Low-phosphorus electroless nickel plating without sulfur-based additives.
Sulfur (sulfur) free! It has become possible to maintain long-term solder wettability, which has been a concern until now.
By achieving "no use of sulfur-based additives," which was not possible with conventional low-phosphorus electroless Ni-P plating, it has become possible to maintain the long-term wettability of solder, which has been a bottleneck until now. Due to its excellent uniformity in film thickness, plating can be performed without variation even on shapes such as heat sink fins. 【Features】 - The phosphorus (P) content of the Ni coating is low at 2-4 wt%, resulting in minimal "nickel consumption" during solder joining, enabling highly reliable solder joints. - Since sulfur-based additives are not used, it can maintain long-term wettability of solder, and the resulting plating film has excellent discoloration resistance and acid resistance. - A high hardness coating of Hv680 can be obtained without post-plating heat treatment, providing excellent wear resistance. *For more details, please refer to the PDF document or feel free to contact us.
- Company:エプテック
- Price:Other