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Resin(frp) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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Resin Product List

46～60 item / All 87 items

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"Supreme" CFRP matrix resin

"Supreme" CFRP matrix resin

Due to its high heat resistance and good moldability, it is ideal for CFRP matrix resins.

We will introduce examples of molding and processing using Suprem's CFRP (carbon fiber composite material) matrix resin. Molding and processing into UD tapes, prepregs, and films as alternatives to super engineering plastics such as PEEK and PEKK. This new material offers high strength and high heat resistance, making it suitable for metal replacement. It can be applied to sensor components in automobiles and industrial machinery. 【Features】 ■ Excellent moldability (secondary processability) ■ High heat resistance (up to 150°C), long-term heat resistance (up to 200°C) ■ High strength, flame retardant ■ Good appearance even after crystallization ■ Low dielectric, high electromagnetic shielding properties ⇒ Suitable for antenna and radar components *For more details, please refer to the PDF materials or feel free to contact us.

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Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.

Improved toughness, enhanced sliding properties, and low dielectric effects from various powder additives! Introduction to powder filler applications.

Introducing the powder filler application of Therplim (filler). The effects of adding powder include improved heat resistance, enhanced mechanical properties, and improved sliding properties. For example, it provides toughness and reduces weight for high heat-resistant CFRP. 【Effects of Adding Powder】 ■ Improved heat resistance ■ Increased toughness ■ Enhanced mechanical properties ■ Improved sliding properties ■ Increased chemical resistance ■ Low dielectric * For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials

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Thermoplastic polyimide Therplim

Thermoplastic polyimide Therplim

Polyimide resin that has both moldability and heat resistance.

"Therplim" shows a well-balanced glass transition point (Tg185 ℃) and melting point (Tm323 ℃) compared to super engineering plastics such as PEEK. A crystalline TPI that maintains a high Tg while lowering its melting point. We can provide powder and pellets. 【Features】 ・Crystalline resin ・high strength ・high heat resistance ・high solvent resistance ・low dielectric constant ・easy molding processing ・Insoluble in solvent ※For details, please see the PDF document or feel free to contact us.

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Ideal for semiconductor manufacturing! Introducing heat-resistant specifications of 'CFRP'.

Ideal for semiconductor manufacturing! Introducing heat-resistant specifications of 'CFRP'.

Introducing "CFRP," which has heat resistance up to a maximum of 250℃ (for non-continuous use). There is also a low outgassing specification suitable for semiconductor-related applications.

In addition to the conventional room temperature specifications, we also offer a 250°C specification (non-continuous) to accommodate demanding processes. We can propose various grades according to the required heat resistance temperature. Furthermore, we have low outgassing specifications available for processes that require strict particle management, such as semiconductor manufacturing. Please feel free to contact us for more information.

  • fiber

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Intermediate material for CFRP CBZ-SMC, CBZ-prepreg [Under development]

Intermediate material for CFRP CBZ-SMC, CBZ-prepreg [Under development]

This is a new material that maintains the advantages of conventional radical polymerization system intermediate substrates while eliminating their drawbacks! Liquid resin CBZ has become the intermediate substrate!

Due to its high adhesion to carbon fibers, the liquid resin CBZ, after several improvements, has become an intermediate material. Features and Benefits: - High performance: Increased design range for CFRP - High cycle: Improved productivity - Storage: Reduced cooling costs - Transparency: Appearance and weather resistance - High weight products: Reduced cutting work, increased productivity - Paintability: Good compatibility with acrylic urethane paints - Low odor: Styrene-free - Low shrinkage: Significant reduction in warping during molding *For more details, please refer to the PDF document or feel free to contact us.

  • Composite Materials

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Thermoplastic polyimide resin "Saprime"

Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Pull-out molding CFRP resin "CBZ"

Pull-out molding CFRP resin "CBZ"

CBZ is a CFRP resin suitable for pull-out molding. Compared to pull-out materials using epoxy resin, productivity improves by 2 to 3 times.

CBZ manufactures many parts using pull-out molding. We have a strong track record due to high strength and good productivity. Feedback from pull-out molding manufacturers: "We can produce at three times the speed when using epoxy resin, which has improved productivity. The properties of CFRP are equal to or better than those of epoxy resin, and there are no issues." 【Features of CBZ】 ■ High adhesion to carbon fibers sized for epoxy resin ■ High adhesion to glass, aramid, and basalt fibers ■ Provision of CFRP with excellent bending, compression, and interlaminar shear strength ■ Low water absorption ■ Moisture resistance, oil resistance, and gasoline resistance ■ Fast curing achieved through radical polymerization. *For more details, please refer to the PDF document or feel free to contact us.

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  • Composite Materials
  • plastic

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Polyimide Therplim Low Friction Grade

Polyimide Therplim Low Friction Grade

Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.

Introducing our crystalline thermoplastic polyimide "Therplim Low Friction Grade." It is suitable for applications requiring a high Tg (185°C) and serves as an alternative to super engineering plastics like PEEK. * For more details, please refer to the PDF document or feel free to contact us.

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"Polycast," a two-component mixture that creates a hard resin in just a few minutes.

"Polycast," a two-component mixture that creates a hard resin in just a few minutes.

Mix the two liquids and you can quickly create a hard resin! It's hard yet strong, can be used for molds, and is easy to machine with NC!

"Polycast" is a low-viscosity, two-component mixed reaction type polyurethane resin that provides a hard and extremely tough resin. It is beneficial as an alternative material to fiberglass-reinforced plastic (FRP) using only resin. 【Features】 ◆ Hard and Tough Resin It produces a resin that is hard yet tough, making it suitable as an alternative material to FRP. ◆ Fast Curing It can be made by mixing the two components and curing at room temperature in about 3 minutes. ◆ Good Working Environment Low odor, solvent-free, and does not require fiberglass. ◆ Environmentally Friendly Can be disposed of as industrial waste or incinerated. ◆ Capable of Large-Scale Molding Large items can be instantly created using spray molding. ◆ Good Machinability Easy to process with NC machining and can also be used as an alternative to synthetic wood. *For more details, please contact us or refer to the catalog.

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A thermosetting epoxy resin system that can recycle both fibers and resins.

A thermosetting epoxy resin system that can recycle both fibers and resins.

CFRP using EzCiclo can be decomposed by reacting with the dedicated decomposing agent CleaVER in a reaction kiln, allowing for recovery without damaging the fibers.

Not only fibers but also resins can be reused and remolded, making recycling possible and significantly contributing to the realization of a circular society. 【Features】 ■ 100% recoverable resin ■ No need to introduce new equipment ■ Maintains the length of recovered fibers ■ Maintains the strength of recovered fibers ■ No waste generated ■ Can greatly contribute to a circular society *For more details, please refer to the PDF materials or feel free to contact us.

  • Composite Materials
  • Composite Materials

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Thermoplastic polyimide resin "Saprime Powder"

Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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『Therplim』 Low Friction Grade

『Therplim』 Low Friction Grade

For complex shape members and high-performance molded members!

Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.

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Examples of Suprem Film Molding

Examples of Suprem Film Molding

Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!

Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.

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『Therplim』 Wear resistance grade

『Therplim』 Wear resistance grade

Therplim「TS2400W」achieves higher strength, lower wear than PEEK!

The therplim TS series is a wear resistance grade for injection molding. The reinforced grades "TS2400W" that combine carbon fiber and whiskers have higher strength and elastic modulus than PEEK. ※For details, please see the PDF document or feel free to contact us.

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