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Polishing Machine Product List and Ranking from 249 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. 松田精機 Hyogo//Manufacturing and processing contract
  2. 田中インポートグループ Osaka//others
  3. アイエムティー Wakayama//Testing, Analysis and Measurement
  4. 4 フジミインコーポレーテッド Gifu//Electronic Components and Semiconductors
  5. 5 チップトン Aichi//Manufacturing and processing contract
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Polishing Machine Product ranking

Last Updated： Aggregation Period:Feb 25, 2026～Mar 24, 2026
This ranking is based on the number of page views on our site.

  1. Belt Grinder "Bader Machine" 松田精機
  2. "Improved drill sharpness" Comprehensive catalog of automatic drill sharpening machines available. 田中インポートグループ
  3. Manual Sample Grinder "IM-P2" [Made in Japan] アイエムティー
  4. 4 Portable and lightweight side belt sander "SBD-4S" 松田精機
  5. 5 Drill Grinder "PT-01N" 田中インポートグループ

Polishing Machine Product List

481～510 item / All 796 items

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NC High-Precision Centerless Grinding Machine PM-160

NC High-Precision Centerless Grinding Machine PM-160

* Touch panel / Digitalization of all processing conditions / Memory / High reproducibility * Fully NC / Ultra high rigidity, high precision, versatile machine

* NC High-Precision Centerless Grinding Machine Manual Type PM Series PM-80/-100/-120/-160/-200/-300 Select based on lens diameter and processing radius... A comprehensive lineup Product introduction: PM-160 Features... Direct grinding creation of lens spherical surfaces using dish-shaped grinding wheels / Efficient grinding * Additional Specifications - DS = Direct Smoothing Method - CS = Cup Hole Smoothing Method - AC = Auto Centering Smoothing Method - PP = High-Speed Compression Grinding Method - VP = Optical Axis Automatic Centering Grinding Method

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NC/High Precision Centerless Grinding Device PM-8F

NC/High Precision Centerless Grinding Device PM-8F

* Touch panel / Digitalization of all processing conditions / Memory / High reproducibility * Fully NC / Ultra high rigidity, high precision, versatile machine

* NC High-Precision Centerless Grinding Machine Manual Type PM Series PM-8F-2P PM-8F-4P Product introduction: PM-8F-4P Features… Direct grinding creation of lens spherical surfaces using dish-shaped grinding wheels / efficient grinding * Additional specifications - DS = Direct Smoothing Method - CS = Cup Hole Smoothing - VS = Vacuum Centering Smoothing Method - PP = High-Speed Compression Grinding Method - VP = Optical Axis Automatic Centering Grinding Method

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  • Polishing Machine

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NC Fully Automatic Grinding Specification Model Line

NC Fully Automatic Grinding Specification Model Line

Easy operation with a touch panel! Model line for multi-axis management with a small number of people, "Auto Hand Loading."

We would like to introduce the "Model Line" of multi-axis management "Auto Hand Loading" by a small number of people. With simple operation via a touch panel, it can handle everything from supplying cleaning baskets to polishing, scrubbing, and storing cleaning baskets. Additionally, we have obtained international patents in Japan, Taiwan, South Korea, China, the United States, and Europe. 【Components】 ■(1) XY Supply Device "XY-2X5 Type" ■(2) NC Fully Automatic Polishing Device "APM-8FO-2P-L Type (2 Axes)" ■(3) Scrubbing Cleaning Device "KW-80-L Type" ■(4) Finished Product Storage Stocker "XY-2X5W-L Type" *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Kanzashi Unit

Kanzashi Unit

We offer a variety of products with lightweight rotating diaphragm packing specifications, high durability structures, and high rigidity types.

At Kojima Engineering, we handle the "Kanzashi Unit." We offer a wide range of products, including the "Koma-style Kanzashi V-20/25 type," which excels in polishing medium to large diameter lenses ranging from 30φ to 160φ and direct smoothing processing, as well as the "HC-1 type (shaft diameter 8φ), HC-2 type, and HC-3 type (shaft diameter 6φ)" that rotate smoothly without sliding resistance from the packing, along with the "HE-9 type, HE-11 type, and HE-22 type." You can choose according to your needs. 【Partial Lineup】 ■ V-20/25 type (Koma-style) ■ SWA-20/25 type, SWB-20/25 type (lightweight) ■ G type, GD type ■ HC-1 type, HC-2 type, HC-3 type ■ HE-9 type, HE-11 type, HE-22 type, etc. *For more details, please refer to the PDF document or feel free to contact us.

