List of Printed Circuit Board products
- classification：Printed Circuit Board
901～945 item / All 1982 items
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...
- Shelf life enhancer
Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.
We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.
Superior electrical and thermal properties due to special copper plating! Introducing the filling of DPC substrates.
- Printed Circuit Board
A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.
- Printed Circuit Board
We also support special processing such as ZAGRI processing, tap hole processing, and countersunk screw hole processing!
- Printed Circuit Board
High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.
- Printed Circuit Board
High heat resistance and high strength! Ceramic wiring board using DPC plating method.
- Printed Circuit Board
Introducing products by function such as high frequency, high thermal conductivity, and dimensional stability in a tree diagram!
- Printed Circuit Board
We provide a total solution from idea-level specifications to manufacturing and inspection.
- Printed Circuit Board
- Other electronic measuring instruments
Leave double-sided circuit boards to Kyosha! Please feel free to consult us with any concerns you may have.
- Printed Circuit Board
Kyosha adds more value to EMS. Kyosha can handle all aspects of circuit boards, jigs, and assembly in-house.
- EMS
- Career
- Printed Circuit Board
We respond to a wide range of requests with integrated production from prototype to mass production.
- Printed Circuit Board
We will introduce the assembly process of Azumi Manufacturing!
- Printed Circuit Board
Achieve high reproducibility! (Track record: approximately 80% or more) Leave the optimization of verification, components, and functions to prototype verification to us. *CPU is subject to consultati...
- Printed Circuit Board
- Circuit board design and manufacturing
● Aluminum substrates have a proven track record in automotive products and LED lighting fixtures. We also accommodate small quantities and a variety of products. ● Thick copper substrates are being d...
- Printed Circuit Board
- Circuit board design and manufacturing
Gravure roll technology essential for the production of microdevices adopted by major companies.
- Printed Circuit Board
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.
- Printed Circuit Board
- Circuit board design and manufacturing
![[Concerns about Device Assembly] It...](https://image.mono.ipros.com/public/product/image/881/2000751842/IPROS53284928688238343837.jpeg?w=280&h=280){kind=small}
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!
- Printed Circuit Board
- Circuit board design and manufacturing
Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.
- Printed Circuit Board
- Circuit board design and manufacturing
![[Concerns about Busbars] Busbars ar...](https://image.mono.ipros.com/public/product/image/8a9/2000751790/IPROS72604267135792674069.png?w=280&h=280){kind=small}
By converting the busbar into a circuit board, high insulation and compactness are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
![[Busbar Concerns] I want to reduce ...](https://image.mono.ipros.com/public/product/image/123/2000751794/IPROS84719230582340018141.png?w=280&h=280){kind=small}
By converting the busbar into a circuit board, high insulation and compactness are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
![[Busbar Concerns] I want to ensure ...](https://image.mono.ipros.com/public/product/image/07b/2000751795/IPROS89597759834847826898.png?w=280&h=280){kind=small}
By converting the busbar into a substrate, high insulation and miniaturization are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
![[Concerns about Busbars] The busbar...](https://image.mono.ipros.com/public/product/image/795/2000751798/IPROS47759230588737954979.png?w=280&h=280){kind=small}
By integrating the busbar into a circuit board, high insulation properties and miniaturization are achieved!
- Printed Circuit Board
- Circuit board design and manufacturing
Conducting electrical inspections and comprehensive inspections! Laminates are available up to a maximum size of 500mm × 2000mm.
- Printed Circuit Board
- Circuit board design and manufacturing
Pattern exposure corresponding to 20m! Achieving low-cost production through innovative manufacturing methods.
- Printed Circuit Board
- Circuit board design and manufacturing
4-layer flexible printed circuit board (FPC) using LCP materials! Introducing our manufacturing achievements for a product size of 1300mm.
- Printed Circuit Board
- Circuit board design and manufacturing
Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!
- Printed Circuit Board
- Circuit board design and manufacturing
- Paper and pulp products
[Materials Available] We will solve your problems! Introduction of printed circuit board prototyping service examples!
- Printed Circuit Board
[Essential for Development Managers!] If you have a limited budget, want to quickly create a prototype, or have many constraints regarding circuit board prototyping, please feel free to consult with u...
- Printed Circuit Board
For development prototype personnel! You can prototype with just one single-sided flexible circuit board starting at a low cost of only 34,800 yen!
- Printed Circuit Board
Production is possible at suitable factories both in Japan and overseas, according to your requests! PCB assembly service.
- Printed Circuit Board
It is also possible to replace parts due to loading errors! We also support circuit board repairs from scratch.
- Printed Circuit Board
Low-cost PCB prototyping! Small lot of one-sided aluminum board prototyping starts at 19,800 yen, including initial costs and shipping. Free samples available.
- Printed Circuit Board
We contribute to miniaturization of products through 3D implementation technologies such as PoP (Package on Package) implementation.
- Printed Circuit Board
3D implementation contributes to miniaturization and high density.
PoP technology is adopted in products that require miniaturization and high density, such as smartphones and digital still cameras, and our company has achieved a cumulative production record of over 100 million units to date. In addition to PoP, we also possess technology for stacking substrates to accommodate product miniaturization. 【Features】 ■ By stacking two semiconductor packages, it is possible to reduce the footprint on the substrate. ■ By using wiring between the upper and lower packages, we can shorten the wiring length compared to wiring on the substrate, enabling high-speed wiring. ■ By using tested packages that are quality assured, we can reduce the failure rate compared to SiP. ■ In addition to PoP, we can also accommodate substrate stacking.
Turnkey connector implemented! A thin polymer resin film is used as insulation.
- Board to Board Connectors
- Printed Circuit Board
High-reflective solder resist achieving high brightness and high heat dissipation, reflector processing technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
- Printed Circuit Board
We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.
- Printed Circuit Board