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Etching solution Product List and Ranking from 8 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Etching solution Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. KANTO CHEMICAL CO., INC. Electronics Material Division Tokyo//Chemical
  2. Hayashi Pure Chemical Ind., Ltd. Electronic Materials Osaka//Chemical
  3. null/null
  4. 4 奥野製薬工業 大阪・放出、東京、名古屋など Osaka//Chemical
  5. 5 サンハヤト Tokyo//Resin/Plastic
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Etching solution Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Aluminum etching solution "MIXED ACID Al Etchant" KANTO CHEMICAL CO., INC. Electronics Material Division
  2. Titanium Etchant "TI Series" KANTO CHEMICAL CO., INC. Electronics Material Division
  3. Gold Etchant "AURUM Series" KANTO CHEMICAL CO., INC. Electronics Material Division
  4. SUS Roughening Etching Solution "PureEtch MF series" Hayashi Pure Chemical Ind., Ltd. Electronic Materials
  5. 4 Cu etching solution "Pure Etch C series" Hayashi Pure Chemical Ind., Ltd. Electronic Materials

Etching solution Product List

16～30 item / All 49 items

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Cr Etching Solution "Pure Etch CR series"

Cr Etching Solution "Pure Etch CR series"

We will etch the Cr film well. If you are considering the formation of fine patterns, we also offer suggestions for pretreatment solutions to improve wettability.

The features of this product are as follows: - It has minimal side etching, allowing for the formation of fine patterns. - The etching speed and in-plane uniformity of the etching shape are excellent. - It is suitable for etching of black matrix (BM) and photo masks made of chromium. Keywords: wet etching, chromium

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ITO etching solution "Clean Etch ITO series"

ITO etching solution "Clean Etch ITO series"

We provide excellent etching for ITO films, with options available for both a-ITO etching and p-ITO etching.

The features of this product are as follows: - There are no residues after etching. - It has low foaming properties and excellent defoaming capabilities. - The etching speed and the in-plane uniformity of the etching shape are good. Keywords: wet etching, indium tin oxide

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Ni Etching Solution "Pure Etch NE series"

Ni Etching Solution "Pure Etch NE series"

It etches the Ni film well.

The features of this product are as follows: - There is little side etching, allowing for the formation of fine patterns. - The etching speed and the in-plane uniformity of the etching shape are excellent. Keywords: Wet etching, nickel For roughening etching solution that processes the surface shape of Ni into a rough texture, please refer to the "Ni Roughening Etching Solution" page.

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Single crystal silicon texture etching solution

Single crystal silicon texture etching solution

We will form a texture on the single crystal silicon substrate (possible size: 2 to 3 μm).

The features of this product are as follows: - It is a one-component type that is used by adding to an alkaline solution. - It can form a TEX size of 2-3μm. - It requires a small amount of chemical solution and has a long chemical life. - It enables improvement in conversion efficiency due to the reduction of surface reflectivity after treatment. Keywords: texture formation, unevenness, single crystal Si, solar cells.

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Crystal etching liquid "Pure Etch ZE series"

Crystal etching liquid "Pure Etch ZE series"

We etch the quartz with a flatter bottom shape than conventional products without corroding the mask made of resist or metal films (such as Au and Cr).

The features of this product are as follows: - The angle difference of the taper angle in the cross-sectional shape can be reduced compared to conventional products. - The etched bottom surface can be etched more flatly than conventional products. - The uniformity of thickness is excellent. Keywords: wet etching, quartz

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Roughening etching solution

Roughening etching solution

Reduction of reflectivity, improvement of efficiency, enhancement of adhesion, roughening of silicon, compound semiconductors, and metal surfaces.

- It forms the desired unevenness. - The in-plane uniformity of the uneven shape is good.

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Cu seed layer etching solution

Cu seed layer etching solution

For the Cu plating/Cu seed structure, it etches the Cu seed layer with minimal damage to the Cu plating wiring and bumps.

