Semiconductor Manufacturing Equipmentの製品一覧

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

1. Inkjet printing and coating device for experimental DPN specifications. 2. Usable with KM256LNB-DPN.

• Other semiconductor manufacturing equipment

This is a pattern drawing device essential for inkjet printing in printed electronics applications, featuring hydrophilic and hydrophobic areas. Wavelength 285 nm.

• Other semiconductor manufacturing equipment

Ultraviolet curing unit

• Other cleaning machines
• Other semiconductor manufacturing equipment

It is an inline heater (chemical heater) unit with a quartz glass jacket and a halogen lamp heat source.

• Other semiconductor manufacturing equipment

Simultaneous exposure of both sides of the wafer! Supports medium lot production with semi-automatic operation.

• Other semiconductor manufacturing equipment

Liftoff, thick film, low-temperature film deposition compatible - the top model that combines Showa Vacuum's technology.

• Evaporation Equipment

It is a large-size coating machine designed to apply a specific film thickness.

• Secondary Cells/Batteries
• Coater

It is a small-sized coating machine.

• Secondary Cells/Batteries
• Coater

This is a coating machine with a heat cover that can dry thin films at a maximum temperature of 100°C after coating.

• Secondary Cells/Batteries
• Coater

Achieved 1% precision head control through inkjet DPN discharge control.

• Other semiconductor manufacturing equipment
• Other process controls
• Other semiconductors

Ensure a flow rate of up to 1,000 lpm.

• CVD Equipment
• Etching Equipment
• Evaporation Equipment

A high-thrust air cylinder that integrates a hydraulic cylinder and an air-hydraulic conversion booster device in a compact form.

• Hydraulic Equipment
• Molding Equipment
• Other machine elements

Featuring ceramic rolls made from ultra-high-performance ceramics with excellent wear resistance.

• Ceramics
• Wafer processing/polishing equipment

Accurately responding to needs and taking on new challenges! We will create a production foundation and be of service to our customers.

• Other semiconductor manufacturing equipment

The specification is a scribing accuracy of 30 microns (30μm).

• Other physicochemical equipment
• Other semiconductor manufacturing equipment
• Other inspection equipment and devices

Achieving high quality and high productivity! Further evolved high-precision SiP bonders compatible with 300mm wafers.

• Bonding Equipment

High output type

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

High output type

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

High-frequency type

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

High-frequency type

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Equipped with "constant power mode" and "constant voltage mode."

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

We undertake the development and production of ultrasonic transducers and ultrasonic oscillators tailored to our customers' needs.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

We accept the development and production of ultrasonic transducers and ultrasonic oscillators tailored to your needs.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Thorough pursuit of compactness and lightweight design.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Thorough pursuit of compactness and lightweight design.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

Over the past 30 years, there has been a proven track record of being installed in numerous semiconductor wire bonders.

• Ultrasonic Oscillator
• Other semiconductor manufacturing equipment

High-speed thermal processing equipment (RTP/RTA equipment) AccuThermo series

• Other semiconductor manufacturing equipment

The high-performance, low-cost manual prober was uniquely developed and designed by Highsol based on experience and achievements.

• Other semiconductor manufacturing equipment

We pursue the latest laser technology and its application possibilities as the core of the photonics business within the HOYA Group, focusing on industry and healthcare.

• Other semiconductor manufacturing equipment

Ultra-high precision alignment within ±1um. Ideal for prototype development.

• Other semiconductor manufacturing equipment

Heating multiple wafers in a clean environment of Class 1 at a maximum temperature of 450°C with high temperature stability.

• Heating device
• Annealing furnace

Dust prevention and reliable protection of wafers! Bulk transfer is also possible!

• Other semiconductor manufacturing equipment

Featuring the latest products from Tokyo Electron Kyushu, a leading company in semiconductor manufacturing equipment!

• Other semiconductor manufacturing equipment

Film formation completed without exposure to the atmosphere in full auto! ~Sample measurement in progress!~

• Sputtering Equipment

SiC semiconductor evaluation device using photoluminescence (PL) imaging method

• Semiconductor inspection/test equipment

It is a high-efficiency ozone removal device that can be used under vacuum conditions.

• Other semiconductor manufacturing equipment
• Other filters

PSPC standard compliant product. It uses a three-blade cutter, which ensures long-lasting blades and low running costs!

• Wafer processing/polishing equipment

A semi-automatic grinding machine for chamfering the outer peripheral edge of a wafer in a simple manner.

• Wafer processing/polishing equipment

This device measures the thickness of wafers fixed to ceramic plates without contact, using optical probes/sensors.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device for measuring the thickness of φ8” silicon wafers.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

This machine is a device that performs macro and micro inspections of φ8-inch wafers in the semiconductor manufacturing process.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a diamond-like carbon that is resistant to wear.

• Coater

This machine is a device for spin-drying workpieces.

• Other semiconductor manufacturing equipment
• Other industrial robots

It is a device for drying wafers that have been stripped and cleaned.

• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

It is a device for cleaning wafers that are epoxy bonded to a glass plate.

• Other semiconductor manufacturing equipment
• Wafer processing/polishing equipment
• Other industrial robots