List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
91～135 item / All 5250 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
- Bonding Equipment
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
- Bonding Equipment
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
- Bonding Equipment
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
- Bonding Equipment
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
- Bonding Equipment
One unit supports 4 channels! Cost reduction and space-saving possible!
- Other semiconductor manufacturing equipment
HJS K-Series Bellows Pump for Semiconductor Manufacturing Equipment | High Quality, Low Pulsation, High Durability
- Other semiconductor manufacturing equipment
From RF solutions to repair and refurbishment. FNS supports semiconductor manufacturing as a whole.
- Other semiconductor manufacturing equipment
![[Hot Stage] Ultra High Temperature ...](https://image.mono.ipros.com/public/product/image/671/2000002653/IPROS21404174246949592221.png?w=280&h=280){kind=small}
An ultra-high temperature substrate heating stage that allows for substrate elevation, rotation, and RF/DC substrate bias all in one device! 'All-In-One' component.
- Sputtering Equipment
◉Mini-BENCH-prism Semi-Automatic Ultra-High Temperature Experimental Furnace Max 2000℃
◉ Maximum operating temperature Max 2000℃ ◉ PLC semi-automatic control A higher model of the tabletop Mini-BENCH with semi-automatic control Automatically controls each process of "vacuum/purge cycle," "gas replacement," and "venting" Maximum operating temperature 2000℃ Semi-automatic control ultra-high temperature experimental furnace (carbon furnace, tungsten metal furnace) Compact and space-saving experimental furnace ◉ Effective heating range (crucible dimensions) - Planar heater heating range: Φ2 inch to Φ6 inch - Cylindrical heater heating range: Φ30 to Φ80 x Depth Max 100(H) mm ◉ Up to 3 MFC systems for automatic flow control (or manual adjustment) ◉ APC automatic pressure control ◉ Ensures safety during operation Monitors abnormal cooling water, chamber temperature, and overpressure. Made of SUS, the robust water-cooled chamber can be safely used even during continuous operation at maximum temperature. ◉ Compact and space-saving Width 603 x Depth 603 x Height 1,160 mm (*Installed inside rotary pump housing) Various sample heating experiments, such as ultra-high temperature heating of small samples and new material research and development, can be easily performed with simple operations. The main unit is compact yet can be used for research and development in various fields.
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
- Bonding Equipment
It is a high-precision top-hat beam shaper that is not limited to specific wavelengths, thanks to a smooth aspheric lens.
- Electron beam lithography equipment