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Analysis Product List and Ranking from 382 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

Analysis Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. ダイコーテクノ Hiroshima//others
  2. 中電シーティーアイ 本社 Aichi//Service Industry
  3. アイテス Shiga//Electronic Components and Semiconductors
  4. 4 環境シミュレーション Tokyo//software
  5. 5 同仁グローカル Kumamoto//others
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Analysis Product ranking

Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 水処理分野向け　流体解析サービス 中電シーティーアイ 本社
  2. Metabolome analysis 同仁グローカル
  3. FEM (Finite Element Method) Contract Analysis Service ベンカン機工
  4. 4 Hepasine™ liver-related health indicator analysis service for medical institutions. プロトセラ
  5. 5 AI-supported app for KY activities 'HACARUS KY' ＨＡＣＡＲＵＳ

Analysis Product List

556～570 item / All 1060 items

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Heideck Hendo

Heideck Hendo

Providing the desired technology with expertise and know-how in resin! 【Analysis】

Hondoku Idec provides analysis technology with expertise and know-how in resin. 【Features】 ○ Structural Analysis By utilizing structural analysis, improvements in design quality regarding product strength, reduction of man-hours for prototypes and experiments, and shortening of development periods can be expected. ○ Resin Flow Analysis During product design, evaluating moldability before mold design enhances design quality, reduces defects that may occur in later processes, and streamlines the development process. ● For more details, please contact us or download the catalog.

  • 3D CAD

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CFD (Computational Fluid Dynamics) thermal fluid analysis

CFD (Computational Fluid Dynamics) thermal fluid analysis

Visualize fluid flow and temperature distribution! We will conduct analysis using Ansys Icepak to assist in your design.

In modeling for cooling targets, when designers repeat the process of design → prototyping → measurement through experiments → redesign → prototyping based on their experience, it leads to wasted time and costs. In short, CFD analysis is necessary to eliminate that waste. In CFD, as long as the input parameters are provided, calculations are performed automatically, allowing for the visualization of fluid flow and temperature distribution. Our company conducts analysis using Ansys Icepak to assist in the design process. *For more details, please refer to the PDF materials or feel free to contact us.*

  • Thermo-fluid analysis

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Coverity Static Analysis

Coverity Static Analysis

Static analysis (SAST) solutions by industry leaders. Quickly identify and fix security and quality issues during coding.

Coverity combines speed, ease of use, accuracy, compliance with industry standards, and scalability to support the development of high-quality and secure applications. Coverity can identify critical quality defects and security vulnerabilities early in the development process during coding, minimizing the effort and cost of fixing them. With accurate and specific remediation advice, along with context-sensitive e-learning, developers without security expertise can quickly understand how to address high-priority issues. Coverity seamlessly integrates automated security testing into CI/CD pipelines, supporting existing development tools and workflows. Additionally, Coverity can be deployed as a cloud-based Polaris Software Integrity Platform, providing a scalable application security platform not only on-premises but also in a SaaS model, depending on the development location and style. Coverity supports 22 languages and over 70 frameworks and templates.

  • Other security

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Software Composition Analysis "Black Duck"

Software Composition Analysis "Black Duck"

We protect and manage open source across the entire software supply chain!

"Black Duck" is a comprehensive solution for managing the risks of security, license compliance, and code quality that arise when using open source in applications and containers. Certified as a leader in Software Composition Analysis (SCA) by Forrester. Maximizes visibility of third-party code and manages it across the entire software supply chain and throughout the application lifecycle. 【Features】 ■ Improved accuracy and efficiency of analysis ■ Rapid detection and remediation of vulnerabilities ■ Automatic enforcement of security and usage policies ■ Identification of open source risks even without source code *For more details, please refer to the PDF document or feel free to contact us.

  • Software (middle, driver, security, etc.)
  • Other security and surveillance systems
  • Document and Data Management

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Wet-type single-screw small extruder 'ME-110INV' <for laboratory and trial use>

Wet-type single-screw small extruder 'ME-110INV' <for laboratory and trial use>

Excellent sanitary properties and compact! Here is a proposal for a high-torque, low-speed single-screw extruder.

