron beam), and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Annealing furnace
Sputtering/Dual Chamber System【MiniLab-E080A/S060A】
Two thin-film experimental devices are connected via a load lock mechanism. Different film deposition devices (sputtering - evaporation, etc.) are seamlessly connected through the load lock. With Moorfield's unique load lock system, connections to the left, right, and rear process chambers are also possible (see photo below). 1. MiniLab-E080A (Evaporation Device) - EB Evaporation: 7cc crucible x 6 - Resistance Heating Evaporation x 2 - Organic Evaporation Limit x 2 2. MiniLab-S060A (Sputtering Device) - Φ2" Magnetron Cathode x 4 sources for simultaneous sputtering - Compatible with both DC and RF power supplies 3. Load Lock Chamber - Plasma Etching Stage In the load lock chamber, plasma cleaning of the substrate surface is performed using the "RF/DC substrate bias stage," and the company's unique 'soft etching' technology allows for a <30W low-power, damage-free plasma etching stage. This enables delicate etching processes that are prone to damage, such as 2D (removal of resists like PMMA), graphene delamination, and etching of Teflon substrates. (*This can also be installed in the main chamber stage.)
Two thin film experimental devices are connected with a load lock mechanism. Different film deposition devices (sputtering, evaporation, etc.) are seamlessly connected with the load lock.
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
High-performance multi-sputtering device 6-element multi-sputter (for Φ4 inch) 4-element multi-sputter (for Φ6, 8 inch)
- Sputtering Equipment
- Evaporation Equipment
- Etching Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
A semi-custom-made thin film experimental device that can be assembled with the desired configuration for processes such as evaporation, sputtering, electron beam (EB) deposition, and annealing.
- Evaporation Equipment
- Sputtering Equipment
- Etching Equipment
□■□■【Mini-BENCH】Ultra High Temperature Tabletop Experimental Furnace Max 2000℃ □■□■
Tabletop Small-Size Experimental Furnace - Space-Saving, Maximum Operating Temperature 2000℃ ◆ Equipment Configuration ◆ We will propose the desired configuration according to your budget and purpose. (A) Minimum Configuration: Chamber + Temperature Control Unit (B) Above Minimum Configuration (A) + Vacuum Exhaust System (Pump, Gauge, Valve, Vacuum Piping) ◉ Cylindrical Heater: For sintering samples in crucibles (for solid, powder, granule, and pellet-shaped samples) ◉ Flat Heater: For sintering Φ1" to Φ6" wafers and small chip samples ◆ Basic Specifications ◆ - Heater: C/C Composite (Carbon Furnace), Tungsten (Metal Furnace) - Insulation Material: Graphite Felt, Tungsten/Molybdenum - Temperature Control: Programmable Temperature Controller, C Thermocouple - Achievable Vacuum Level: 1x10-2 Pascal (*for an empty furnace) - Power Supply Specifications: AC200V 50/60HZ Three-Phase 6KVA - Cooling Water: 3L/min, 0.4Mpa 25-30℃ ◆ Control Box Specifications ◆ - Programmable Temperature Controller - DC Power Supply Unit or External Transformer Box - Current and Voltage Meters - Heater Circuit Trip Switch - Main Power Switch ◆ Options ◆ - Vacuum Exhaust System - Custom Crucibles and Others
Microfabrication and diffusion bonding
- Special Processing Machinery
- Other machine elements
- Other purification and extraction
We meet the high precision needs of semiconductor manufacturing with microfabrication and diffusion bonding.
- Special Processing Machinery
- Other machine elements
- Other purification and extraction
Lightweighting of metal products using diffusion bonding.
- Other conveying machines
- Press Dies
- Auto Parts
High-precision positioning machining achieving μm accuracy.
- Processing Contract
- Plastic Mould
- Mold
Achieving a maximum cooling time reduction of 50%: Introducing examples of mold performance improvement through diffusion bonding.
- Plastic Mould
- Injection Molding Machine
- Mold
From small precision items to large 2-meter pieces, we guarantee the final finishing accuracy.
- Grinding Machine
- Contract manufacturing
- Processing Contract
Are you having trouble with deep hole machining and your suppliers?
- Contract manufacturing
- Processing Contract
- Plastic Mould
Genuinely facing technology and delivering that technical expertise to our customers.
- Plastic Mould
- Mold
- Food Packaging Machinery
Processing accuracy in the 1000 range.
