Etching solution H-20L
Main component: Ferric chloride aqueous solution
Etching solution that allows for easy etching of self-made circuit boards.
- Company：サンハヤト
- Price：Other
Etching solution Product List and Ranking from 8 Manufacturers, Suppliers and Companies | IPROS GMS
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
Etching solution Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
- KANTO CHEMICAL CO., INC. Electronics Material Division Tokyo//Chemical
- Hayashi Pure Chemical Ind., Ltd. Electronic Materials Osaka//Chemical
- null/null
- 4 サンハヤト Tokyo//Resin/Plastic
- 5 日研化学研究所 Aichi//Printing Industry
Etching solution Product ranking
Last Updated： Aggregation Period:Feb 11, 2026～Mar 10, 2026
This ranking is based on the number of page views on our site.
- Aluminum etching solution "MIXED ACID Al Etchant" KANTO CHEMICAL CO., INC. Electronics Material Division
- Titanium Etchant "TI Series" KANTO CHEMICAL CO., INC. Electronics Material Division
- Gold Etchant "AURUM Series" KANTO CHEMICAL CO., INC. Electronics Material Division
- 4 Chromium etchant "Cr Series" KANTO CHEMICAL CO., INC. Electronics Material Division
- 5 TiW Etching Solution "Pure Etch TE Series" Hayashi Pure Chemical Ind., Ltd. Electronic Materials
Etching solution Product List
31～50 item / All 50 items
Displayed results
Neutral flash etching solution "OPC Seed Etchant NE"
Flash etching solution for copper sputter film compatible with fine circuit boards 'OPC Seed Etchant NE'
With the miniaturization, high performance, and high functionality of information and communication devices, semiconductor devices are now required to operate at high speeds. For the implementation of wiring on semiconductor package substrates and printed circuit boards, the method of forming a copper seed layer through sputtering followed by electroplating has become common to achieve further miniaturization and improved interlayer adhesion. Our company has newly developed a flash etching solution that preferentially etches copper sputtered films to accommodate copper sputtered films. There is a demand for technology that reduces transmission loss in copper films to support high-speed communication. To meet this demand, we have newly developed a flash etching solution for copper sputtered films that is optimal for fine circuit substrates and excels in planar smoothness.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
LtF Process for Fan-Out Packaging Process
Introducing dry film stripping agents and seed layer (copper/titanium) etching solutions!
The "LtF Process" is a product for the Fan-Out packaging process. We offer amine-based dry film resist stripping solutions, copper sputter seed layer etching solutions, and titanium sputter seed layer etching solutions. 【Features】 ■ Dry film stripping agent ⇒ Reduces copper dissolution ■ Copper sputter seed layer etching solution ⇒ Maintains stable performance due to continuous supply method ■ Titanium sputter seed layer etching solution ⇒ Low corrosiveness to other metal materials and excellent selective etching properties *For more details, please refer to the PDF document or feel free to contact us.
- Company：メルテックス
- Price：Other
GaP roughening etching solution
The surface of the GaP film and the surfaces, slopes, and sides of the GaP substrate can be effectively roughened through etching, improving the light extraction efficiency.
The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, gallium phosphide, gallium nitride.
AlGaAs/GaAs roughening etching solution
The surfaces of AlGaAs films, GaAs films, and GaAs substrates can be effectively roughened through etching, improving light extraction efficiency.
The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, aluminum gallium arsenide, gallium arsenide.
Al Damage-Free Insulating Film Etching Solution
Al and Al alloy films are etched well without corroding the insulating film. We have products for etching processing and for removing Si natural oxide films.
The features of this product are as follows: - It does not corrode Al or Al alloys. - It forms a good tapered profile. - It can be used for the formation of vias and pads through wet etching. - It can also be used as a pretreatment solution for Pure Etch 160 (Al damage-free Si etching solution). Keywords: wet etching, SiO2, SiN, TEOS, silicon oxide film, silicon nitride film.
GaN (N-face) rough surface etching solution
The surface of the GaN (N-face) film can be effectively roughened through etching, improving the light extraction efficiency.
The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at room temperature to high temperatures. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, gallium nitride.
W Etching Solution 'Pure Etch W Series'
We will etch the W film well.
The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are good. - There are no residues after etching. Keywords: Wet etching, tungsten
Au Etching Solution "Pure Etch AU series"
We will etch the Au film well. There are also etching solutions for seed layers that cause little damage to the Au plating and allow for etching of the Au seed layer.
The features of this product are as follows: - It allows for processing at low temperatures and in a short time. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for fine bump formation and pattern formation processes. Keywords: wet etching, gold, plating, seed layer, selective etching solution.
TiW Etching Solution "Pure Etch TE Series"
We etch TiW films effectively. Since the etching performance varies depending on the film formation method and film structure, please contact us for more details.
The features of this product are as follows: - It forms a good positive taper. - There is minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - There is no residue after etching. Keywords: wet etching, titanium tungsten
PZT etching solution "Pure Etch PT series"
We will etch the PZT (lead zirconate titanate) film well.
