Single-chamber vacuum reflow device 'NRY-703WSZ/VA'
Void processing for power module metal substrate reflow is possible!
The "NRY-703WSZ/VA" is a single-chamber (1 zone) vacuum reflow device capable of preheating, heating, and cooling in a single chamber. Thanks to the floating gas extraction heating (Patent No. 5576577), thermal processing can be performed without the influence of warping or bending. Additionally, by injecting nitrogen, reflow soldering and bump formation can be achieved with an oxygen concentration of less than 10 ppm. 【Features】 ■ Void treatment during the formation of solder bumps on wafers ■ By reducing the chamber pressure during solder melting, void removal is possible ■ Supports automatic inline integration by connecting with the entrance conveyor (standard equipment) *For more details, please download the PDF or contact us.
- Company：大和製作所
- Price：Other
