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Report: Intel 22nm Haswell eDRAM

Report: Intel 22nm Haswell eDRAM

This is a detailed structural analysis report of Intel(R) eDRAM.

The "Intel(R) 22nm Haswell eDRAM" is a detailed structural analysis report on Intel(R) eDRAM, which is embedded DRAM corresponding to the Haswell G82494 processor equipped with the Intel GT3 graphics unit (GPU). This integrated graphics unit has various features, including low-end GT1, mid-range GT2, and high-end GT3. The version with the best performance among GPU ICs is GT3e. 【Features】 ■ GT3e: Composed of embedded DRAM with 9 metal layers and 22nm TriGate transistor technology ■ Silicon source-drain is used for NMOS transistors, while SiGe is used for PMOS transistors For more details, please contact us or download the catalog.

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Report: Comparison Report on Samsung Memory Cell Processes

Report: Comparison Report on Samsung Memory Cell Processes

This is a report comparing the cell configurations of 20nm class DRAM and 0nm class 2Gb DDR3 DRAM.

This is a reconstruction of the structural analysis of the "Samsung 20nm class 3GB (6x4Gbit) LPDDR3." The main purpose is to compare the cell configurations of the 20nm class DRAM with its predecessor, the 30nm class 2Gb DDR3 DRAM (the 20nm class is simply designated as "2X nm"). 【Features】 ■ Chip using six 2X nm class 4GB ■ Symmetrical configuration of two sets of three chip stacks within one package ■ Package thickness: 0.8mm with six die configuration For more details, please download the catalog or contact us.

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Report 20 nm HKMG Qualcomm

Report 20 nm HKMG Qualcomm

Detailed structural analysis of the Gobi MDM9235 modem logic

This report is a detailed structural analysis (LDSA) of the 20nm node Qualcomm MDM9235 modem. The MDM9235 is Qualcomm's first modem manufactured using a 20nm CMOS process and is part of the 4th generation Qualcomm Gobi 9x35 series modems. The MDM9235 is paired with the Qualcomm Snapdragon 805 application processor to support 4G LTE-A Cat. 6 data rates (301.5 Mbps) and 4K video content. 【Features】 ○ Understanding key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

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Samsung 3D V-NAND Structure Analysis Report

Samsung 3D V-NAND Structure Analysis Report

This is a structural analysis report of Samsung 3D V-NAND.

This report is a Memory Detailed Structural Analysis (MDSA) of the K9HQGY8S5M 3D V-NAND flash memory. The K9HQGY8S5M is the industry’s first implementation of a 32 cell vertical NAND memory and marks the departure from conventional planar flash memories. 【Features】 ○ Understand key design and manufacturing innovations ○ Make informed technical resource investment decisions ○ Find Evidence of Use For more details, please contact us or download the catalog. *This catalog is in English.

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Cutting-edge 20nm class logic device process comparison report

Cutting-edge 20nm class logic device process comparison report

Seven cutting-edge logic devices manufactured by Intel, TSMC, and Samsung.

This report is a process comparison of seven advanced 20nm-class logic devices manufactured by Intel, TSMC, and Samsung. It discusses the structures and materials used in the manufacturing of core logic transistors, I/O transistors, metallization, and SRAM layout. [Features] - Understanding key design and manufacturing innovations - Informed decision-making for technology resource investments - Support for IP activities through valuable "Evidence of Use (EoU)" information For more details, please contact us or download the catalog.

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BMW i3 Onboard Detailed Report

BMW i3 Onboard Detailed Report

Disassembly and cost analysis of all electronic circuit boards mounted in the vehicle.

Just by looking at this document, it is possible to understand what products are installed in the vehicle, and it can be used as a marketing and sales promotion tool.

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Detailed teardown report that reveals the analysis of products and parts.

Detailed teardown report that reveals the analysis of products and parts.

Ideal for when you want to know about product development or other companies' designs! You can quickly research using the largest data library instead of analyzing it in-house.

TechInsights' tear-downs provide deep insights into the technological and cost factors that impact product design and the related supply chain. Tear-down reports for major market products such as mobile devices, medical equipment, and digital home products are available individually or through licensing agreements. Various manufacturers utilize our tear-downs to obtain information such as the following: 【Examples of Use by Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Examples of Use by Semiconductor/Component Suppliers】 - Potential for sockets - Trends in component integration - Trends in packaging - Competitive threats 【Examples of Use by Intellectual Property Stakeholders】 - Verification of design wins - Tracking of target claims - Market sizing for relevant products and technologies (Custom tear-downs tailored to meet unique customer needs are also available.) *For more details, please download the catalog or contact us.

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Waveform Analysis Report of Samsung 21nm TLC NAND

Waveform Analysis Report of Samsung 21nm TLC NAND

To those involved in device design and development! This is an analysis report on Samsung's NAND flash. It explains the important signal operations during device operation!

This is a report on waveform analysis of Samsung's 64 Gbit 21 nm TLC NAND flash from Semiconductor Insights Japan, a leading company in integrated circuit and electronic system technology and patent analysis. This waveform analysis describes the signal behavior of key signals when the device operates in several different standard operating modes. The analyzed component is Samsung's 21nm NAND Flash, where a microprobe was placed on the metal signal line part to operate the device and record the vibration behavior. 【Samsung 21nm NAND Flash】 ○ Used in Samsung's latest solid-state drives 【Observed Signals】 ○ Global word line ○ Bit line ○ P-well isolation ○ Global string select ○ Global ground select, etc. For more details, please download the catalog or contact us.

