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![[Data] Plasma dicing of various materials](https://image.mono.ipros.com/public/product/image/47c/2000499782/IPROS50645552467826755000.png?w=280&h=280)
It includes a comparison of blade dicing and plasma dicing.
This document introduces plasma dicing of a wide variety of materials. It includes the advantages of plasma dicing and Samco's technology. Please take a moment to read it. 【Contents】 ■ Advantages of plasma dicing ■ Samco's technology ■ Processing of a wide variety of materials is possible ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.
Solving the issues of dicing! Contributing to productivity improvement through advanced process technology.
The "7120/7130 series" is a low-vibration spindle device available in 2" and 4" sizes, providing satisfactory usability and flexibility in response to your requirements. The turntable features high torque and high precision (1 micron). It has a long travel distance on the X-axis, making loading and unloading easy. Additionally, thanks to a unique algorithm, it can predict blade wear rates based on average blade consumption time, reducing wear rates to one-third of traditional methods and increasing production per hour. 【Features】 ■ Multiple panel dicing ■ Equipped with a high-resolution camera (2000×2000 pixels) ■ Easy loading and unloading ■ Easy maintenance ■ Supports customer-specific process specifications *For more details, please refer to the PDF materials or feel free to contact us.
Optimize dicing time! A single spindle that contributes to yield improvement and cost reduction!
The "7900 Uno" is an automatic, single-spindle dicing device. The "model 7910" consists of a 2" spindle and an 8" size. It features an easy-to-use, intuitive, GUI-based touch screen. It has a small installation footprint, is compact, and easy to maintain. In addition to performing cutting surface inspection, quality analysis, process data collection, and statistical analysis, it also has compatibility technology with the 7900 dual spindle device. 【Features】 ■ Low ownership costs ■ Small installation footprint and compact ■ High reliability and high precision ■ Optimization of dicing time ■ Yield improvement and cost reduction functions *For more details, please refer to the PDF materials or feel free to contact us.
Improved processing efficiency. Dicing processing with high precision and low cost. Excellent operability.
The ADT-made "8020 Series" is a fully automatic dicing machine capable of cutting semiconductor wafers with a diameter of up to 8 inches with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high processing efficiency. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Supports hub/hubless blades up to 3" O.D. - High-power spindles of 1.8kW or 2.4kW - Excellent vision system with continuous zoom - Improved throughput with high-speed automatic alignment and cutting positioning *For more details, please refer to the materials. Feel free to contact us as well.
An excellent vision system equipped with continuous zoom magnification! A twin dicing device with two touch screens.
The ADT Corporation's "8030 Series" is a twin dicing machine capable of cutting semiconductor wafers up to 12 inches in diameter with high precision and low cost. With twin spindles arranged to face each other, simultaneous dicing is possible, contributing to high efficiency in processing. It features two touch screens for the main display and maintenance, equipped with an intuitive user interface for easy operation. 【Features】 - Bridge-type frame - Flexibility – supports hubs with a maximum outer diameter of 3 inches and hubless blades - Dual microscopes, fixed non-contact sensors, and two dress stations - High-output spindles of 1.8kW or 2.2kW - Excellent vision system with continuous zoom magnification - Intuitive operating interface using a large 19-inch touch screen monitor *For more details, please refer to the PDF document or feel free to contact us.
Leave the dicing, scribing, and appearance inspection to us!
Fujita Device Co., Ltd. is a company that operates as a member of the Fujita Group, engaging in backgrinding (BG), dicing, appearance inspection, design and manufacturing of printed circuit boards, and the development and production of labor-saving devices. We own equipment such as dicing machines, scribers, and metal microscopes for appearance inspection, and we are involved in a wide range of operations including the assembly and sorting of optical devices, jig packing, and the design and production of testing boards for semiconductors. With excellent technology and high quality provided by our outstanding staff, as well as cost performance, we offer superior products. By gaining high trust, we contribute to the development of our customers' businesses and society. 【Product and Service Introduction】 ■ Backgrinding (BG), dicing, and appearance inspection ■ Design and manufacturing of printed circuit boards ■ Development and production of labor-saving devices ■ Image inspection equipment ■ Package assembly *For more details, please download the catalog from the link below or feel free to contact us.
Supports multiple wafer sizes! Dicing using the Bosch process with inductively coupled plasma.
The "MDS-100/MDS-300" is a plasma dicing device that utilizes inductively coupled technology, enabling stable and uniform continuous processing of 25 wafers with high-output plasma. It allows processing while maintaining high uniformity without causing damage to the wafers, similar to that caused by saws or lasers. Using the Bosch process with a high-speed gas switching system, it achieves excellent sidewall shape and processing of free shapes, providing superior dicing strength compared to existing methods. 【Features】 ■ Contributes to improved die quality, yield, and freedom of die shape with excellent processing capability ■ Supports multiple wafer sizes (MDS-100: φ4" to 8", MDS-300: φ8" to 12") ■ Dicing using Bosch process with inductively coupled plasma ■ Achieves fast and stable step switching through a high-speed gas switching system ■ Allows setting of parameter morphing and its fluctuation trends *For more details, please refer to the PDF document or feel free to contact us.
