List of Pressure products
- classification：Pressure
1081～1125 item / All 1175 items
We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...
- Contract manufacturing
Do you have any concerns about contract manufacturing of various chemical products?
We would like to introduce the contract manufacturing services provided by Riten Chemical Co., Ltd. We are a chemical manufacturer based in Kyoto with 70 years of experience. Since our establishment, we have been developing, manufacturing, and selling various surfactants used in the textile and paper industries. Based on the technology and development capabilities we have cultivated over the years, we accept contract manufacturing of various chemical products, so please feel free to contact us. 【Contract Manufacturing Achievements】 ■ Construction waterproofing agents ■ Plant growth promoters ■ Construction waterproofing materials ■ Greening-related agents ■ Chemicals for the electronics industry ■ Wastewater treatment agents ■ Industrial preservatives ■ Special surfactants... We provide more detailed information through related products and catalogs.
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
High-speed sampling at 10 milliseconds. Measurement with the main unit only and detailed waveform monitoring and data recording measurement using the standard attached PC connection software are possi...
- Pressure
Ideal for low-viscosity plastics and resins!
- Pressure
Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
Ideal for low-viscosity plastics and resins!
- Pressure
Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
Measuring the surface temperature of plastic injection molding molds!
- Pressure
Measuring the surface temperature of plastic injection molding molds!
- Pressure
High-sensitivity compact sensor with a tip diameter of Φ2.5mm!
- Pressure
Announcement of Free Webinar: Semiconductor Resin Molding "Visualization Solutions Inside the Mold" and IoT Technology (April 20)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held four times on the following dates, but the content will be the same for all sessions, so please join us on a date that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
- Tension measurement of tension materials - Magnetostrictive sensor - NETIS registration (CG-140020-A) - Registered in the Hiroshima Prefecture Long-Life Technology Utilization Promotion Techno...
- Pressure
A sensor designed for precise measurement of static and dynamic pressure vibrations, ideal for absolute pressure measurement from 0 to 2 bar and 0 to 500 bar!
- Pressure
- Other measurement, recording and measuring instruments
Measurement with high precision of 0.05%! Contributes to cost reduction through single and multiple channel process monitoring.
- Pressure
- Torque Meter
- Other measurement, recording and measuring instruments
The internal volume is extremely small! A sensor with absolutely no internal contamination.
- Pressure
- Sensors
Trust and proven results born in Germany! Displaying invisible "forces" such as pressure, load, and torque in waveform.
- Pressure
- Torque Meter
- Other measurement, recording and measuring instruments
It is a manufacturer of high-precision pressure transmitters.
- Pressure
- Other measurement, recording and measuring instruments
Tip diameter Φ4mm, simultaneously measuring resin pressure and mold surface temperature!
- Pressure
Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
Compact sensor with a tip diameter of Φ1.2mm!
- Pressure
Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
Compact sensor with a tip diameter of Φ1mm!
- Pressure
Announcement of a free webinar: Semiconductor resin encapsulation molding "Visualization solutions for inside the mold" and IoT technology (4/27)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (New Energy Vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins like epoxy transfer molding and for low-pressure measurements. - Compatible with low-viscosity resins ⇒ Structure that does not cause measurement errors due to the intrusion of epoxy resin (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% relative to the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held three times on the following dates, but the content will be the same for all sessions, so please feel free to join on a date that suits you! April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register using the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
A robust structure without a diaphragm, capable of accommodating a wide measurement range!
- Pressure
- Other measurement, recording and measuring instruments
Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.
This is a USL pack that clearly distinguishes itself from competitor products.
- Pressure
This is a USL pack that clearly distinguishes itself from competitor products.
- Pressure
It is adopted in various fields, from semiconductors to pharmaceuticals and food.
- Pressure
Here is an introduction to the smallest type and the most popular type of the Reactor series!
- Pressure
Ideal for research on petroleum products and fuels! A wide range of options is available to suit your type.
- Pressure
It is possible to measure a differential pressure of -3.447 kPa to +3.447 kPa.
- Pressure
Differential pressure can be measured between -13.79 kPa and +13.79 kPa.
- Pressure
Differential pressure can be measured in the range of -34.48 kPa to +34.48 kPa.
- Pressure
It measures differential pressure in the range of -13.78 kPa to +13.78 kPa.
- Pressure
A portable digital manometer capable of data logging and printing out data.
- Pressure
Achieve low drift! A compact, high-performance digital pressure gauge with tracking functionality.
- Pressure
The resonance frequency is high, with high resolution, capable of measuring dynamic pressure and short-term static pressure from vacuum up to 10 bar!
- Pressure
The mechanical and thermal stress acting on the sensor is reduced with the front seal method, allowing for the measurement of explosion pressure and hydraulic pressure up to a maximum of 2,000 bar!
- Pressure
NATO standard sensor! The front seal design reduces mechanical and thermal stress on the sensor, capable of measuring explosion pressure and hydraulic pressure up to 6,000 bar!
- Pressure
The mechanical and thermal stress acting on the sensor is reduced with the front seal method, allowing for the measurement of explosion pressure and hydraulic pressure up to a maximum of 10,000 bar!
- Pressure
Easy setup and measurement with smartphone/tablet.
- Pressure
Depending on the sensor type, it can measure pressures up to a maximum of 400 bar. It records the minimum and maximum pressures during measurement.
- Other electronic measuring instruments
- Pressure
It is possible to measure absolute vacuum and pressure. Due to the robust structure of the vacuum pressure sensor, it can be used with gases, oils, and liquids.
- Other electronic measuring instruments
- Pressure
- Vacuum Equipment
Firmly control the vacuum (gas pressure)!!
- Other measurement, recording and measuring instruments
- Pressure
Tightly control the vacuum (gas pressure)!!
- Other measurement, recording and measuring instruments
- Pressure
Measure small pressure on a large scale!!
- Other measurement, recording and measuring instruments
- Pressure
It is a low-cost type differential pressure gauge.
- Other measurement, recording and measuring instruments
- Pressure
It is a rotary microloud vacuum gauge.
- Other measurement, recording and measuring instruments
- Pressure
- Vacuum Equipment
It is a simple structure vacuum manometer.
- Other measurement, recording and measuring instruments
- Pressure
- Vacuum Equipment
This is a U-tube with one end closed and filled with mercury, used to measure absolute pressure.
- Other measurement, recording and measuring instruments
- Pressure
- Vacuum Equipment
This is a Pitot tube compliant with JIS B 8330. It is a Pitot tube with a good directional shape, commonly referred to as the JIS type.
- Other measurement, recording and measuring instruments
- Pressure
- Vacuum Equipment
The tip diameter is larger compared to the L type and is used in areas with a lot of dust and debris.
- Other measurement, recording and measuring instruments
- Pressure
- Vacuum Equipment