- Processing Contract
- Contract manufacturing
- Special Processing Machinery
We offer a wide range of services from mold making to parts manufacturing with a mirror finish.
- Plastic Mould
- Processing Contract
We expand possibilities with microfabrication and diffusion bonding.
- Special Processing Machinery
- Other machine elements
- Other purification and extraction
Contributing to weight reduction in the aerospace field through microfabrication and diffusion bonding.
- Special Processing Machinery
- Other machine elements
- Other purification and extraction
Achieving miniaturization of medical devices through microfabrication and diffusion bonding.
- Special Processing Machinery
- Other machine elements
- Other purification and extraction
Achieving perfect integration without melting.
- Contract manufacturing
- Welding Machine
- Cooling system
Achieving both high surface quality and fine shapes with ultra-precision machining at a μm accuracy. It also contributes to the reduction of polishing processes.
- Contract manufacturing
- Milling machine
- Mold
Significantly reduce the craftsman's "hand polishing process." Achieve a mirror finish at the nano level while still in the rough state.
- Machining Center
- Processing Contract
- Contract manufacturing
Ultra-precision machining technology that supports μm accuracy
- Plastic Mould
- Processing Contract
- Mold
Joining different materials without melting: A joining technology that balances precision and strength.
- Welding Machine
- Oxidation/Diffusion Device
- Processing Contract
Custom-made transformers ideal for imported equipment from overseas: Food processing machinery edition
- Transformers
- Food Processing Equipment
- Other food machinery
We will be exhibiting at the 'Oosaki Industrial Fair 2025 (October 17th (Friday) and 18th (Saturday) at Takakatsu Arena Oosaki)' at the Nikkou Electric Sendai Sales Office booth!
The "Osaki Industrial Fair 2025" will be held on October 17 (Friday) and 18 (Saturday), 2025, at Takakatsu Arena Osaki in Osaki City, Miyagi Prefecture, where the Nikkou Electric Sendai Sales Office will exhibit. Nikkou Electric Sendai Sales Office operates as a "specialist group in snow melting," proposing and installing snow melting equipment throughout the Tohoku region. We also handle repairs and maintenance of electric motors, as well as electrical materials (such as crimp terminals and circuit breakers). Our company is strongly associated with "Transformers Nikkou Electric," so please take this opportunity to visit our booth at the "Osaki Industrial Fair 2025." ◎ Osaki Industrial Fair 2025 https://osaki-industries.com/ Date: October 17 (Friday) and 18 (Saturday), 2025, from 10:00 to 16:00 Venue: Takakatsu Arena Osaki (Osaki City Furukawa General Gymnasium) 4-5-2 Asahi, Furukawa, Osaki City, Miyagi Prefecture Admission: Free Organizer: General Incorporated Association Osaki Industrial Promotion Organization, Osaki City
![[Announcement] Max Company Tube Mar...](https://image.mono.ipros.com/public/product/image/769/2001531437/IPROS11640289163947851070.jpg?w=280&h=280){kind=small}
[Sunshine Electric Sendai Sales Office] Orders from 8/1 to 8/31! Max (MAX) Company Tube Marker Letter Twin Special Price Campaign
- tube
- Commercial printers
- Printer/marker
We will be exhibiting at the 'Oosaki Industrial Fair 2025 (October 17th (Friday) and 18th (Saturday) at Takakatsu Arena Oosaki)' at the Nikkou Electric Sendai Sales Office booth!
The "Osaki Industrial Fair 2025" will be held on October 17 (Friday) and 18 (Saturday), 2025, at Takakatsu Arena Osaki in Osaki City, Miyagi Prefecture, where the Nikkou Electric Sendai Sales Office will exhibit. Nikkou Electric Sendai Sales Office operates as a "specialist group in snow melting," proposing and installing snow melting equipment throughout the Tohoku region. We also handle repairs and maintenance of electric motors, as well as electrical materials (such as crimp terminals and circuit breakers). Our company is strongly associated with "Transformers Nikkou Electric," so please take this opportunity to visit our booth at the "Osaki Industrial Fair 2025." ◎ Osaki Industrial Fair 2025 https://osaki-industries.com/ Date: October 17 (Friday) and 18 (Saturday), 2025, from 10:00 to 16:00 Venue: Takakatsu Arena Osaki (Osaki City Furukawa General Gymnasium) 4-5-2 Asahi, Furukawa, Osaki City, Miyagi Prefecture Admission: Free Organizer: General Incorporated Association Osaki Industrial Promotion Organization, Osaki City
A pen that blurs the boundary between "drawing" and "creating"! Nichiko Electric's 3D Pen Set (LP063S) 3D Printer Pen.