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CNC Controlled Single-Pass Polishing Machine Solution K850

CNC Controlled Single-Pass Polishing Machine Solution K850

Grinding, tooth cutting, and chamfering of metal saws.

The K850 is a fully automatic CNC-controlled grinding machine equipped with movable axes that include two servo drive axes, and it grinds special tooth shapes with outer diameters ranging from 40 to 850 mm, such as metal saws, solid saws, and friction saws.

  • Other processing machines
  • Polishing Machine

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Multi-purpose chip saw sharpener 'CHX840/CHX1300'

Multi-purpose chip saw sharpener 'CHX840/CHX1300'

Achieve high processing quality, very short setup times, and excellent productivity!

The "CHX840/CHX1300" is a versatile saw blade sharpening machine equipped with double grinding wheels. It has a small footprint and is easy for operators to use, allowing for quick and reliable operation through a 10-inch LCD color display and multifunction handwheel. Additionally, its highly stable structure eliminates vibrations during operation, ensuring high-quality finishes. 【Features】 ■ Compact design ■ Innovative control panel ■ Large viewing window ■ Full cover included as standard ■ Robust construction *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Other machine tools
  • Wafer processing/polishing equipment
  • Polishing Machine

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Universal Super Hard Tipped Saw Blade Grinder CHP840 / CHP1300

Universal Super Hard Tipped Saw Blade Grinder CHP840 / CHP1300

Freely process saw blades with an outer diameter of 80mm to a maximum of 1300mm. It demonstrates high efficiency not only for woodworking and aluminum but also for metal.

The CHP series can be universally used in various fields such as wood, aluminum, plastic, and metal for tasks like sawing, polishing, and small-scale production, thanks to its high variability and functionality. With 4-axis CNC control, it can process all common tooth shapes, including saws with lead angles and combination teeth, in a single operation. Standard oscillation polishing is possible, allowing for significant cutting volume to be achieved in one process, especially for saws that have undergone tooth repairs. Motor-driven adjustments for squaring angles and tip relief angles enable quick switching between squaring and tip operations. Optimal motion control reduces polishing and changeover times. It operates without any hydraulic systems, resulting in minimal maintenance effort. Automatic centralized lubrication, which reduces maintenance effort, is included as standard equipment.

  • Grinding Machine
  • Polishing Machine

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Universal Super Hard Tipped Saw Blade Sharpener CHC840 / CHC1300

Universal Super Hard Tipped Saw Blade Sharpener CHC840 / CHC1300

Freely process saw blades with an outer diameter of 80mm to a maximum of 1300mm, demonstrating high efficiency for woodworking.

The CHPC series can be universally used in the fields of saw blade manufacturing, grinding, and small-scale production for aluminum, plastic, and various types of wood, thanks to its four CNC-controlled axes. - It can process all common tooth shapes, including saws with lead angles and combination teeth, in a single operation. - Oscillation grinding is possible as standard, allowing for significant material removal in one operation, especially for saws that have undergone tooth repairs. - Quick switching between squaring and tip angles is enabled by motor-driven adjustments. - Optimal motion control reduces grinding and changeover times. - It operates without any hydraulic systems, resulting in minimal maintenance effort. - Automatic centralized lubrication, which reduces maintenance effort, is included as standard equipment.

  • Grinding Machine
  • Polishing Machine

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Universal Super Hard Saw Blade Sharpener CP650

Universal Super Hard Saw Blade Sharpener CP650

Freely process saw blades with an outer diameter of 80mm to 650mm, demonstrating high efficiency for woodworking.

The CHPC series can be universally used in the fields of saw blade manufacturing, grinding, and small-scale production for aluminum, plastic, and various types of wood, thanks to its four CNC-controlled axes. - It can process all common tooth shapes, including saws with lead angles and combination teeth, in a single operation. - Standard oscillation grinding is possible, allowing for significant cutting volume to be achieved in one operation, especially for saws that have undergone tooth repairs. - Quick switching between squaring and tip angles is enabled by motor-driven adjustments. - Optimal motion control reduces grinding and changeover times. - It requires no hydraulic systems, resulting in minimal maintenance effort. - Automatic centralized lubrication, which reduces maintenance effort, is included as standard equipment.

  • Grinding Machine
  • Polishing Machine

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Ultra-hard chip saw side grinding machine CPF650

Ultra-hard chip saw side grinding machine CPF650

Freely process the sides of chip saws with an outer diameter of 80mm to 650mm.

