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391～405 件を表示 ／ 全 958 件
The BC65A-J is a rotary chuck main body.
The precision ball lock chuck BC65A-J can be used by equipping it with a three-jaw chuck or the JAM original G1 chuck. Note: Only the gripping part cannot be replaced.
The BC65B-J is a rotary chuck body.
You can use it by equipping the precision ball lock chuck body with a three-jaw chuck or the JAM original G1 chuck. Note: Only the gripping part cannot be replaced.
Lever chuck specification
●This is a specification that combines a lever chuck with the main body of the precision ball lock chuck BC65A. ●It can be easily set up using the indexing function with scale alignment. ●By adopting a special ball lock mechanism, it achieves good repeatability in locking and precise positioning. (Patent pending) ●The indexing is done through a manual rotation structure. ●BC65A-V main body weight: 3 kg.
G1 Chuck Specification
●This is a specification that combines the G1 chuck with the main body of the precision ball lock chuck BC65A. ●It can be easily set up using the indexing function with scale alignment. ●By adopting a special ball lock mechanism, it achieves good repeatability in locking and precise positioning. (Patent pending) ●The indexing is done through a manual rotation structure. ●BC65A-Y main body weight: 3.2 kg.
Lever chuck specification
● This is a specification that combines a lever chuck with the main body of the precision ball lock chuck BC65B. ● It can be easily set up using the indexing function through scale alignment. ● By adopting a special ball lock mechanism, it achieves high repeatability in locking and precise positioning. (Patent pending) ● Indexing can be easily operated with the handle attached to the main body. ● BC65B-V main body weight: 4.9 kg
G1 chuck specifications
● This is a specification that combines the G1 chuck with the main body of the precision ball lock chuck BC65B. ● It can be easily set up using the indexing function based on scale alignment. ● By adopting a special ball lock mechanism, it achieves high repeatability in locking and precise positioning. (Patent pending) ● Indexing is easily operated with the handle attached to the main body. ● BC65B-Y main body weight: 5.1 kg
G1 Chuck-equipped specification
● The gripping part can be set to an angle of 0 to 90°, and the chuck body can rotate 360°. ● The main body is made of stainless steel. ● It has a compact design, allowing it to be used in limited processing areas. ● The TDC76-Y is a model equipped with a G1 chuck (shipped set up) on the TDC76 main body. ● TDC76-Y main body weight: 4.7 kg.
Small wafer chuck, high precision control!! From room temperature to -200℃!
In the heating process of semiconductor wafers, we will match the interface to the equipment you have as various evaluation tables.
Customizable in size, adsorption pattern, and temperature!
We uniformly heat extremely thin workpieces such as wafers and glass substrates. The maximum temperature that can be achieved is 300°C. The workpieces are fixed by vacuum suction, so no stress is applied to them during fixation. By combining with a manual simple XY stage, you can build an inspection station on a low budget. Precise temperature control is also possible with the MSA digital temperature controller. OEM support is also available. ● For more details, please download the catalog or contact us.
The chucking (adsorption) pattern is customizable to fit the workpiece!
The "PJ-050 model" is a hot chuck for temperature testing of electronic devices and wafers, capable of handling temperatures from low to high. The temperature range is from -10 to +150°C. It can be added to existing evaluation and testing equipment, making it ideal for small quantities and research and development. It uses a heater as the heating source and a Peltier (air-cooled) as the cooling source, supporting high-speed temperature profile processes. It operates on an AC100V power supply, allowing for both cooling and heating. The temperature controller is a dedicated type that supports both cooling and heating with a single unit. For more details, please download the catalog or contact us.
Supports a wide range from low to high temperatures! Ideal for temperature testing of electronic devices and wafers.
The "PJ-101 model" is a wafer hot chuck (heating and cooling) that can be added to existing evaluation and testing equipment, making it ideal for small quantities and research and development. It uses a heater as the heating source and a Peltier (air-cooled) as the cooling source, supporting high-speed temperature profile processes. It operates on an AC100V power supply, allowing for both cooling and heating. The temperature controller is a dedicated type that can handle both cooling and heating with a single unit. The chucking (suction) pattern can also be customized to match the workpiece. ● For more details, please download the catalog or contact us.
Integration into your company's testing system, OEM products for equipment manufacturers!
The "PH-101T" is a compact wafer hot chuck that can uniformly heat ultra-thin workpieces such as wafers and glass substrates, with a maximum temperature of 300°C. Its top plate structure allows for compatibility with several types of workpieces through plate replacement. The workpieces are fixed by vacuum suction, which does not impose stress on them. Additionally, precise temperature control is possible with the MSA digital temperature controller. Customization is available for size, suction patterns, and temperature. We also offer custom solutions for the method of fixing to the hot chuck stage, so please feel free to consult us. ● For more details, please download the catalog or contact us.
