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box Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

box Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. タカチ電機工業 Saitama//Machine elements and parts
  2. null/null
  3. タイムワールド Tokyo//others
  4. 4 ワコン Wakayama//Warehousing and transport related industries
  5. 5 KEYes Fukuoka//IT/Telecommunications
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box Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. List of CAD Data for Sanparts
  2. Oxygen Box O2 Box T2-R (for 1-2 people) タイムワールド
  3. Smart Key Box KEYes
  4. 4 2025-2027 Edition Takachi Case and Box Comprehensive Catalog タカチ電機工業
  5. 5 | Just set it up with a simple configuration! | Gateway BOX ヘキサコア株式会社(旧：株式会社中央製作所) 本社・工場

box Product List

121～135 item / All 2024 items

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Batch-type plasma reflow device (flux reflow)

Batch-type plasma reflow device (flux reflow)

Flux-free reflow device for fine wafer bumps. Sample test compatible, achieving energy-saving and short takt processes. Reflow video available.

Achieving flux-free bump reflow with highly reducing H2 radicals generated by high-density plasma (SWP). Reducing the application and cleaning processes of flux. Minimizing wet processes before and after reflow. An energy-saving, space-saving, and clean process that reduces the space, processing, and utilities of wet equipment. A cutting-edge mass production process compatible with 300mm wafers, suitable for batch-type hardware and niche devices with small-diameter substrates. Supporting short-tact batch processing for small-lot production and R&D applications.

  • Other semiconductor manufacturing equipment

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Batch-type vacuum soldering device (fluxless reflow vacuum reflow)

Batch-type vacuum soldering device (fluxless reflow vacuum reflow)

Achieving fluxless, voidless reflow from power modules to wafer bumps. New model launched for upgraded quality! *Currently supporting sample testing.

Batch-type vacuum soldering equipment that achieves high-reliability soldering. High-speed and uniform soldering in a low-oxygen atmosphere through vacuum evacuation. Achieves a high level of void-free soldering through combinations of vacuum, atmospheric pressure, and various atmospheres (reduction, inert). A basic model of the standard process for high-reliability power modules for automotive applications. A new model has been introduced to increase processing capacity and performance. The new model has been installed at the factory. Actively responding to equipment tours and sample tests. Conducting void-free, flux-free soldering tests, including plasma cleaning for pre-treatment. ★ We will exhibit at NEPCON Japan 2020! * For more details, please refer to the PDF document or feel free to contact us.

  • Reflow Equipment
  • Soldering Equipment
  • Electric furnace

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Polyimide cure device (300mm wafer compatible clean bake device)

Polyimide cure device (300mm wafer compatible clean bake device)

300mm wafer-compatible polyimide cure, baking, low-temperature annealing, compatible with multilayer substrates. Thermal processing equipment for mass production of advanced electronic devices.

High uniformity hot air heating in a low oxygen atmosphere (N2) after vacuum replacement. Heating treatment of 300mm wafers in cassette units. Compatible with system LSI polyimide curing and flexible printed circuit board curing/annealing. Achieving both high quality and mass production with curing of 300mm wafer cassette units.

  • Annealing furnace

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Standard Batch Type Sputtering Device (SRV Series)

Standard Batch Type Sputtering Device (SRV Series)

Multi-functional, compact, flexible support, a standard lineup with proven results and trust.

A standard batch-type sputtering series that incorporates a three-element cathode into a compact housing. It covers the film deposition process for various electronic devices and related materials from basic development to mass production, thanks to a wide uniform range of film thickness distribution and an automatic control mechanism. Our film deposition processes and options, supported by numerous delivery records, will reliably meet your requirements.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Research and development sputtering equipment

Research and development sputtering equipment

Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.

Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.

  • Sputtering Equipment

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SDR-type roll-to-roll sputtering device (RtoR type sputtering device)

SDR-type roll-to-roll sputtering device (RtoR type sputtering device)

Currently responding to sample tests, developing films and metal foils for flexible devices and advanced functional materials, and supporting mass production. Process support with demo equipment.