The CPF650 is a CNC 5-axis controlled carbide tipped saw side processing machine. It can process many tooth shapes, including inclined teeth and combination teeth, in a single operation. - It automatically sets angles, including the squareness angle, and recognizes pitch automatically. - Standard oscillation grinding is possible, allowing for significant cutting volume in a single operation for saws that have undergone tooth repairs. - It offers flexibility with the option to install auxiliary feeding claws, particularly accommodating pitches up to 180 mm for lumber processing. - Fully automatic processing of one side of conical skimming saws is also possible. - It requires no hydraulic use, resulting in minimal maintenance effort. - Automatic centralized lubrication, which reduces maintenance effort, is included as standard equipment.

  • Grinding Machine
  • Polishing Machine

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Automatic Polishing Machine "Ecomet 30"

Automatic Polishing Machine "Ecomet 30"

Save cleaning time! The durable die-cast body provides robustness and stability.

The "Ecomet 30" is an automatic grinding machine with dimensions W488×D638×H650mm, designed to simplify everyday grinding tasks. Its straight drainage system minimizes the accumulation of grinding debris, saving cleaning time. The grinding wheel can be easily removed for cleaning, helping to prevent contamination. Additionally, the durable die-cast body provides robustness and stability. 【Features】 ■ Simplifies everyday grinding tasks ■ Easy to clean ■ Excellent design ■ Can be linked with burst (up to 3 units) ■ Stores 5 different parameters *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Automatic Polishing Machine "Automet 250"

Automatic Polishing Machine "Automet 250"

Introducing an automatic polishing machine with a total weight of 77kg, available with an optional splash kit and lid!

The "Automat 250" is an automatic polishing machine with a head output of 0.156Hp (116W). Its dimensions are W508 × D620 × H699mm, and the control panel (membrane) features an LED display (3-digit display). Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Power supply: 100-240VAC, 50/60Hz single phase, 200V recommended ■ Polishing wheel motor output: 1Hp (750W) ■ Polishing wheel dimensions: 8 inches (203mm), 10 inches (254mm) ■ Polishing wheel rotation speed: 10-500rpm adjustable in 10rpm increments with up/down keys ■ Polishing rotation direction: clockwise/counterclockwise *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Ski grinding machine

Ski grinding machine

The squeegee used for pushing paste in a screen printing machine is a very important consumable part at the end of the process that determines printing accuracy.

The shape of the tip of the squeegee involved in printing is one of the factors that greatly affects the accuracy of film thickness, line width formation, and the transmitted volume of the designed screen mask. Additionally, depending on the condition of the squeegee, it can lead to issues such as bleeding, paste splatter, screen mask lifespan, insufficient paste release, and screen mask clogging. Our squeegee grinding machine takes all of these factors into consideration, allowing for a grinding surface that is close to ideal with a grinding wheel, while minimizing the occurrence of foreign substances and other issues.

  • Printing Machinery
  • Wafer processing/polishing equipment
  • Polishing Machine

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Grinding device, double-sided grinding machine MS6B-6L・P

Grinding device, double-sided grinding machine MS6B-6L・P

A lapping and polishing device with a variety of functions ranging from flat grinding to spherical grinding.

The use of low-friction cylinders for the pressing force on the upper platen has enabled low-weight control. Additionally, the rotation speeds of the platen, internal gear, and sun gear can now be controlled thanks to the adoption of an inverter. It is possible to set up to 7 levels of polishing processing conditions (time: minutes, rotation speed: RPM, weight pressure: Kg) and continuous operation is feasible.

  • Stone Processing Machinery
  • Polishing Machine

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High-precision ball lens polishing device Ext-1B-0606-6P/L

High-precision ball lens polishing device Ext-1B-0606-6P/L

We can polish ball lenses with micron-level precision.

The high-precision ball lens polishing device Ext-1B-0606-6P/L can polish micro ball lenses and preform ball lenses related to communication and video with micron-level precision. It is possible to control the load from the upper table in a low-load manner using a pulley system. For more details, please contact us or download the catalog.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Brooch Polishing Machine TKG

Brooch Polishing Machine TKG

Re-polishing of treasure brooches is now possible in-house!

We have made it possible to miniaturize and reduce costs by limiting the grinding surface to the 'Heaven Blade No. 2 escape surface' (with an escape angle of 3 degrees) necessary for re-polishing the jewel brooch, and by making all axis movements manual.

  • Grinding Machine
  • Polishing Machine

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Vertical Single-Sided Precision Grinding Machine SW-300

Vertical Single-Sided Precision Grinding Machine SW-300

There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!

Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.

  • Special Processing Machinery
  • Polishing Machine

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Yozuka Industries Flap Wheel

Yozuka Industries Flap Wheel

It has excellent sharpness with long life and is also suitable for heavy grinding.

