Semiconductor Automatic Cutting Machine 'SMB-812-40280'
Cut the processed cylindrical ingot into cones, blocks, and samples.
The "SMB-812-40280" is a semiconductor automatic cutting machine that performs the separation of both ends of long silicon ingots using a band saw, as well as cutting to specified block sizes and sampling cuts for each block. Laser/ink printing can be applied to blocks and samples, and a LAN connection system for logistics sorting is also possible. Additionally, fully automatic loaders and unloaders can be accommodated based on specific requirements. Please feel free to contact us if you have any requests. 【Specifications】 ■ Ingots size: 8", 12" × 2,800l / 500kg ■ Block length: 100–450mm ■ Sample thickness: 1.2–5.0mm ■ Utility: 10kVA / 220V / 50A / 60Hz ■ Dimensions a b h: 8,200 / 4,650 / 3,500mm ■ Machine weight: 19,400kg *For more details, please download the PDF or feel free to contact us.
- Company:齊藤精機
- Price:Other