Achieving mass production of flexible electronic devices represented by FPC with proven results. Reliable response to various individual requirements through process support using in-house demonstration equipment. Proven results with a wide range of substrates, including not only general resin films but also metal foils. Stable operation is realized through a high-utilization cathode developed in-house and a well-established transport mechanism. Equipped with a variety of optional mechanisms such as plasma pre-treatment electrodes, cathodes for magnetic materials, and main rolls for substrate heating, it can be operated as a multipurpose continuous film processing device. Flexible realization of hardware and software according to purpose and application, including small machines for R&D and batch-type equipment compatible with sheets.

  • Other processing machines
  • Sputtering Equipment
  • Plasma surface treatment equipment

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Mass production compatible batch-type sputtering system (Model STH10311)

Mass production compatible batch-type sputtering system (Model STH10311)

A batch-type sputtering device equipped with four substrate holders for φ410 substrates, achieving excellent film thickness uniformity within ±5% in the same substrate holder.

This is a batch-type sputtering device that achieves both processing capacity for mass production and excellent film thickness uniformity by adopting multiple self-rotation substrate stages. Despite being a chamber system exceeding 1 meter due to the side sputtering method, it enables easy attachment and detachment of substrates and targets, as well as simplified maintenance within the vacuum chamber. It incorporates essential considerations for mass production equipment, such as a data logging system optimal for mass production and control interface software that facilitates device control and management. It balances quality and throughput for large substrates represented by 300 mm wafers, as well as for the mass production of small electronic components like resistors and sensors.

  • Sputtering Equipment

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Simple experimental deposition device (EM-645 type)

Simple experimental deposition device (EM-645 type)

Simple, compact, high-performance; ideal for experiments and basic research; flexibly customizable according to user needs; standard-type deposition device.

Covers all performance, cost, and technical support required for basic research, and can be customized according to individual requirements.

  • Evaporation Equipment
  • Other physicochemical equipment
  • Other surface treatment equipment

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Standard Batch Type Vapor Deposition Equipment (AMF Series)

Standard Batch Type Vapor Deposition Equipment (AMF Series)

Standard series for electronic device applications. A reliable and comprehensive lineup ranging from multipurpose small research units for R&D to mass production for well-established back electrode applications.

A lineup of standard deposition equipment that broadly supports everything from research and development of semiconductors, MEMS, and various electronic components (sensors, quartz oscillators, etc.) to full-scale mass production. All models are compatible with clean rooms and clean vacuum environments, equipped with various selection mechanisms. We respond meticulously to individual requests based on our extensive experience with standard specifications. Customization is available for evaporation sources, heating temperatures, substrate mechanisms (planetary dome, rotary dome), operation, and logging software. We also offer process testing with in-house demo units, providing a wide range of flexible hardware and support.

  • Evaporation Equipment
  • Other surface treatment equipment

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AlN template creation device (sputtering device for oriented AlN films)

AlN template creation device (sputtering device for oriented AlN films)

AlN templates for UV-LEDs using sputtering. AlN films with high crystallinity and C-axis orientation can be created by sputtering. Latest model deposition equipment.

A AlN template on a sapphire substrate necessary for reducing the manufacturing cost of UV-LEDs is created by sputtering. An AlN film with a C-axis orientation of less than 100 arc/sec is formed by sputtering at low temperatures (below 700°C). This contributes to the cost reduction of UV-LEDs with a simple and stable process and high throughput. Sample testing is currently underway, and development for expansion into high-frequency devices is also in progress.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Multi-chamber sputtering device

Multi-chamber sputtering device

A lineup with over 20 years of proven history. Customized processes and hardware for high-end niche processes from R&D to mass production.

Actively responding to various applications and substrates that are difficult to accommodate with standard specifications. Dedicated mechanisms are prepared for many substrates, including R&D, discrete components, compounds, MEMS, packaging, assembly processes, masks, and small FPDs. Tray transport of substrates is also standard, enabling film deposition and processing of different types of substrates on the same device through atmospheric substrate handling. In addition to application-specific cathodes (wide erosion, ferromagnetic materials, oxides, reactive types), we support a wide range of applications with special substrate mechanisms (high-temperature heating, magnetic field application, cooling, etc.). Dedicated devices are individually designed based on process tests using in-house demonstration machines.