The features of this product are as follows: - It etches without residue with a small amount of side etching. - It is compatible with PZT films produced by various film formation methods (sol-gel method, sputtering method, and other deposition methods). - Etching is possible using various processing methods such as dip and spray. - It also supports etching of bulk materials. - Non-toxic and non-hazardous products are also available. Keywords: wet etching, lead zirconate titanate
Si etching solution (isotropic)
We perform good isotropic etching of the Si film. In addition to standard isotropic etching solutions, we also have thinning etching solutions that are optimal for thinning Si substrates.
The features of this product are as follows: - Processing at low temperatures and in a short time is possible. - The surface after etching is mirror-like. Keywords: wet etching, silicon isotropic etching, silicon substrate thinning
SUS Roughening Etching Solution "PureEtch MF series"
The surface of SUS material is effectively roughened by etching without using any special techniques.
The features of this product are as follows: - It forms desired unevenness on the surface of various SUS materials. - The in-plane uniformity of the uneven surface shape is excellent. Keywords: chemical roughening, unevenness, stainless steel
Astro No.1 Sex Liquid Mark II
No need for gum pulling during breaks! The shadow area and hair removal text have good visibility.
"Astro No.1 H Liquid Mark II" is a non-alcoholic dampening solution that recommends concentration management through a quantitative addition method that is unaffected by external factors. No gum pulling is required during breaks. It prevents excessive ink absorption and emulsification, eliminating issues like bleeding. Additionally, it enhances the non-inked area of the plate, providing good visibility for shadow areas and fine text. It maintains a consistent water film, making water volume control easy. 【Features】 ■ Reduces usage compared to pH management ■ Maintains a consistent water film, making water volume control easy ■ Prevents excessive ink absorption and emulsification, eliminating issues like bleeding ■ Enhances the non-inked area of the plate, providing good visibility for shadow areas and fine text ■ No gum pulling is required during breaks *For more details, please refer to the PDF document or feel free to contact us.
- Company：日研化学研究所
- Price：Other
PP Clean H
Blue ink can be printed easily without getting dirty! A revolutionary etching solution that pursues convenience and ease of use.
"PP Clean H" is a non-cyan type etching solution. It can be used as both a dampening solution for Pink Master (static master) and PS plates, developed as an innovative product that pursues convenience and ease of use. With traditional cyan types, it was difficult to print with dirty indigo and red inks, but now it is easily achievable. 【Features】 ■ Non-cyan product ■ Easily print with indigo ink without getting dirty ■ Suitable for neutral paper printing ■ Compatible with both Pink Master and PS plates ■ Functions like two machines in one *For more details, please refer to the PDF document or feel free to contact us.
- Company：日研化学研究所
- Price：Other
![[Research Material] Global Market for Buffered Oxide Etch (BOE)](https://image.mono.ipros.com/public/product/image/0ce/2001460007/IPROS94578915933921701563.jpeg?w=280&h=280)
[Research Material] Global Market for Buffered Oxide Etch (BOE)
World Market for Buffered Oxide Etching Solution (BOE): BOE 6:1, BOE 7:1, Integrated Circuits, Solar Energy, Monitor Panels
This research report (Global Buffered Oxide Etchants (BOE) Market) investigates and analyzes the current status and outlook for the global market of buffered oxide etchants (BOE) over the next five years. It includes information on the overview of the global buffered oxide etchant (BOE) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type focus on BOE 6:1 and BOE 7:1, while the segments by application target integrated circuits, solar energy, and monitor panels. The regional segments calculate the market size of buffered oxide etchants (BOE) by dividing into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in buffered oxide etchants (BOE), product and business overviews, and sales performance.
- Company：マーケットリサーチセンター
- Price：Other
Etching solution for aluminum and aluminum alloys "Mastova E1"
It is an acid-type etching solution with low odor and excellent workability.
"Mustova E1" is an etching solution for aluminum and aluminum alloys. It is a mixed acid type etching solution that has a low odor and excellent workability. It is used in the electronics industry. 【Features】 ■ Mixed acid type ■ Low odor ■ Excellent workability ■ For aluminum and aluminum alloys *For more details, please refer to the PDF document or feel free to contact us.
- Company：三若純薬研究所
- Price：Other
![[Research Material] The Global Market for Dental Etching Solutions](https://image.mono.ipros.com/public/product/image/6ed/2001463437/IPROS81727364455237514229.jpeg?w=280&h=280)
[Research Material] The Global Market for Dental Etching Solutions
Global Market for Dental Etching Solutions: Dental Etching Solutions with Syringe, Dental Etching Solutions without Syringe, Hospitals, Clinics, Outpatient Services ...
This research report (Global Dental Etching Liquid Market) investigates and analyzes the current status and outlook for the global dental etching liquid market over the next five years. It includes information on the overview of the global dental etching liquid market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the dental etching liquid market focus on dental etching liquids with syringes and those without syringes, while the segments by application target hospitals, clinics, and outpatient surgery centers. The regional segments calculate the market size of dental etching liquids by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the dental etching liquid market, product and business overviews, and sales performance.
- Company：マーケットリサーチセンター
- Price：Other
