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Resin(tg) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated: Aggregation Period:Feb 04, 2026~Mar 03, 2026
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Resin Product List

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Resin, plastic materials melting point, Tg (glass transition temperature) measurement (DSC)

Evaluation of melting point (Tm), glass transition temperature (Tg), crystallinity, and specific heat is possible!

Our company conducts "Differential Scanning Calorimetry (DSC)" to evaluate the thermal properties of resin materials, such as melting point (Tm) and glass transition temperature (Tg). The measurement conditions are as follows: temperature range from -100°C to 400°C, measurement atmosphere is Air or N2, and the sample amount is 5mg. Additionally, when performing material qualification of polyethylene (PE), the melting point is measured using DSC, allowing us to determine whether the sample is LDPE (Low-Density Polyethylene) or HDPE (High-Density Polyethylene) based on the differences in melting points. 【Measurement Conditions】 ■ Temperature Range: -100°C to 400°C ■ Measurement Atmosphere: Air, N2 ■ Sample Amount: 5mg ■ Applicable Standards - JIS K7121 Transition Temperature (Melting, Crystallization, Glass Transition) - JIS K7122 Transition Heat *For more details, please refer to the related links or feel free to contact us.

  • Contract Analysis
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High Absorbency Resin 'TG-SAP'

Highly absorbent! A superabsorbent resin developed through special polymerization technology.

"TG-SAP" is a highly water-absorbent resin among superabsorbent polymers, developed through specialized polymerization technology, which can maintain its water retention capacity even under pressure. The water absorption capacity of superabsorbent polymers is significantly influenced by osmotic pressure. The presence of high concentrations of -COO⁻ ions and Na⁺ ions creates a difference in ion concentration between the interior of the superabsorbent polymer and the external aqueous solution, resulting in osmotic pressure that causes water to be absorbed into the superabsorbent polymer. 【Features】 ■ Superabsorbent polymer ■ Extremely high water absorption capacity ■ Maintains water retention even under pressure ■ Developed through specialized polymerization technology For more details, please refer to the catalog or feel free to contact us.

  • Plastic utensils and containers
  • others
  • Resin

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Examples of Suprem Film Molding

Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!

Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.

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[Newly Developed Product] One-component Polyepoxy Acrylate Resin

High-performance UV resin that balances high Tg, LED curing, and transparency.

Conventional transparent epoxy required time and heat for the curing process, but TRU-0222K cures instantly with LED light (1,500mJ/cm²). It uses a light initiator that suppresses yellowing, achieving both high transparency and a hard finish. With low viscosity and excellent workability, it demonstrates high performance in a wide range of applications, including CFRP, resin molded products, craft works, and protection of electronic components. Additionally, its high Tg of 124°C allows it to be used in environments where heat resistance is required. *For more details, please download the PDF or feel free to contact us.

  • Other polymer materials
  • Resin

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Taiwan Elite Material Co. Ltd. (EMC)

Morimar SSP Co., Ltd. is the primary agent for Elite Material Corporation (EMC) in Taiwan. For more details, please contact us.

Sales of materials by Elite Material Co. Ltd. (EMC) Main lineup of CCL ■EM-528 ■EM-528K ■EM-890 ■EM-890K ■EM-892K ■EM-370(5) ■EM-370(Z) Others Shielding boards are also available. For more details, please download the materials or contact us.

  • Other electronic parts
  • Resin

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Transcription-type water-soluble 3D printing resin "RWSI Series"

Dissolves at room temperature and in still water! Can be used in soft robotics and injection molded cores.

We would like to introduce the water-soluble 3D printing resin "RWSI Series" handled by Nagase ChemteX Corporation. It can be dissolved at room temperature and in still water, allowing for the creation of precise and complex structures. The heat resistance is Tg > 100°C. It can be used in life sciences, soft robotics, and injection molding cores. 【Features】 ■ Water-soluble (dissolves at room temperature and in still water) ■ Heat resistance Tg > 100°C ■ Capable of creating precise and complex structures *For more details, please refer to the PDF materials or feel free to contact us.

  • 3D Printer
  • Resin processing machine
  • Contract manufacturing
  • Resin

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High heat-resistant liquid epoxy resin series - offering property tables and test data!