The features of this product are as follows: - There is less thinning of the Cu plating. - There is less surface roughness of the Cu. - It can be applied to various seed layers (from electroless copper plating to sputtered copper). - It supports various methods such as dip, spray, and spin. Keywords: wet etching, copper, plating, seed layer, selective semi-additive method.

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Ni rough surface etching solution "Pure Etch MF series"

Ni rough surface etching solution "Pure Etch MF series"

The surface of Ni is well roughened and etched without using any special techniques.

The features of this product are as follows: - It forms the desired unevenness. - The uniformity of the uneven surface shape is good. Keywords: chemical roughening, unevenness, nickel, plating, sputtering.

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InP roughening etching solution

InP roughening etching solution

The surface of the InP film can be effectively roughened through etching, which can improve the light extraction efficiency.

The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven surface shape is excellent. Keywords: frost treatment, unevenness, LED, light-emitting diode, indium phosphide.

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Aluminum etching solution "MIXED ACID Al Etchant"

Aluminum etching solution "MIXED ACID Al Etchant"

Etching solution for Al that enables fine processing!

The "MIXED ACID Al Etchant" is an etching solution for aluminum that allows for fine processing without damaging glass or silicon substrates. It can also be used as an etching solution for molybdenum and molybdenum alloys. 【Features】 ■ No dilution or mixing required; can be used as is ■ No damage to glass, silicon substrates, etc. ■ Good in-plane uniformity of etching shapes ■ No etching residues ■ Al etching rate of approximately 1,000 Å/min (30°C)

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Gold Etchant "AURUM Series"

Gold Etchant "AURUM Series"

A gold etchant for high-precision patterning with minimal residue. Delivers excellent profiles in fine bump and wiring formation.

The "AURUM Series" is an etching solution for Au thin films that offers excellent wettability and achieves superior processing shapes in high-resolution bump and wiring formation processes, with a long liquid life. 【Features】 - Minimal etching residue, enabling high-resolution patterning - Free of cyan compounds, with excellent surface smoothness - Long liquid life, allowing for cost reduction - Excellent selectivity against dissimilar metals such as Al, Ni, Cr, and Ti - Does not damage substrates like Si and glass We offer high etching rate products for high resolution... AURUM-304: approximately 300nm/min (30℃) Low etching rate products for high resolution... AURUM-302: approximately 100nm/min (30℃) *For more details, please feel free to contact us.

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Etchant for polycrystalline transparent conductive films "ITO Series"

Etchant for polycrystalline transparent conductive films "ITO Series"

Low-resistance polycrystalline ITO film etchant – Cu damage suppression depending on model number

"Mixed Acid ITO-02" is an etching solution that enables high-precision patterning of low-resistance poly-ITO electrodes in the FPD manufacturing process. Additionally, "ITO-301" is an etching solution that suppresses Cu damage and allows for the patterned formation of low-resistance poly-ITO electrodes. 【Features】 ■ Usable for etching low-resistance poly-ITO films ■ Capable of etching poly-ITO films and amorphous ITO films at low temperatures and in a short time ■ No damage to glass substrates ■ Cu damage can be suppressed depending on the model number ■ No dilution or formulation is required; it can be used as is

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Copper etching solution "GHP-3" "BTF-3"

Copper etching solution "GHP-3" "BTF-3"

Smooth finish, minimal change in Cu surface roughness.

It is suitable for etching Cu/Ti seed layers after Cu plating, and it is also possible to etch Cu and Ti simultaneously. Additionally, it has a minimal impact on transmission loss as it does not compromise the smoothness of the Cu surface. 【Features】 ■ The smoothness before etching is not compromised ■ Minimal shape change due to over-etching *For more details, please feel free to contact us.

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Chromium etchant "Cr Series"

Chromium etchant "Cr Series"

Chromium etchant with minimal side etching during patterning.

Etchant suitable for electrode materials such as crystal oscillators and MEMS sensors, as well as for Cr thin films used in photomasks. 【Features】 ■ Enables patterning with minimal side etching ■ Cr-301 is suitable for adjusting the thickness of Cr films due to its extremely low etching rate. *For more details, please feel free to contact us.

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