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Report: ValleyView Atom Z3740 SoC

Report: ValleyView Atom Z3740 SoC

Detailed structural analysis report of the Intel Atom 23740 processor.

The "Intel(R) 22nm ValleyView Atom(TM) Z3740 SoC" is a detailed structural analysis report of the Intel Atom 23740 processor. The 24740 is designed for Windows and Android tablets and is a power-efficient quad-core SoC. This SoC operates at a clock speed of 1.33GHz and is based on the Intel Bay Trail-Silvermont architecture. 【Features】 ■ The 23740 is manufactured using a 9-layer metal, dual-gate dielectric, 22nm SoC process. ■ Device: HKMG FinFET transistors with a minimum pitch of 90nm. ■ Silicon diffusion layer section: Used for NMOS transistors, while SiGe is used for PMOS transistors. For more details, please contact us or download the catalog.

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Memory Structure Analysis Report "SK Hynix 16 nm"

Memory Structure Analysis Report "SK Hynix 16 nm"

Detailed Memory Structure Analysis Report of Flash Memory

This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS (16 GB, 16nm node MLC NAND flash memory) used in the Apple iPhone 6 Plus smartphone. The device is manufactured using a three-layer metal structure process (1st and 2nd metal layers: W, 3rd metal layer: Al), polysilicon control gates, and polysilicon floating gates. The memory array features a bit line pitch of 32nm and a word line pitch of 38nm. An air gap is employed to reduce crosstalk between adjacent cells. [Features] ○ Understanding of key design and manufacturing innovations ○ Informed technical resource investment decisions based on appropriate information For more details, please contact us or download the catalog.

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Report: "Intel 14 nm M5Y70 Processor"

Report: "Intel 14 nm M5Y70 Processor"

Logic Detailed Structure Analysis Report, Transistor Characteristics Report

At TechInsights, we collaborate with client companies to address their intellectual property rights and technology requirements. We assist you in monetizing your patent portfolio, protecting your patent positioning, safeguarding market share, and acquiring information on competing products. **Features** - Understanding key design and manufacturing innovations - Data-driven decision-making for technology resource investments - Valuable Evidence of Use (EoU) - Support for IP activities through information For more details, please contact us or download the catalog.

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iPhone 6S Disassembly Investigation Report

iPhone 6S Disassembly Investigation Report

The iPhone 6S from Apple, which has added new features.

The touchpad function of mobile phones, which has traditionally been used by long-pressing the touch panel, has been enhanced by Apple by adding new features through the application of pressure. What happens when you press harder? Traditionally, it was possible to achieve a similar effect through software on a capacitive touchpad panel, but there was a technological barrier since merely changing the capacitance of the electrostatic field was not enough. A report clarifying this will be released by Tech Insights.

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Mobile phone, Teardown report campaign

Mobile phone, Teardown report campaign

Selling the latest Dear Down report at a low price in a bundle.

1. Apple products, iPhone (5, 5S, 5C, 6, 6 Plus, & 6s and 6s Plus) 2. Major mobile phone manufacturers, iPhone 6, 6s, 6 Plus, 6s Plus & Samsung Galaxy S5, S6, S6 Edge, Note 5 Both 1 and 2 will be available for $10,000 each. This is a campaign until December 2015.

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Intellectual Property Solutions Tech Insights

Intellectual Property Solutions Tech Insights

Tech Insights provides a wide range of technology information and intellectual property solutions.

Tech Insights supports patent-holding companies in creating, managing, and utilizing their patent portfolios to achieve business goals. We conduct structured portfolio structuring and patent analysis using a systematic approach to identify the potential of patents. The data generated through this process enables fact-based decision-making regarding patent applications, disposals, sales, purchases, and litigation strategies. We offer solutions and services to maximize the value of our clients' intellectual property. 【Intellectual Property Services】 ■ Patent Landscape ■ Patent Strengthening ■ Patent Research ■ Prior Art Search ■ Infringement Evidence ■ Portfolio Evaluation ■ Patent Transaction Services *For more details, please refer to the PDF materials or feel free to contact us.

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Detailed teardown report that provides insights into the products and components.

Detailed teardown report that provides insights into the products and components.

Currently offering sample reports that provide insights into the design of other companies during the development of medical device products!

TechInsights' teardown services are trusted by client companies in sectors such as mobile, consumer electronics, and medical devices for technology and intellectual property portfolio evaluation and management, acceleration of time-to-market, risk reduction, provision of competitive intelligence, and maximization of ROI. Various manufacturers utilize our teardown services to obtain information such as the following: 【Use Cases for Product Manufacturers】 - Design choices made by competitors - Emerging/leading component suppliers - Key cost factors behind new product features - Competitive advantages of new entrants in the international market 【Use Cases for Semiconductor/Component Suppliers】 - Potential of sockets - Trends in component integration - Trends in packaging - Competitive threats 【Use Cases for Intellectual Property Stakeholders】 - Verification of design wins - Tracking of assertion targets - Market sizing for the relevant products and technologies (Custom teardowns tailored to meet specific customer needs are also available.) *For more details, please download the catalog or contact us.

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