The "CROWN" disc has a long life and exceptional cutting performance, and it is also suitable for heavy grinding. The "Crown flap wheel" adapts well to any processing surface and maintains a consistent roughness of the grinding surface without clogging due to moderate wear, allowing for extended continuous operation.

  • Grinding Machine
  • Polishing Machine

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Precision grinding contract processing - Silicon and glass processing

Precision grinding contract processing - Silicon and glass processing

Due to being in the research and development stage, there is not enough quantity to consider processing equipment!! In such cases, please feel free to contact us!

With the diverse processing know-how accumulated by our company, we respond to all technical needs ranging from lap and polish processing, double-sided processing, edge processing, deposition, cutting, etc. We can accommodate processing quantities starting from just one unit, so please feel free to contact us.

  • Casting Machine
  • Polishing Machine

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Tabletop Grinder TR15M

Tabletop Grinder TR15M

A standard tabletop polishing device that meets a wide range of requirements from research and development to production.

The TR15M tabletop grinding machine is a standard tabletop grinding device that meets a wide range of requirements from research and development to production. With a variety of options available, it can be customized to accommodate a wide range of applications, from lapping processes for glass, metal, and ceramics to polishing and CMP processes. For more details, please download the catalog or contact us.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Abrasive (grinding powder) fused alumina/white fused alumina, etc.

Abrasive (grinding powder) fused alumina/white fused alumina, etc.

We will propose the most suitable abrasive material according to your company's usage purposes.

Grinding micro powder A (fused alumina) is a representative artificial abrasive material made by melting alumina ore in an electric furnace. Grinding micro powder WA (white fused alumina) is also a representative artificial abrasive material made by melting in an electric furnace, similar to material A. Grinding micro powder KOA has fused alumina as its main component, and appears as a brown powder that is very tough. Grinding micro powder GC (green silicon carbide) is a representative artificial abrasive material made by firing quartz and coke in an electric furnace. Grinding micro powder CeO2 (cerium oxide) is a typical abrasive used for glass polishing, with various processing targets including flat glass, glass ornaments, quartz, lenses, and photomasks. ● For more details, please download the catalog or contact us.

  • others
  • Polishing Machine

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Chemical polishing device

Chemical polishing device

Equipped with a function to adjust the swing angle! It can maintain an even spray balance!

The "Chemical Polishing Device" is a product that roughens the surface of copper foil to improve the adhesion of laminates. The spray nozzle pipe can be switched between vertical and horizontal arrangements, allowing it to accommodate various product conditions. The oscillation of the chemical polishing section is equipped with a function to adjust the angle of the swing, in addition to speed adjustment through electric control, enabling the spray balance to be maintained evenly. 【Features】 ■ Renders the surface of copper foil rougher to enhance laminate adhesion ■ Accommodates various product conditions ■ The spray nozzle pipe can be switched between vertical and horizontal arrangements *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other surface treatment equipment
  • Polishing Machine

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Multi-stage finishing by a film-type NC super finishing machine super finisher.

Multi-stage finishing by a film-type NC super finishing machine super finisher.

Stable achievement of finishing surface precision below Rz0.8μ (Ra0.2μ) ■Industry: Automotive (prototype) / Semiconductor / Robotics

The film is retractable, allowing for continuous exposure of a new surface during polishing, achieving a finishing surface accuracy of Rz0.8μ (Ra0.2μ) or less consistently. Additionally, it can flexibly accommodate a variety of products through programming. 【Main Usage Examples】 Polishing of automotive parts (such as AT transmissions and shock absorbers) Polishing of crankshaft, camshaft, and seat surfaces of hydraulic and pneumatic valves Finishing polishing of painting rollers for printers and similar equipment Precision polishing of rollers for paper and film manufacturing and printing *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • Processing Contract
  • Polishing Machine

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Flap Wheel "KF Wheel" [Excellent Flexibility & Uniform Finish]

Flap Wheel "KF Wheel" [Excellent Flexibility & Uniform Finish]

Achieves good flexibility and a uniform finish! General flap wheel.

■For catalog downloads and inquiries, please visit the following URL and click on [Request Materials Here]. http://www.koyo-sha.co.jp/ KF wheels have a long product life and a consistent surface roughness, making them easy to automate. The air cooling effect helps to prevent burning of the workpiece while providing good "familiarity" with the shape, allowing for curved surface polishing. <Features> ■Moderate wear prevents clogging. ■Can be used as a substitute for emery buffs. ■Long product life and consistent surface roughness make automation easy. ■The air cooling effect helps to prevent burning of the workpiece. ■Good "familiarity" with the shape of the workpiece allows for easy curved surface polishing. ■Designed for dry use, offering great flexibility and achieving a more uniform finish. <Type-Specific Performance> ・DAK... A general type with a uniform finish that is easy to connect to the next process (for dry use). ・YWK... Performance that is intermediate between standard wheels and resin-bonded polishing cloth wheels (for dry use).