  • Sputtering Equipment
  • Plasma surface treatment equipment

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Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

Electrode film annealing device for compound semiconductors (variable atmosphere heat treatment device)

A quartz tube type annealing device commonly used for alloying and reducing resistance of electrode films in compound semiconductors. It is a high-temperature processing type equipped with a rapid cooling mechanism. It is also compatible with transparent electrode films.

Customizing an annealing device with extensive experience in Si processes for compound semiconductor processes. Capable of high temperatures (900-1000°C) compared to hot plate types for GaAs. Proven results in the alloying of electrodes for nitride semiconductor films. Equipped with a rapid temperature rise and fall heating furnace to control the annealing of electrode films with uniform heating and optimal temperature profiles. A heat treatment device for wafer processes with a proven track record that can propose optimal equipment configurations based on production volume and processes.

  • Annealing furnace
  • Heating device

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SiC coating device (AF-IP device)

SiC coating device (AF-IP device)

A dense SiC (silicon carbide) film with excellent wear resistance and oxidation resistance is formed using PVD. A thick film (7 μm) is formed using a new ion plating method.

Achieved SiC film formation using a PVD method that was not previously available through a newly developed arc filament-type ion plating method. Adopted a new film formation technology that enables the formation of dense SiC films with excellent wear resistance and oxidation resistance at low temperatures below 400°C. The ion plating method, using solid silicon as the starting material, realizes a simple and environmentally friendly clean process with low environmental impact. The new film formation equipment offers high control over film thickness and quality, and excels in exhaust gas treatment, maintenance, installation area, and running costs compared to CVD.

  • Other machine tools
  • Other processing machines
  • Plasma surface treatment equipment

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Metal nanopaste sintering bonding compatible vacuum soldering device

Metal nanopaste sintering bonding compatible vacuum soldering device

A new model of Shinko Precision's vacuum soldering device has arrived, enhancing the quality of metal sintering joints with excellent thermal uniformity, temperature rise characteristics, and atmosphere control. This is a next-generation high-reliability sintering bonding device.

The vacuum soldering equipment from Shinko Seiki, which supports the production of power device modules, has been upgraded. It improves the heating and cooling characteristics and expands the processing dimensions. It accommodates the sintering bonding of metal paste through the conventional atmosphere control performance and the increase in processing temperature. The realization of low oxygen concentration and the reducing power of a 100% hydrogen atmosphere significantly enhance the wettability by preventing the oxidation of wet paste. The addition of an optional heating and pressurizing mechanism also enables void-free bonding. Shinko Seiki's new vacuum soldering equipment is compatible with next-generation bonding materials.

  • Annealing furnace
  • Reflow Equipment
  • Industrial Furnace

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Plasma Lava Coating Device (STV6301 Sputtering Device)

Plasma Lava Coating Device (STV6301 Sputtering Device)

Coating Sakurajima lava with the latest plasma technology. Naturally derived functional surface treatment. Achieving new functions such as various vegetation and hydrophilicity for all types of equipment.

Coating Sakurajima lava using magnetron sputtering. Application of naturally derived lava for advanced surface treatment. Formation of thermally and chemically stable thin films utilizing the properties of lava. Realization of decorative films (transparent and interference colors) and hydrophilic films on various materials (metal, glass, fiber). Being a natural material, it does not cause allergies in humans and prevents alteration and discoloration of the material. It has been put into practical use for surface treatment of tableware, and market expansion is expected. Additionally, it excels in infrared light transmittance, and development for fiber coating is also anticipated. A lava coating with excellent energy-saving performance and environmental resistance, applied uniformly to three-dimensional shapes. A new era of surface treatment equipment.

  • Sputtering Equipment
  • Glass
  • fiber

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