List of その他半導体 products

  • classification:その他半導体

271~315 item / All 2605 items

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100万回繰り返しても壊れない!確実動作と高耐久性・低価格のマットスイッチ。工作機械のオプションなどにも。納期ご相談ください。

  • センサ

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<カラムデモ実施中> SECカラムとHICカラムを用いて凝集体と薬物抗体結合比(DAR)を分析

  • 8. MALS (UP-LS).png
  • 4. mAb (UP-LS).png
  • 15. γ-グロブリン (UP-LS).png
  • 5. 標準タンパク (HIC-ADC).png
  • 6. ADC Mimic (HIC-ADC).png
  • 7. ADC Mimic 高速 (HIC-ADC).png
  • クロマトグラフ用樹脂、充填剤

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サムネ緑.png

製薬企業様向け 動画配信サイトを公開しております。

バイオ医薬品業界で特に注目されているトピックスについて、 オンデマンド動画形式で配信しております。 定期的に最新動画を更新していきますので、この機会にぜひご覧ください。 ★視聴登録はこちら★ ※URLをコピーして、ブラウザでご視聴ください https://portal.stream.jp/eqk212ojxt ←もしくは、左のQRコードを読み取りご登録をお願いいたします。 【最新コンテンツ】 ・An Overview of Tosoh SEC Columns for Biotherapeutic Separation ・ワクチンのダウンストリーム精製におけるクロマトグラフィー分離 【人気コンテンツ】 ・抗体薬物複合体(ADC)の非変性クロマトグラフィー分離における最近の動向 ・オリゴ核酸医薬品のクロマトグラフィー精製(分取クロマトグラフィーへの応用)  など Webセミナーの中でご興味持っていただけたカラム、充填剤がございましたら ご評価用サンプルのご用意を積極的に行っておりますので、お申し付けください。

4つのトランジスタをヒートシンクに並べて固定できる

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1401-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1501-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1701-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1801-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2001-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2301-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE0801-2D-1.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1002-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE1201-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2101-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE3001-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE4003-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE3502-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2704-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2701-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2304-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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AL6063-T5アルミ合金の表面を黒アルマイト処理したBGAヒートシンク

  • JBHAE2303-2D.jpg
  • logo JARO Thermal.png
  • その他半導体

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強制空冷に適したハイパフォーマンスヒートシンク W300mm x H83.5mm

  • sk158_162.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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W15 mm x H25 mm トランジスタクリップ対応アルミヒートシンク

  • sk701.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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ネジなしでトランジスタを固定できる基板取付用アルミヒートシンク(W20 mm x H50 mm)

  • sk702.eps.jpg
  • sk70250sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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使用用途に合わせた曲げ加工も対応!様々な機能性材料を組合わせて打ち抜き加工することも可能

  • シールド材加工2.png
  • シールド材加工3.png
  • シールド材加工4.png
  • その他半導体
  • 加工受託

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Fischer Elektronik製 強制空冷用ハイパフォーマンスヒートシンク(中空型)W165mm x H84mm

  • sk497.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅47.8mm 高さ33mm 長さ50mm 基板取付用押出成形ヒートシンク トランジスタクリップ対応

  • sk495.eps.jpg
  • sk49550sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅35 mm x 高さ30 mm トランジスタをクリップで固定できる基板取付用アルミヒートシンク

  • sk697.eps.jpg
  • sk69750sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅46 mm x 高さ33 mm トランジスタをクリップで固定できる基板取付用アルミヒートシンク

  • sk499.eps.jpg
  • sk49975sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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2つのトランジスタをヒートシンクに並べて固定できる

  • thfm.eps.jpg
  • IPROS2175634052087143217.jpeg
  • その他半導体

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3つのトランジスタをヒートシンクに並べて固定できる

  • thfm.eps.jpg
  • thfm.jpg
  • IPROS2175634052087143217.jpeg
  • その他半導体

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モジュラー型静電容量変位計 イーサネットインターフェースで簡単接続!

  • その他半導体
  • 試験機器・装置

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約80メーカー、約70、000品種を当社で在庫を持ち【ひとつから】購入できるサービスです。

  • その他半導体
  • その他電子部品
  • その他の各種サービス

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パワー半導体の品質を、後工程から支える。

  • その他半導体

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ICデバイスをはんだ付けせずに実装と同じ条件で使用可能なソケット 「はんだいら~ず」

  • その他半導体
  • ソケット

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配線修正コネクタ・パッケージ変換サービス

  • その他半導体

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主要市場セグメントに焦点を当てた12の限定ウェビナーにご参加下さい!一流の半導体専門家が集まり、今後の 1 年を解き明かします。

  • セミナー
  • その他半導体

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2.xD/3Dパッケージ チップレットから後工程の基礎・トラブル対策、生成AIへの対応まで 先端半導体パッケージング技術を網羅

  • 技術書・参考書
  • その他半導体

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幅50mm x 高さ40mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk43450me.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅50mm x 高さ10mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk548.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅49.5mm x 高さ50mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk450.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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家電、民生、通信、産業、車載など様々なアプリケーションに順応する製品展開※AEC-Q100認証を受けた製品も保有

  • トランジスタ
  • 専用IC
  • その他半導体

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幅49.5mm x 高さ38mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk445.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅48.3mm x 高さ16.51mmのアルミ押出成形ヒートシンク

  • sk425.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅45.7mm x 高さ16.51mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk424.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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幅48mm x 高さ40mmのアルミ押出成形ヒートシンク - 長さバリエーションあり

  • sk666.eps.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • その他半導体

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通信・医療・半導体分野で注目の理由とは!皿リベット加工の事例をご紹介

  • 加工受託
  • その他半導体

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医療器などの高信頼性が必要な機器に適しているPTCサーミスタの活用事例をご紹介!

  • その他半導体

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