  • Other cutting tools
  • Polishing Machine

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"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Polishing Machine

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Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly

Presentation of Materials: Comprehensive Catalog of Grinding Machines for Integrated Production from Design to Assembly

We respond to our customers' needs with a consistent production system that encompasses everything from design to assembly, with meticulous attention and a sense of speed.

IMT Corporation is a precision grinding equipment manufacturer headquartered in Wakayama. We previously had sales offices in Tokyo, Osaka, and Nagoya, but we have now decided to finally expand into Kyushu. Our company has been providing production equipment for the semiconductor and liquid crystal panel industries, as well as equipment for preparing materials for microscopic observation, for many years. Through our "domestic sample grinding machines" and "consumables for microscope sample preparation and grinding materials," we will consult on our customers' quality assurance operations. 【Features】 - Consistent support: A unified production system from design to assembly in-house - Speedy response: Detailed and prompt support *For more details, please download the materials or contact us directly.

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  • IMT　サブ１.png
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  • Wafer processing/polishing equipment
  • Polishing Machine

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Sample Grinding Machine 2-Stage Grinder "Eo2" [Made in Japan]

Sample Grinding Machine 2-Stage Grinder "Eo2" [Made in Japan]

High torque! Low price! Cute logo! A dual machine with triple grinding capabilities!

The "Eo2" is a two-disk device specifically designed for hand polishing. It features a table height that makes hand polishing easy, allowing for comfortable work. It is equipped with a motor that delivers strong torque even at high speeds and low ranges. It comes with two water supply taps and a drainage hose at the back. 【Disc Sizes】 ○ Polishing Disc: Φ223mm or Φ200mm ○ AL Polishing Disc: Φ200mm ○ Magnetic Surface Disc: Φ200mm For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Polishing Machine

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Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan]

Sample Grinding Machine Individual Load Type 'Rana-3' [Made in Japan]

Adopts an individual loading method! It is a sample polishing machine that allows grinding without losing parallelism.

The "Rana-3" adopts an individual load method and is a sample polishing machine that allows for the free setting of 1 to 6 samples. Since it is possible to change the holder rotation speed, the holder and disk can be polished at the same rotation speed, preventing the polishing surface from tilting or becoming pencil-shaped. Both the holder and disk can rotate in both forward and reverse directions. 【Features】 ○ Grinding can be performed without losing parallelism ○ Automatic increase and decrease of pressing force up to the set seconds ○ Three-stage variable polishing conditions (pressure/rotation speed) ○ Memory for 16 polishing conditions For more details, please contact us or download the catalog.

  • Other physicochemical equipment
  • Polishing Machine

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Surface grinding machine "Cyrex-G" with grinding stone.

Surface grinding machine "Cyrex-G" with grinding stone.

The grinding machine features an automatic dressing function for the grinding wheel, with a rotation speed of 800 to 1700 rpm!

We would like to introduce our surface grinding machine, 'Cyrex-G', which uses grinding wheels. It comes with a safety cover that protects the body from high-speed rotating objects, and the holder rotation speed ranges from 60 to 200 rpm. Additionally, it features a 50L tank for circulating cooling water. IMT, although small in scale, responds to customer requests with a consistent and meticulous "manufacturing" system and a sense of speed. 【Specifications (partial)】 ■ Power supply: Three-phase 200-220V 50/60Hz ■ Air: Requires an air source of 0.5MPa or more ■ Holder rotation speed: 60-200 rpm ■ Maximum sample holder diameter: φ200mm ■ Grinding wheel rotation speed: 800-1700 rpm *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment
  • Polishing Machine

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[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

I'm graduating from hand polishing!

Every day after joining the company, I receive strict guidance on hand polishing from my supervisor. It's difficult to grind parallel, and it takes a whole day to finish just one piece. Colleagues from other departments often ask, "Why is that new employee standing there all day?" It's a bit tough... One day, I searched for sample polishing on Ipros and found IMT, which ranked first in the search results. When I requested information, a cheerful and friendly salesman came to see me right away and offered to help. He introduced me to the IM-P2 and SP-L1, providing detailed explanations. (For uses not listed in the catalog, please inquire.) I convinced my supervisor and got permission to conduct a demo of the IM-P2/SP-L1. [To be continued in the next part]

  • Wafer processing/polishing equipment
  • Polishing Machine

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