The "ME-110INV" is a compact extruder suitable for laboratory and trial use in the food, cosmetics, and pet food industries. In the 50Hz area of Eastern Japan, it operates at 16 revolutions per minute, while in the 60Hz area of Western Japan, it operates at 20 revolutions per minute. However, the rotation speed can be adjusted by the user from 12rpm (40Hz) to 23rpm (70Hz) according to the hardness of the material and the working speed. The nozzle die can be easily replaced according to the application, and the extruding screw section can be completely disassembled for cleaning. 【Features】 - Compact size, ideal for small-scale production in research and development (laboratory, food, cosmetics applications) - The nozzle die can be easily replaced according to the application (two standard sizes included) - The extruding screw section can be completely disassembled for cleaning - The rotation speed can be adjusted by the user from 12rpm (40Hz) to 23rpm (70Hz) *For more details, please refer to the related links or feel free to contact us.

  • Extrusion Machine

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[Low Cost / Short Delivery Time] Contract Flow Analysis of Resin

[Low Cost / Short Delivery Time] Contract Flow Analysis of Resin

Possible defect prediction and cause analysis during molding! Resin flow analysis that can reduce mold modification costs! [Expedited service available]

"Resin flow analysis" is a method for visualizing the flow of molten resin injected into the interior of a mold from an injection molding machine, which is difficult to confirm from the outside. By conducting flow analysis in advance, it becomes possible to predict defects during molding and analyze their causes. This can shorten the development period, reduce mold modification costs, and enable product design that does not rely on intuition or experience. 【Features】 ■ Shortens the development period ■ Reduces mold modification costs ■ Enables product design that does not rely on intuition or experience ■ Improves the quality of molded products *For more details, please refer to the PDF materials or feel free to contact us.

  • Other analyses

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for analysis - Backside polishing - We accommodate various sample forms. Si chip size: 200um to 15mm square ■ Defective area identification - Backside IR-OBIRCH analysis and backside emission analysis - IR-OBIRCH analysis: Supports up to 100mA/10V and 100uA/25V Emission analysis: Supports up to 2kV * We address a wide range of defect characteristics such as low-resistance shorts, micro leaks, and high voltage breakdown failures. ■ Pinpoint cross-sectional observation of leak areas - SEM/TEM - We select SEM or TEM observation based on the predicted defects and can conduct physical observation and elemental analysis of leak defect areas with precision.

  • Contract Analysis
  • Transistor
  • Analytical Equipment and Devices

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Analysis of semiconductor diffusion layers using sMIM

Analysis of semiconductor diffusion layers using sMIM

Detect changes in concentration as changes in C! The dC/dV signal can also be obtained, which is effective for analyzing the diffusion layer.

At Aites Co., Ltd., we conduct analysis of semiconductor diffusion layers using sMIM. The Scanning Microwave Impedance Microscopy (sMIM) features a signal that has a linear correlation with dopant concentration. sMIM scans the sample by irradiating microwaves from the tip of a metal probe attached to an SPM and measures the reflected waves to obtain sMIM-C images that have a linear correlation with the concentration of the diffusion layer. The C component of Zs obtained from reflectivity consists of oxide film capacitance and depletion layer capacitance, and by utilizing the fact that the depletion layer width changes depending on impurity concentration, we detect changes in concentration as changes in C. [Application Examples] ■ sMIM-C: Visualization of diffusion layers and semi-quantitative evaluation of dopant concentration for various semiconductor devices such as Si, SiC, GaN, InP, GaAs, etc. ■ dC/dV: Evaluation of diffusion layer shape, determination of p/n polarity, visualization of depletion layers. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Contract Analysis
  • Other contract services

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a copper plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the halving of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain *For more details, please refer to the PDF document or feel free to contact us.

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  • Analytical Equipment and Devices
  • Analysis Services

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Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

Pre-processing of SiC devices → Identification of leakage points → Physical analysis/component analysis handled seamlessly!