- Processing Jig
- Other markings
- Resin mold
![[Data] List of Nichiko Electric Equ...](https://image.mono.ipros.com/public/product/image/98a/2000777095/IPROS64295555017191683378.png?w=280&h=280){kind=small}
We have a large number of winding machines and dryers! Our quality assurance and inspection equipment is also well-equipped!
- Winding Machine
TECHNO-FRONTIER 2023, the 38th Power System Exhibition (July 26-28, 2023, at Tokyo Big Sight), will be held. We will be exhibiting at booth number 3C-04, custom transformer manufacturer Nikko Electric Co., Ltd.!
We are pleased to announce that our company will be exhibiting at "TECHNO-FRONTIER 2023, the 38th Power System Exhibition," which will be held at Tokyo Big Sight, East Exhibition Hall, from July 26 (Wednesday) to July 28 (Friday). We kindly invite you to visit our booth during this event, and we look forward to seeing you there despite your busy schedule. Exhibition: "TECHNO-FRONTIER 2023, the 38th Power System Exhibition" (https://www.jma.or.jp/tf/) Date: July 26 (Wednesday) to July 28 (Friday), 2023 Time: 10:00 AM to 5:00 PM Location: Tokyo Big Sight, East Exhibition Hall, 3-11-1 Ariake, Koto-ku, Tokyo Booth No.: 3C-04 Nikkodenki Co., Ltd. http://www.nikkodenki.com
Instant 100% complete water removal with air blow! The drying process becomes unnecessary, significantly shortening internal setup time.
- Food Cleaning Equipment
- Other cleaning equipment
- Drying Equipment and Devices
Are you making this mistake with the work's drainage?
- Other semiconductor manufacturing equipment
Are you making this mistake while draining water from the work?
[To those in charge who are struggling with workpiece water drainage] Are you making these mistakes with workpiece water drainage? ✓ Do you know the real reason why, even if you increase the air blow pressure, not all water droplets are blown away? ✓ Do you know the real reason why, even if you increase the number of air nozzles, water is not sufficiently drained? ✓ Do you know the real reason why, even if you change the shape of the air nozzle, it still does not drain water effectively? These mistakes are typical errors made by companies that use air blow for workpiece water drainage and droplet removal. However, these mistakes are not significant compared to a certain "fatal mistake." What is that "fatal mistake"? It is… We provide this information in a PDF file. Download it now to find out.
No more revolution! No need for washing; particles are removed with just air blowing.
- Other semiconductor manufacturing equipment
Just by looking at this, you'll understand everything! We created a PR flyer (dust removal version).
Thoroughly remove dust from workpieces with air blow! We have summarized everything about the patented complete dust removal air nozzle, "Air Screw Nozzle," on a single A4 flyer. "What kind of nozzle is it?" "Why can it remove dust so effectively?" "How can it remove dust even from complex-shaped workpieces?" Just by looking at this, you can quickly understand everything about the Air Screw Nozzle. Please download and take a look.
[Patent Obtained] Complete water removal in an instant with air blow = complete drying!
- Other semiconductor manufacturing equipment
If you see this, you'll understand everything! I created a PR flyer.
100% water removal with air blow! No water droplets left on the workpiece! We have summarized everything about the patented complete drying air nozzle, "Air Screw Nozzle," on a single A4 flyer. "What kind of nozzle is it?" "Can it really remove 100% of the water?" "Why is it so effective at removing water?" Just by looking at this, you can quickly understand everything about the Air Screw Nozzle. Please download it and take a look!
[Patent Obtained] Instant complete water removal of workpieces with air blow = complete drying!
- Other semiconductor manufacturing equipment
Revolutionary! No need for water washing! Particles are removed with just air blow.
- Other semiconductor manufacturing equipment
Are you making this mistake when draining water from your work?
- Other semiconductor manufacturing equipment
Instant 100% complete water removal with air blow! The drying process becomes unnecessary, significantly shortening the interval.
- Food Cleaning Equipment
- Other cleaning equipment
- Drying Equipment and Devices