Principles of Joining Imagery and Troubleshooting Focus Points
Understanding wire bonds through images! Introducing topics such as WB as a joining method in a column.
There is a lack of explanations that connect the problems and their causes commonly encountered in the fields of design and quality management as images. When one can grasp the concepts in the fields of design and quality management, it becomes valuable knowledge when considering material design or when hypothesizing the causes of issues within semiconductors. Our company has experienced a large volume of wire bonding under major manufacturers since the early wire bonding days of the 1980s. We have encountered many issues, including complaints. *For detailed content of the column, please refer to the PDF document. For more information, feel free to contact us.*
- Company:佐用精機製作所
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