Our company conducts "Backside Emission Analysis of SiC Devices." SiC is a power device with less energy loss compared to conventional Si semiconductors and is attracting attention. However, due to its different physical properties from Si semiconductors, new methods are required for failure analysis. In a case study of backside emission analysis of SiC MOSFETs, an overseas SiC MOSFET was subjected to ESD, creating a G-(D,S) leakage, and numerous emissions indicating the leakage points were detected through emission analysis. When the emission points were observed using TEM, destruction of the SiO2 film and damage to the SiC crystal were noted. *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!

We will introduce the EBSD analysis of flexible printed circuits (FPC). For flexible circuits used in products with movable parts and bending mechanisms, we conducted an EBSD analysis to check for differences in the Cu wiring between the bending section and the fixed section. As a result, while no significant abnormalities or differences were observed in the optical images of the wiring in the bending and fixed sections, the EBSD analysis revealed areas where strain is accumulated in the wiring of the bending section and areas where low-angle grain boundaries are concentrated. [Analysis Content] ■Appearance of the flexible circuit and optical images of Cu wiring - Appearance of the flexible circuit - Wiring in the bending section - Wiring in the fixed section ■Comparison of Cu wiring in the bending section and fixed section using EBSD - Wiring in the bending section - Wiring in the fixed section *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services
  • Contract Analysis

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LED failure analysis

LED failure analysis

Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Discrimination," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "Electrical Normal" and "Open, High Resistance." 【Initial Diagnostic Items for LED Packages】 ■ Electrical Characteristics Measurement ■ Visual Inspection ■ Lens Polishing / Internal Optical Observation of the Package ■ Lighting Test (Brightness Distribution Observation) *For more details, please refer to the PDF document or feel free to contact us.

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  • Contract Analysis
  • Analysis Services

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Analysis of Li-ion battery separators

Analysis of Li-ion battery separators

I confirmed the blocking function of polymer melting at high temperatures!

Regarding the separator used in commercially available Li-ion batteries, after conducting material analysis using FT-IR, we confirmed its function of blocking polymer melting at high temperatures. The document presents the material analysis of Li-ion battery separators and observations of the state changes of the separators under high-temperature conditions using graphs and photographs. [Analysis Overview] ■ Material analysis of Li-ion battery separators ■ Observation of state changes of separators under high-temperature conditions - The state changes of the separator were observed over time at a constant temperature of 135°C using FIB/SEM. *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services
  • Contract Analysis

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Structural analysis of prismatic Li-ion batteries.

Structural analysis of prismatic Li-ion batteries.

Observation using optical microscopy and ultra-low acceleration FE-SEM! Detailed structural analysis and elemental analysis are possible.

By mechanically polishing commercially available rectangular Li-ion batteries and observing them with optical microscopy and ultra-low acceleration FE-SEM, detailed structural analysis and elemental analysis can be performed. The materials introduce the overall structure of the Li-ion battery and detailed structural observations of the Li-ion battery using SEM and ultra-low acceleration FE-SEM through photographs. [Analysis Overview] ■ Overall structure of the Li-ion battery and SEM observation ■ Detailed structural observation of the Li-ion battery using ultra-low acceleration FE-SEM *For more details, please refer to the PDF materials or feel free to contact us.

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  • Analysis Services
  • Other contract services

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Structural analysis of Nylon 6.10

Structural analysis of Nylon 6.10

We will elucidate the characteristics at the molecular level using our FT-IR and thermal decomposition GC-MS!

At AITES, we are conducting a structural analysis of Nylon 6.10. Nylon possesses flexibility and a texture similar to silk, while also having high strength and durability that natural fibers do not have, described as "stronger than steel and finer than a spider's silk." We will elucidate these characteristics at the molecular level using our FT-IR and pyrolysis GC-MS. 【Nylon 6.10 Interfacial Polymerization Reaction Mechanism】 1. Electron withdrawal by chlorine leads to a deficiency of electrons in adjacent carbon. 2. The non-bonding electrons of the amine attack the carbon as a nucleophile. 3. The oxygen atom is activated to form an unstable intermediate. 4. Hydrogen chloride is eliminated, forming an amide bond. 5. Interfacial polymerization progresses, resulting in polymerization. *For more details, please refer to the PDF document or feel free to contact us.

  • Contract Analysis

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