Introduction to Extrusion Molding Technology in Q&A Format
★What is the difference between crystalline plastics and amorphous plastics? What is interlayer adhesion in co-extrusion? ★What is a T-die? What is a circular die?
Lecturer Chair Researcher, Packaging Science Research Institute, Dr. Yoshihiko Kuzu (Formerly of Toyo Seikan Co., Ltd.) Target Audience: Engineers interested in molding technology, technical sales departments, technical management departments, etc. Venue: Scheduled to be held in Tokyo (Nihonbashi) Access: 4 minutes from Exit B3 of Higashi-Nihonbashi Station on the Toei Asakusa Line, towards Asakusabashi/ Oshiage Date and Time: December 16, 2011 (Friday) 10:30 AM - 4:30 PM Capacity: 30 participants. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for 2 participants from one company. *Limited to Tech-Zone members who apply by December 2. Membership registration is free. *After December 2, the [Regular Price] will be 49,350 yen (tax included, including text costs) per participant.
- Company:AndTech
- Price:10,000 yen-100,000 yen