We offer a wide range of liquid epoxy resin encapsulants with a maximum Tg (glass transition temperature) of 308°C under our own brand, TERADITE.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of one-component and two-component liquid epoxy encapsulants with a maximum Tg of 308°C. These liquid epoxy resins can also be used in areas requiring high heat resistance outside the field of electronic devices. Currently, we are providing a specification sheet and thermal test data for some products! For more details, please check the PDF download below. Feel free to contact us with any inquiries.

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  • Other polymer materials
  • Resin

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New Development Product: Two-Component Heat-Curing Epoxy Resin TE-7814V

High thermal conductivity of 2.5 W/mK and high Tg of 185°C, this is a highly reliable low-viscosity epoxy resin suitable for thermal management of motors and coils.

"TE-7814V" is a two-component, heat-curing epoxy resin suitable for heat dissipation sealing applications in electronic and electrical equipment. Its low viscosity design allows it to accommodate complex component shapes, significantly improving workability and production efficiency. This product has a thermal conductivity of 2.5 W/m·K, making it effective for heat dissipation measures in electronic components that generate heat. It can be widely used in fields that require high performance, such as electronic devices and power modules. 【Features】 - Two-component heat-curing epoxy resin (mixing ratio 100/100) - Suitable for complex component shapes due to low viscosity - High thermal conductivity: 2.5 W/m·K - High heat resistance: high Tg 185℃ - Flame retardant: equivalent to UL94 V-0 - High insulation properties ensure long-term reliability of electronic devices *For details, the product's specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

  • Other polymer materials
  • Resin

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Amorphous polyester resin "ALTESTER SH grade"

A special grade of ALTESTER suitable for applications requiring heat resistance and impact resistance! Amorphous and highly transparent!

The "ALTESTER SH Grade" is a special grade that has heat resistance and improved impact resistance. The impact resistance is higher compared to existing grades, on par with PET, and it has good chemical resistance as an amorphous polyester. Additionally, it has a Tg of 135°C and a total light transmittance of over 91%. It is a transparent material that demonstrates high heat resistance. 【Features】 ■ Glass transition temperature is 135°C, no deformation in boiling test ■ Amorphous with high transparency ■ Impact resistance is higher compared to existing grades, on par with PET ■ Good chemical resistance as an amorphous polyester ■ Listed in the Ministry of Health, Labour and Welfare positive list *For more details, please refer to the PDF document or feel free to contact us.

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SABIC ULTEM resin

Characterized by high heat resistance.

High heat resistance is a characteristic of ULTEM resin. However, there are many features regarding short-term and long-term temperature performance and how it applies to various industries and applications. For a brief tutorial on glass transition temperature (Tg), continuous use temperature (CUT), heat deflection temperature (HDT), and relative thermal index (RTI), please refer to this material. It explains why ULTEM resin can maintain heat resistance while preserving strength and rigidity. For inquiries and material requests, please visit this site: https://sjpn1971.plabase.com/

  • Engineering Plastics
  • Resin

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High-temperature resistant adhesive 'ZC-210'

High heat-resistant and film-curable adhesive

Attention those struggling with adhesives! =====Amazing Features of ZC-210===== 1. Non-spreading, Thixotropic Ratio = 3 2. Capable of thin film curing, approximately 0.1mm 3. Coating toughness 4. Heat resistance, Tg = 175℃ 5. Quick curing, cures in 10 minutes at 160℃ *For more details, please download the PDF or feel free to contact us.

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Introduction of exhibited products at "Chemical Material Japan 2020"

Polyimide resin, which is expected to be utilized in various fields including 5G-related applications and aerospace. Product materials are being provided.

