100% Water-Cutting Air Nozzle for the Semiconductor Industry
Instantly achieve complete water removal from the workpiece with air blow. Realize complete drying on the spot.
"Instantly achieve complete water removal with air blow! Complete drying on the spot." In the semiconductor industry, the quality of ultra-precise workpieces greatly affects product performance. In particular, the residual water droplets after cleaning can lead to the occurrence of defective products and a decrease in yield, making complete water removal and drying essential. Conventional air nozzles tend to leave water droplets behind, necessitating an additional drying process. Our product, the "Air Screw Nozzle," utilizes unique patented technology to achieve 100% complete water removal from workpieces instantly with just air blow. This reduces the time, cost, and personnel required for the drying process, thereby improving production efficiency. [Application Scenarios] - Water removal and drying process after wafer cleaning - Use in clean rooms (Class 100 compliant) [Benefits of Implementation] - Cost reduction due to the elimination of the drying process - Streamlining of production lines - Improved yield by reducing defective products
- 企業：バリューイノベーションジャパン
- 価格：Other