![[Data] 7120/7130 Expansion Automatic Dicing Machine](https://image.mono.ipros.com/public/product/image/7c7/2000350860/IPROS7518895817979121024.jpg?w=280&h=280)
Publication on new features and enhancements related to the Dicing Saw 7120/7130 series.
This document introduces the automatic dicing machines of the '7120/7130 series'. We offer the standard model "Dicing Saw 7120 Series" with a stroke of up to 8 inches, and the standard model "Dicing Saw 7130 Series" with a stroke of up to 12 inches. It includes improvements to the hardware from the "old version 7100," which has been on the market for over 10 years, as well as new software features and enhancements. [Contents] ■ Model ■ Hardware Improvements ■ Low Vibration Spindle ■ New Software Features ■ Software Enhancements *For more details, please refer to the PDF document or feel free to contact us.
Applicable to glass plates and PCBs! Large panel dicing up to 24" × 18"!
The "ATD Model 7100 XLA" is a large panel dicing machine that accommodates sizes up to 24"×18". The chuck is customizable for user specifications and can support both clamped and unclamped options, as well as processing with or without tape. Loading and unloading are easy, and maintenance can be performed with ease. The monitor is adjustable and rotatable, and it comes with a USB hub. 【Features】 ■ Large panel size up to 24"×18" ■ Applications: Glass plates, PCBs, copper-clad FR4, QFN, etc. ■ Customizable chuck for user specifications ■ Supports clamped and unclamped options ■ Processing with or without tape *For more details, please refer to the PDF document or feel free to contact us.
From development to mass production! Increased productivity through efficient wafer transport and rapid, precise alignment!
The "7220 Series" is a space-saving fully automated device that widely offers advanced automation and process monitoring mechanisms that meet the productivity and quality required for challenging dicing. Starting with efficient wafer transport systems for streamlined operations, it enhances productivity by shortening height measurement time through rapid and accurate alignment and a blade wear prediction algorithm. In addition to automatic blade sharpening with a dedicated dress cassette, it also excels in operability with a touch panel display. 【Features】 ■ Streamlined operations with efficient wafer transport systems ■ Rapid and accurate alignment with continuous digital image magnification devices ■ Reduced height measurement time with blade wear prediction algorithms ■ Excellent process results with spray-type wafer cleaning technology ■ Quality assessment during the process with built-in inspection trays *For more details, please refer to the PDF materials or feel free to contact us.
Simultaneous dicing with two spindles facing each other! A high-performance device that doubles productivity!
The "7900 Duo" is a dicing saw equipped with two opposing spindles that simultaneously dice wafers, doubling productivity. The dicing saw is fixed to the front-mounted spindle, eliminating the effects of heat and preventing misalignment of the cut position, which ultimately increases yield. Additionally, by combining a small footprint with high productivity and automation, it reduces costs, leading to a decrease in ownership costs and, consequently, a reduction in cost per product. 【Features】 ■ Simultaneous dicing with two opposing spindles ■ Low vibration base ■ Improved productivity with quick automatic alignment and cut positioning ■ Reduced ownership costs with a small footprint *For more details, please refer to the PDF document or feel free to contact us.
ICA1205 is a multi-laser dicing device that employs a multi-beam structure.
Achieved through a multi-laser structure: - Enables finer cutting - Reduces temperature during cutting - Minimizes impact on the substrate Applications: RFIC, discrete, thin wafer, LED, MEMS, memory, power devices 〇 Other ASM equipment handled: - Wire bonder equipment - 2D and 3D package appearance inspection equipment - Other die bonder equipment (alignment accuracy 0.2µm to 25µm) 〇 ASMPT equipment installation achievements (total domestic and international): 2,000 die bonders per year, 4,000 wire bonders per year
Full cut and step cut compatible with dual spindle! Processing track record for wafer thickness of 725 to 100 μm and chip sizes of 0.5 mm or less!
Full cut and step cut compatible with dual spindles. Equipped with CO2 injectors and transport for ESD measures, as well as ionizers during cleaning. Additionally, please leave the blade selection and processing conditions to minimize chipping to us. 【Overview】 ■ LSI silicon wafers (Max 8 inches) ■ Quartz *For more details, please refer to the PDF document or feel free to contact us.
Introducing technologies compatible with wet dicing and dry dicing!
We would like to introduce the dicing technology of Niigata Seimitsu Co., Ltd. In the dicing process, we can accommodate both wet dicing, which uses pure water to cut substrates and wafers, and dry dicing, which cuts substrates without using pure water. 【Supported Dicing】 ■ Wet Dicing (Substrate) ■ Wet Dicing (Wafer) ■ Dry Dicing (Substrate) *For more details, please refer to the PDF materials or feel free to contact us.
