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Substrate(kit) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Substrate Product List

1～15 item / All 26 items

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5C-SSM evaluation kit_box

5C-SSM evaluation kit_box

Evaluation kit equipped with an odor sensor, "CEK box"

Evaluation kit consisting of three components: CMOS-type odor sensor "5C-SSM," interface board, and flow path fixture, all housed in a casing. The accompanying software includes automatic setting functions for sensor drive parameters and pixel selection, allowing for simple data acquisition. The CEK box (official name: 5C-SSM evaluation kit_box) is available for purchase starting from one set.

  • O2 sensor evaluation test device
  • Other Sensors

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FSM Adapter Board

FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board

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Flexible circuit board

Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

  • Other electronic parts
  • others
  • Processing Contract

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Rigid substrate

Rigid substrate

Rigid substrate

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

  • Other electronic parts
  • others
  • Processing Contract

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Glass substrate

Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
  • others
  • Processing Contract

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Universal board for PIC microcontroller board MB-P11

Universal board for PIC microcontroller board MB-P11

Ideal for electronic projects using PIC microcontrollers.

This is a PIC microcontroller board for experimentation and evaluation compatible with the PIC16F/18F series.

  • Printed Circuit Board

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Integrated design and manufacturing solution services

Integrated design and manufacturing solution services

All of our printed circuit boards, including special products, can be accommodated for assembly!

Our company provides a consistent solution service for design and manufacturing. We offer services utilizing OKI-EMS's comprehensive capabilities, including circuit design, firmware development, mechanical design, and AW design. Additionally, all of our printed circuit boards, including special products, are capable of implementation. 【Features】 ■ FPGA IP (image, audio, communication, embedded systems) ■ DSP platform ■ Wireless EtherCAT analog support ■ Enclosure and mechatronics design An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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VMIVME-1129

VMIVME-1129

128-bit High-Voltage Digital Input Board

VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U

  • Embedded Board Computers

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OKI Circuit Technology Pattern Design

OKI Circuit Technology Pattern Design

Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.

Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Various Custom Printed Circuit Board Catalogs

Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.

This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Board "SY-KUS-01"

Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing

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Printed circuit boards (wiring boards) for space and defense equipment.

Printed circuit boards (wiring boards) for space and defense equipment.

We supply printed circuit boards for space and defense applications. The printed circuit boards that withstand harsh operating environments are a testament to the high reliability of our products.

OKI Circuit Technology Co., Ltd. is a manufacturer of printed circuit boards that primarily engages in the development, design, and manufacturing of printed wiring boards, electronic devices, and electronic components, and is part of the OKI Group (OKI Electric Industry Co., Ltd.). The company has obtained certification from the Ministry of Defense and the Japan Aerospace Exploration Agency (JAXA), achieving high quality and high reliability in printed circuit boards that can cater to the aerospace industry, earning a high reputation within the industry. Among the products created with our technology, the "flex-rigid board," which combines flexible printed circuits (FPC) with standard rigid boards, eliminates the need for connector space for connecting cables, achieving space-saving and lightweight designs. Furthermore, it provides high reliability by eliminating concerns about connector connections due to vibrations, contributing to the development of the aerospace industry. Please feel free to consult with us. Our article has been published in MONOist. [Reducing a cumulative 480 hours over three years: How we advanced smart manufacturing in a low-volume, high-mix factory] https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html

  • Printed Circuit Board

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Support for high-density build-up structures

Support for high-density build-up structures

We can accommodate high-density build-up structures, such as 4-layer full-stack prototypes!

Our company enables the mounting of narrow-pitch components through a high-density build-up structure. In the interlayer thick structure, the interlayer thickness is set to 100-120μm, achieving high insulation reliability. Additionally, we support mass production of three-tier full stacks and skip via structures. Please feel free to contact us when you need our services. 【Specifications Supported】 ■ Narrow pitch support ■ Thick copper foil specifications ■ Mixed IVH & LVH ■ High-frequency support An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

High-frequency compatible printed circuit board [Basic knowledge materials on printed circuit boards provided]

Supports high frequency and millimeter wave frequency bands from 30 to 300 GHz! "I want to consider high frequency printed circuit boards, but it's difficult." We will solve such problems!

Our company will realize products that support high-frequency and millimeter-wave frequency bands from 30 to 300 GHz. Do you have any concerns such as "I want to consider next-generation high-frequency printed circuit boards, but it's difficult to realize"? We will support you in solving challenges towards product commercialization. We will provide proposals tailored to your needs, such as adopting new high-frequency materials, evaluating frequency characteristics, and assessing environmental resistance together. [We solve the following concerns] ■ I want to consider next-generation high-frequency application substrates ■ I want to consider millimeter-wave radar application substrates ■ I want to reduce transmission loss and delay time ■ I want to accurately match characteristic impedance ■ I want to keep costs down for high-speed high-frequency compatible substrates ■ I want to know about printed circuit boards for the fifth-generation mobile communication system (5G) ■ I want to learn about the latest lamination technology and pattern design ■ I want to know about selecting suitable printed circuit board materials, etc. *For more details, please refer to the PDF document, or feel free to contact us if you wish to have a technical consultation.

  • Circuit board design and manufacturing

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