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We manufacture a variety of flat through-hole printed circuit boards.
By filling in only the BGA/CSP section, we are able to flatten the surface mount pads (compatible with 0.35mm pitch) and permanently fill all mini Via holes, among other variations, allowing us to manufacture a wide range of flat through-hole PCBs according to product specifications.
Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.
"Pad on Via" is a printed circuit board that supports the manufacturing of BGA and CSP areas. The filling of Pad on Via holes can accommodate a board thickness of up to 4.8t, with drill diameters ranging from φ0.105mm to φ1.0mm. (Consultation available depending on specifications) Additionally, we can achieve permanent filling of vias according to customer requests. The permanent filling ink is processed smoothly through polishing. 【Process Example】 ■ NC drilling ■ Primary copper plating ■ Hole filling ■ Curing and polishing ■ Secondary copper plating ■ Pattern formation *For more details, please refer to the PDF document or feel free to contact us.
We respond to diverse needs, focusing on the prototype manufacturing of printed circuit boards from single-sided boards to multilayer boards!
Screen Process was established with the aim of providing screen printing plate services and expanded into the printed circuit board business in 1992, continuing to the present day. Printed circuit boards are often referred to as the heart of the electronics industry, and due to remarkable technological innovations in recent years, they have transitioned to high density, high functionality, and high multilayering. Our company strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also making efforts to respond accurately to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future. 【Business Content】 ■ Printed Circuit Boards (multilayer boards, BGA/CSP high-density substrates, pad-on-via, aluminum substrates, and prototypes of other special wiring boards for consumer and industrial use) ■ Laser drawing, CAM editing, precision industrial photography, and a full range of screen plate services *For more details, please refer to the PDF document or feel free to contact us.
It is now possible to create high-difficulty fine patterns like never before!
Our company has introduced the "LI-9200 Mercurex" manufactured by SCREEN PE Solutions. This has made it possible to create fine patterns with higher difficulty than ever before. 【Direct Imaging System】 ■ Manufactured by SCREEN PE Solutions ■ "LI-9200 Mercurex" *For more details, please refer to the PDF document or feel free to contact us.
Information on various materials that can be handled and manufacturing conditions that can be accommodated by our company.
This is an introduction to various materials and manufacturing conditions that we can handle. For specifications not listed, please feel free to consult with us. 【Printed Circuit Board Specifications】 ＜Minimum L/S＞ ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pad-on-via mixing not allowed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
The pad pitch is 0.5mm! It is suitable for fine pattern products.
We would like to introduce our "Direct Imaging System." It is suitable for fine pattern products such as substrates with 0.3mm to 0.65mm pitch BGA and CSP, as well as flip chip mounted substrates. Additionally, it is applicable to products requiring high alignment accuracy. Please feel free to contact us when you need assistance. 【Features】 ■ High-difficulty fine patterns ■ Fine pattern formation ■ Resist formation *For more details, please refer to the PDF document or feel free to contact us.
Supports plate thickness up to 4.8t! We can achieve permanent hole filling for Via according to customer requests.
We offer "Pad on Via (permanent filling)" services. We support the manufacturing of pad on vias in the BGA and CSP areas. The filling of pad on vias can accommodate board thicknesses up to 4.8t. Additionally, the permanent filling ink is processed smoothly through polishing, allowing us to achieve permanent filling of vias according to customer requests. 【Features】 ■ Supports the manufacturing of pad on vias in the BGA and CSP areas ■ Filling of pad on vias can accommodate board thicknesses up to 4.8t ■ Achieves permanent filling of vias according to customer requests ■ Permanent filling ink is processed smoothly through polishing *For more details, please refer to the PDF document or feel free to contact us.
ニーズにお応えする為に高品質・高精度・短納期を追求し、低価格化のニーズにも的確に対応できるように尽力致します。
ハロゲンフリー化及び鉛フリー化に各種、対応しております。
It is a new feature that adds "heat dissipation" and "mechanical rigidity" to the functions of conventional printed circuit boards.
Aluminum substrates are designed to add new functions of "heat dissipation" and "mechanical rigidity" to the conventional printed circuit boards. Additionally, compared to resin-based printed circuit board materials, aluminum substrates have a temperature rise of about 1/10 or less at the same power consumption, making them very suitable for components that generate heat, such as resistors carrying large currents, power transistors, and high-power LEDs.
There are various variations depending on the board thickness and pitch.
There are various variations depending on the thickness of the board and the pitch.
Compatible with minimum hole diameter φ0.125.
The maximum interlayer thickness of IVH is 0.4mm, and it can accommodate a minimum hole diameter of φ0.125. In the future, it is also planned to support multi-layer laminated press specifications.
Impedance measurement creates test coupons outside the product! The design values for the impedance line can be simulated by our company.
In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. By providing us with impedance specifications and other details before or during the design phase, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS800s4 *For more details, please refer to the PDF document or feel free to contact us.
Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.
We would like to introduce the "Printed Circuit Board Specifications" handled by Screen Process Co., Ltd. The maximum IVH interlayer thickness can accommodate up to 0.4t and the minimum hole diameter is φ0.1mm. We also support sequential IVH. For more details, please refer to the catalog. 【Minimum L/S】 ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pads and vias cannot be mixed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
Introducing our substrate specifications, including MCL-E-67 and R-1766!
We would like to introduce the specifications of the substrates handled by Screen Process Co., Ltd. The "NP-140TL" from Nanya has a UL/ANSI grade of FR-4.0, with its main application being general-purpose, and a thermal conductivity of 0.4W/mK. For more details, please refer to the catalog. 【MCL-E-67 Specifications (Partial)】 ■ Substrate Manufacturer: Hitachi Chemical ■ UL/ANSI Grade: FR-4.0 ■ Main Application: General-purpose ■ Glass Transition Temperature ・TMA Method: 120–130 ・DMA Method: 150–160 *For more details, please refer to the PDF document or feel free to contact us.
We will meet our customers' needs through creativity and effort!
Our company was founded in 1984 with the aim of providing screen printing plate services, and we expanded into the printed circuit board business in 1992, continuing to the present day. To meet the various needs of our customers, we pursue high quality, high precision, and short delivery times, while also striving to respond accurately to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future trends and contribute to a prosperous future. 【Business Activities】 ■ Printed circuit boards (multilayer boards, BGA/CSP high-density substrates, pad-on-via, aluminum substrates, and prototypes of other special wiring boards for consumer and industrial use) ■ Laser drawing, CAM editing, precision industrial photography, and a full range of screen printing services *For more details, please refer to the PDF materials or feel free to contact us.
