List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

3466~3510 item / All 4536 items

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Very useful for CMP research and development applications! Patterns with high step heights are also available.

  • Other semiconductors
  • Wafer

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Very useful for CMP research and development! 【Pattern Wafer】 3D ILD Pattern

At Advanced Materials Technology, we supply wafers that incorporate cutting-edge technologies necessary for research and development in film formation, CMP, cleaning, etching, and TSV, particularly among test wafers. The image shows examples of HDP and SiN on Si. We can accommodate 200mm and 300mm sizes. Please consult us regarding the types of films you require. We also offer patterns with high step heights, which are very useful for CMP research and development purposes. *For more details, please download the catalog or contact us. Basic Information [About Our Services] Our company aims for rapid supply, stable supply, and more cost-effective supply of products, providing and selling wafers tailored to various customer requests. - Sales of various evaluation pattern wafers and film formation wafers - Collection and recycling of used silicon wafers - Contract analysis and evaluation services We have excellent procurement sources in the United States, Europe, South Korea, and Taiwan, and we are prepared to provide our customers with wafers of better quality in a stable manner.

Available in 200mm and 300mm! Please consult us regarding the types of films available according to your preferences.

  • Other semiconductors
  • Wafer

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Available in 200mm and 300mm! 【Test wafer for CMP】 MIT STI CMP wafer

At Advanced Materials Technology, we supply wafers that incorporate cutting-edge technologies necessary for research and development in film formation, CMP, cleaning, etching, and TSV, particularly for test wafers. The image shows an example of HDP and SiN on Si. We can accommodate 200mm and 300mm sizes. *MIT mask used Please consult us regarding the types of films according to your preferences.

A pattern wafer manufactured in domestic mass production, close to device grade.

  • Other semiconductors
  • Wafer

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The image is an example of a Cu blanket wafer!

  • Other semiconductors
  • Wafer

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Available in 200mm and 300mm! Please consult us regarding the types of films available as per your request.

  • Other semiconductors
  • Wafer

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Semiconductor device panel

  • Other semiconductors

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Liquid flow controller for quantitative discharge management of acids, organic chemical solutions, and other substances.

  • Other semiconductors

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We provide appropriate products and services across a wide range of fields, starting with automotive equipment and industrial sectors.

  • Other electronic parts
  • Other semiconductors
  • Contract manufacturing

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A wide range of product development tailored to customer needs!

  • Ceramics
  • Other electronic parts
  • Other semiconductors

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Semiconductor device side panel

  • Other semiconductors

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We would like to provide information about test wafers supplied to semiconductor material manufacturers and equipment manufacturers.

  • Other semiconductors
  • Wafer

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Basic Knowledge of Test Wafers: What is a Test Wafer?

A test wafer is a wafer used for the evaluation of devices and materials necessary for next-generation semiconductor process development. Semiconductor manufacturers are tirelessly developing new process technologies, striving to enrich people's lives. Supporting this effort are material manufacturers and semiconductor equipment manufacturers, who conduct experiments and research daily to develop next-generation technologies. In this process, data collection using actual wafers is essential to improve the uniformity of processes on the wafer. Our company manufactures and sells test wafers for next-generation semiconductor development in a "custom-made" format that meets our customers' needs. Among the test wafers, we supply wafers that incorporate advanced technologies necessary for research and development in film formation, CMP, cleaning, etching, and TSV.

Semiconductor device stage

  • Other semiconductors

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Semiconductor device fixed fixture

  • Other semiconductors

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By using a copper core ball, deformation of the ball is minimized, enabling 3D implementation and narrow pitch implementation.

  • Other semiconductors
  • Prototype Services
  • Memory

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Supports ELO (epitaxial lateral overgrowth) as well!

  • Wafer
  • Wafer processing/polishing equipment
  • Piezoelectric Devices

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Semiconductor device fixed fixture

  • Other semiconductors

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Semiconductor device case

  • Other semiconductors

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Semiconductor device chassis

  • Other semiconductors

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Semiconductor device panel

  • Other semiconductors

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Semiconductor device panel

  • Other semiconductors

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Semiconductor device timer mounting bracket

  • Other semiconductors

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Semiconductor device case

  • Other semiconductors

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Bubbles-free application possible! Non-contact type for patterned surfaces can also be produced.

  • Wafer
  • Wafer processing/polishing equipment

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Adopts motor drive! Dust-free and suitable for clean rooms.

  • Wafer
  • Wafer processing/polishing equipment

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Semiconductor device components

  • Other semiconductors

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Semiconductor device connection bar

  • Other semiconductors

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Semiconductor device terminal fittings

  • Other semiconductors

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Semiconductor device chassis

  • Other semiconductors

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Analysis of the expanding COF market for OLED/smartphones, including an analysis of new Chinese manufacturers entering the market.

  • Organic EL
  • LCD display
  • Dedicated IC

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microSD card compatible ultra-fast programming & ultra-fast FPGA configuration module

  • ASIC
  • Memory

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Achieving 10Gbps UDP communication functionality with pure hardware logic without CPU!

  • ASIC

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High-performance, high-reliability IP core proven by NASA (National Aeronautics and Space Administration).

  • ASIC

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M.2-FMC conversion adapter board compatible with Intel/Xilinx FPGA evaluation boards. Supports connection of up to 2 M.2 NVMe SSDs.

  • ASIC
  • Board to Board Connectors

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Thickness from 0.1mm to 3.0mm, can be cut up to 8 inches in size!

  • Processing Contract
  • Circuit board design and manufacturing
  • Other semiconductors

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It is possible to achieve several times the speed and sensitivity of conventional technologies from other companies. Our unique structure allows us to form electromagnetic shielding on the photodiode.

  • Other semiconductors
  • Other measurement, recording and measuring instruments

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We will transform into a trading company that proposes total solutions.

  • Other electronic parts
  • Other semiconductors
  • Circuit board design and manufacturing

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Achieving 40 times speed 10GbE TCP/IP communication functionality with pure hardware logic without CPU!

  • ASIC

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Meeting the demands for higher flatness, damage-free, and free from heavy metal contamination with a complete mirror finish!

  • Other semiconductors
  • others

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15 years of trust and experience in memory module production. Production capacity is 340,000 units per month.

  • Other semiconductors
  • Contract manufacturing
  • Memory

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