Our company will be exhibiting at "Chemical Materials Japan 2020," which will be held online from October 19 to November 18, 2020. 【Exhibited Products Features】 ■ Thermoplastic Polyimide Resin 'Supreme TO65' - Excellent moldability with a Tg of 185°C and a Tm of 323°C - Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Heat-Resistant Transparent Polyester Resin 'ALTESTER Series' - Developed a new grade with a glass transition temperature up to 50°C higher than PET - Currently developing a new grade with crystallinity - Maintains transparency while improving impact resistance ■ Thermosetting Resin 'CYTESTER' - Cures by forming a triazine ring Excellent processability, with high glass transition temperature, low thermal expansion, and low dielectric properties after curing ■ Special Polyol 'SPG (Spiroglycol)' - Symmetrical and stable molecular structure - Incorporating into polymers enhances heat resistance, impact resistance, hardness, and moldability ■ Special Polyol 'DOG (Dioxanediol)' - Can impart flexibility when incorporated into polymers *For more details about each product, please refer to the materials or feel free to contact us.

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Environmentally friendly materials: Low VOC coating raw material resin

Developed resin materials for coatings in emulsion type and solvent-free type.

【Emulsion Type】 - Hard coat urethane acrylate 【Solvent-free Type】 - A syrup diluted with acrylic monomer of low Tg type acrylic ester-based polymer Since it is a raw material resin, photoradical initiators are not added.

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  • Other polymer materials
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Biomass Acrylic Polyol '6BX-010'

It is a polyol that can incorporate biomass components into coating agents.

【 POINT 1 !! 】 Acrylic polyol with approximately 48% biomass content can be used as a binder resin for various coatings, offering a wide range of applications and the potential for reduced environmental impact. 【 POINT 2 !! 】 It has good compatibility with isocyanate prepolymers, allowing for improved film properties. 【 POINT 3 !! 】 With low viscosity, it has a minimal impact on the viscosity of coating materials, enabling improvements in high solid content and reducing solvents.

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『Therplim』 Low Friction Grade

For complex shape members and high-performance molded members!

Introducing the crystalline thermoplastic polyimide "Therplim Fiber Reinforced Grade". It is suitable for applications that require high Tg (185℃) as an alternative to super engineering plastics such as PEEK.

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Resin, plastic materials thermal gravimetric analysis (TGA)

The amount of inorganic fillers such as glass fibers, talc, and carbon black can be measured!

In "Thermogravimetric Analysis (TGA)," which is a type of thermal analysis, we measure the weight change of a sample when heated under specific conditions. Simultaneous measurement of Differential Thermal Analysis (DTA) is also possible. This allows us to capture chemical changes accompanied by weight changes such as decomposition, oxidation, and reduction, as well as changes without weight changes such as transitions and crystallization. 【Measurement Conditions】 ■ Temperature Range: Room Temperature to 1300℃ ■ Measurement Atmosphere: Air, N2 ■ Sample Amount: 10mg ■ Corresponding Standards: JIS K7120 (TG/DTA) *For more details, please refer to the related links or feel free to contact us.

  • Contract Analysis
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Cutting processing material: PI resin (BPDA)

Biphenyl tetracarboxylic dianhydride (BPDA) and diamine condensation polymerization!

We would like to introduce the cutting processing material "PI resin (BPDA)" that we handle. It is an all-aromatic polyimide resin produced by the polycondensation of biphenyl tetracarboxylic acid dianhydride (BPDA) and diamines. The compression molding grades include "SCP-5000," which excels in dimensional stability under humid conditions, and "SCM8000," which has good wear resistance. 【Features of SCP-5000】 - Improved rigidity and impact strength compared to aromatic polyimide resin SP-1 - Enhanced long-term high-temperature exposure resistance (with a Tg point of 380°C) - Excellent dimensional stability under humid conditions *For more details, please refer to the related links or feel free to contact us.

  • Other polymer materials
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High-performance epoxy compound "TEPIC"

High heat resistance, high light resistance, high elasticity epoxy compound.

TEPIC is a triad-based epoxy compound with a triazine skeleton. Compared to general-purpose epoxy resins, it excels in transparency, heat resistance, and light resistance, and has very unique characteristics such as high elasticity and high Tg. It has a wide range of applications, including LED peripheral materials and solder resist inks. Additionally, by adding a small amount of TEPIC to CFRP matrix resins, it is possible to improve compression properties, tensile properties, and interlaminar shear strength. *For more details, please download the PDF or feel free to contact us.*

  • Chemicals
  • Resin

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UV-curable resin, flexible type TRU-0202

It is a radical-type UV-curable resin. It has been given anaerobic and heat-curing properties. It is flexible and effective in preventing cracks.

TRU-0202 Radical-type UV-curable resin Features: Flexibility, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is applicable only when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 8,000 (mPa·s) ■Glass transition temperature: -30℃ ■Shear adhesive strength: 11.0 (MPa) AL/AL 25℃ 11.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

  • Other polymer materials
  • Coating Agent
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Polyester resin "Alapole"

Used for applications such as can paint, PCM, laminated cans, and adhesives!

"Arapor" is a high molecular weight polyester resin that offers excellent processability and adhesion to various substrates. The "high molecular weight type" can exhibit film-forming properties, toughness, and adhesion through the adjustment of "a wide range of glass transition temperatures (Tg)," "a broad range of molecular weights from low to high," "compatibility with various polymers," and "solubility adjustments to solvents." 【Features (Solvent-based Grade)】 ■ High molecular weight type → Improved intermolecular forces → Film-forming properties, toughness, adhesion ■ Random copolymerization → Suppression of crystallinity → Solubility, flexibility, adhesion ■ Varnish form (solvent-diluted) → Easy to handle *For more details, please refer to the PDF materials or feel free to contact us.

  • Plastic bearings
  • Plastic utensils and containers
  • Resin

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UV-curable resin with a methacrylate group

It is a di-functional urethane methacrylate with a methacrylate group.

This product is a di-functional urethane methacrylate with a methacrylate base. It is suitable as a base resin for thermosetting adhesives, anaerobic adhesives, and sealing/casting agents. - Due to its milder reactivity compared to acrylate bases, it has low exotherm, anaerobic curing properties, and low curing shrinkage. It is also characterized by high heat resistance and low toxicity due to its high Tg. - It has a structure that combines hydrolysis resistance from the ether backbone and toughness from the aromatic component. - It uses plant-derived raw materials, making it possible to consider environmentally friendly product development. It is supplied in liquid form. Please download the catalog for more details. We also offer free samples, web seminars, and product customization. Feel free to contact us.

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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).

Introducing the applications of Suprem's super engineering plastics alloy. Suprem is a crystalline super engineering plastic with high heat resistance (Tg: 185°C, Tm: 323°C) and high fluidity, allowing for a high content of fillers and other additives. By leveraging Suprem's characteristics of high heat resistance, crystallinity, low water absorption, and flexibility, improvements in various properties can be expected through alloying with various super engineering plastics. 【Features】 ■ Alloyed product of crystalline thermoplastic polyimide (TPI) resin ■ Crystallinity derived from Suprem is maintained even in alloyed products ■ Expected reinforcement effects through fiber reinforcement *For more details, please refer to the PDF document or feel free to contact us.

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Structural materials and composite epoxy resin *Evaluation sample*

Essential for CFRP! Short curing time and high mechanical strength and toughness! Ideal for large items too!

High heat resistance, high Tg, high strength, high elongation rate, chemical resistance, room temperature curing, fast curing, etc. We offer a lineup of products tailored to on-site needs! In addition to the items listed in the catalog, we have a wide variety of products, so please feel free to contact us. 【Features】 ■ Short curing time is also possible (matrix resin for HP-RTM) ■ Capable of RTM molding, infusion molding, and filament winding molding ■ A lineup of composite and dissimilar material adhesives, as well as matrix resins for tow prepreg ■ Other products available: dispensers, extrusion machines, SGA, acrylic adhesives, urethane adhesives, bagging films, PFA films, peel plies     ★ Evaluation samples are also available ★ If you are interested, please apply through the "Contact Us" section below.

  • glue
  • plastic
  • Composite Materials
  • Resin

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[Newly Developed Product] One-component Heat-Curing Epoxy Resin TE-7901K

One-component × High thermal conductivity 6.5W/mK! Epoxy resin for heat dissipation insulation. Suitable for encapsulating components that require thermal management, such as motors and power devices.

TE-7901K is a one-component, heat-curing epoxy resin developed as an insulating material for heat dissipation in electronic and electrical equipment. It excels in workability due to the absence of a mixing process, allowing for stable quality during use. This product boasts a thermal conductivity of 6.5 W/m·K, making it suitable for heat dissipation measures in electronic components that generate heat, such as motors, coils, and power devices. Additionally, it has flame retardancy equivalent to UL94 V-0, making it a reliable choice for applications that require high reliability. 【Features】 - One-component, heat-curing epoxy resin (no mixing required, high workability) - High thermal conductivity: 6.5 W/m·K - Flame retardancy: UL94 V-0 equivalent (5mm thickness) - High insulation and high heat resistance (Tg 110℃) - Suitable for heat dissipation and insulation sealing applications in electronic devices *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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Thermosetting resin (cyanate monomer) 'CYTESTER'

A thermosetting cyanate monomer with excellent heat resistance and processability, achieving low dielectric constant and low dielectric loss tangent.

"CYTESTER" is a thermosetting resin with a high glass transition temperature, low dielectric constant, and low dielectric loss tangent. In addition to being used alone, it can also be combined with various thermosetting resins such as epoxy resins. Its features can be utilized in applications such as printed circuit boards, semiconductor encapsulation materials, adhesives, and composite materials. We offer grades suitable for each application. 【Features】 Monomer Cured Product ◎ Low melting viscosity ◎ High heat resistance (Tg≈300℃) ◎ Excellent solvent solubility ◎ Low thermal expansion rate ◎ Low dielectric constant / low dielectric loss tangent ◎ Electrical insulation *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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Thermoplastic polyimide resin "Saprime Powder"

Drive blendable! Micronized powder of heat-resistant polyimide resin that can also be processed by melting.

"Saprime" is a thermoplastic polyimide resin that demonstrates a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic uses. "Saprime Powder" is a fine powder of heat-resistant polyimide resin. Despite being a fine particle, it has a uniform particle size and can be melt-formed above the melting point. [Features] - Crystalline thermoplastic polyimide - Insoluble in solvents - Fine powder with a sharp particle size distribution - Milky white powder - Can be drive blended - Low dielectric, high heat resistance, and meltable *For more details, please refer to the PDF document or feel free to contact us.

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Crystalline polyester resin "ALTESTER SC grade"

[Heat-resistant material] Improved heat resistance during stretching due to crystallinity! A special grade of ALTESTER aimed at enhancing physical properties!

The "ALTESTER SC Grade" is a special grade designed to improve physical properties after stretching, possessing crystallinity. The resin has heat resistance with crystallinity and a glass transition temperature of over 100°C, exhibiting high Izod impact strength and excellent impact resistance even at low stretch. Additionally, the heat resistance of the stretched film surpasses that of PET, making it suitable for applications requiring high heat resistance. 【Features】 - Resin heat resistance: Crystalline with a glass transition temperature of over 100°C - Resin impact resistance: High Izod impact strength and excellent impact resistance even at low stretch - Stretched film heat resistance: Surpasses PET, suitable for applications requiring high heat resistance - Stretched film characteristics: Low density, low elastic modulus, low dielectric constant (compared to PET film) - Safety and hygiene: Under consideration for positive list inclusion *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime"

A thermoplastic polyimide resin that combines unprecedented moldability and heat resistance.

"Suprem" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK, and combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, and it has a wide range of applications such as CFRP matrix resin, CFRP toughness modifiers, compounds, and electrical and electronic uses, leveraging its characteristics. [Features] ■ Crystalline thermoplastic polyimide (pellets, powder) ■ Insoluble in solvents ■ High heat resistance, high strength ■ Easy moldability ■ Reflow resistant ■ Low dielectric, high lubricity *For more details, please refer to the PDF document or feel free to contact us.

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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]

This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!

Mitsubishi Gas Chemical's "Therplim" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature and melting point, along with high strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability. Samples are available upon request! 【Features】 ■ Excellent moldability with a glass transition temperature (Tg) of 185 degrees and a melting point (Tm) of 323 degrees ■ High strength, high heat resistance, high solvent resistance, low dielectric properties, and easy moldability ■ Suitable for various applications such as melt-extruded films, machining, and injection molding ■ Used in 5G FCCL, test sockets, various sliding compound grades, CFRP, and toughness modifiers *For more details, please request documentation or download the PDF data.

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