The sale of the appearance inspection device "AURCA series," which supports RDL defect inspection, bump defect inspection, and TSV defect inspection, has begun!
The AURCA series is a next-generation 2D appearance inspection system that combines full-color high-speed scanning with AI technology, compatible with wafers and panels. It features full-color line scanning and an autofocus mechanism, integrating conventional image processing (CV) with AI algorithms. In mass production lines, it simultaneously achieves high detection rates, low false detection, and high-speed processing.
■ Features
- Full-color high-speed line scanning
- Equipped with an autofocus mechanism (prevents blurriness due to warping)
- Integrated detection of AI and conventional algorithms (hybrid inspection)
- Minimizes miss rate and excessive detection rate to the extreme
- Automatic classification and quantitative measurement of defects (length, width, area, position)
- Reduces inspection time by over 30% (supports high throughput mass production)
■ Example Inspection Items
- RDL defect inspection: open, short, notch, metal residue, CD variation
- Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment
- TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations
- Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots