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resin(100) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
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resin Product List

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Impregnating sealant "5100"

Impregnating sealant "5100"

Seal the gaps inside the electric wires and wire harnesses. A new sealing method to replace O-rings and potting.

"5100" is a sealant suitable for sealing gaps inside electric wires, wire harnesses, and similar applications. It maintains flexibility even after curing, making it suitable for sealing gaps in molded parts of connectors and sensors. Have you ever experienced oil or humid air leaking through gaps inside a wire harness? Or have you encountered situations where the insulation was damaged during use, allowing water to enter? In such scenarios, our impregnating liquid "5100" demonstrates high reliability. Additionally, "5100" retains high flexibility even after curing. Due to the differences in thermal expansion coefficients between resin and metal molded products, gaps can significantly shift when subjected to thermal shock. Even in such cases, "5100" moves with the shifting gaps, helping to minimize their occurrence. 【Basic Properties】 ■Material Acrylic resin ■Heat Resistance -40℃ to 150℃ 【Target Materials】 ■Fluoropolymer wires ■Cross-linked polyethylene wires ■Super engineering plastics such as PPS and PEEK ■Engineering plastics such as PA6, PA66, POM, and PBT

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Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Learning from the Basics

Epoxy Resin Hardener Q&A Course for Beginners

8. Characteristics of Polyamide Amine Curing Agents 9. Others 10. Amine Curing Agents Applicable to Various Uses of Epoxy Resins 10-1 Lining 10-2 Coatings 10-3 Reinforcement for Civil Engineering and Construction Structures 10-4 Adhesives 10-5 Electrical Insulation Materials 10-6 Tooling 11. Q&A on Epoxy Curing Agents Q1: Estimated Demand for Curing Agents for Epoxy Resins by Application Q2: Estimated Demand for Epoxy Resin Curing Agents Q3: Selection Method for Curing Agents by Performance Q3-1 Adhesives Q3-2 Chemical Resistance Q3-3 Heat Resistance Q3-4 Electrical Insulation Q3-5 Heat Resistance Q3-6 Moisture and Water Resistance Q3-7 Flexibility Q3-8 Impact Resistance Q4: Causes of Various Troubles Q4-1 Causes of Insufficient Curing Q4-2 Method for Determining Insufficiently Cured Areas Q4-3 Causes of Bubble Formation Q4-4 Causes of Resin Cracking After (or During) Curing Q4-5 Causes of Delamination After (or During) Curing 12. Examples of Epoxy Resin Performance: Photos

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UV-curable resin, high glass transition temperature type TRU-0251

UV-curable resin, high glass transition temperature type TRU-0251

It is a cationic UV-curable resin. It has a Tg of 150°C and excellent heat resistance.

TRU-0251 Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 10,500 (mPa·s) at 25°C ■ Glass transition temperature: 150°C ■ Shear adhesion strength: Substrate failure GL/GL at 25°C Substrate failure GL/GL after 1,000 hours at 85°C/85% RH ■ Recommended curing conditions: UV metal halide lamp 3,000 mJ/cm²

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Water-absorbing resin "Aqua Keep"

Water-absorbing resin "Aqua Keep"

A resin that absorbs 1000 times its own weight in water! It is used in diapers, various hygiene products, and industrial products.

"Aqua Keep" is a highly absorbent resin that our company has been researching and developing for many years. By adding meticulous design tailored to user requirements to a resin that absorbs water up to 1000 times its own weight, we have incorporated various functions. Utilizing this functionality, it is used in products such as disposable diapers, various hygiene products, and industrial products, receiving high quality evaluations from users. [Features] - A resin that absorbs water up to 1000 times its own weight - Various functions added through meticulous design tailored to user requirements - High quality evaluations from users - Produced in Japan, Singapore, France, and South Korea, and used worldwide *For more details, please refer to the related link page or feel free to contact us.

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UV-curable resin, high thixotropic type TRU-0250K

UV-curable resin, high thixotropic type TRU-0250K

Cationic UV-curable resin, providing high thixotropy.

TRU-0250K Cationic UV-curable resin Features: Heat resistance, moisture resistance Applications: Protection of small motors and sensors 【Specifications (excerpt)】 ■ Viscosity: 25℃ 158,000 (mPa·s) ■ Glass transition temperature: 125℃ ■ Shear adhesion strength: Substrate failure GL/GL 25℃ Substrate failure GL/GL 85℃/85℃RH after 1000h ■ Recommended curing conditions: UV metal halide lamp 3,000mJ/cm²

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[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

[New Development] One-component Heat-Curing Epoxy Resin TE-5111K

This is a one-component heat-curing epoxy resin for new product development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 168°C. It can be used for encapsulation of electrical and electronic components. Single-component heat-curing black epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For more details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if you need them.

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Development of next-generation glass alternative materials and their optical properties, impact resistance, application examples, EU standards.

Development of next-generation glass alternative materials and their optical properties, impact resistance, application examples, EU standards.

Now, let's explain the necessary optical properties and impact resistance, as well as future goals, based on examples of developments!

★Automotive windows, residential windows, transparent resins for tablets and smartphones, etc. Glass alternative materials are expected to see significant demand growth in the future! ☆A representative from a company dealing with typical glass alternative resins (PC, PMMA, COP) will explain the current required optical properties, impact resistance, and future targets based on market development examples! ★Transparency, refractive index, solar heat gain coefficient, ultraviolet absorption/shielding rate, impact resistance, etc.! 【Venue】 Tokyo Chuo Ward Industrial Hall 4F, Meeting Room 2 【Tokyo, Chuo Ward】 Date and Time July 23, 2013 (Tuesday) 11:00-16:00

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
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UV-curable resin, high strength type TRU-0212

UV-curable resin, high strength type TRU-0212

It is a radical-type UV-curable resin. Because it has been given anaerobic and heat-curing properties, it is possible to cure the resin even inside where light does not reach.

TRU-0212 Radical-type UV-curable resin Features: High strength, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 92,000 (mPa·s) ■Glass transition temperature: 36℃ ■Shear adhesive strength: 18.0 (MPa) AL/AL 25℃ 17.5 (MPa) 85℃/85%RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² + 80℃ x 2h / Anaerobic curing

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Basics and synthesis of epoxy resin hardeners, and improvement of heat resistance, moisture resistance, and impact resistance.

Basics and synthesis of epoxy resin hardeners, and improvement of heat resistance, moisture resistance, and impact resistance.

A one-day seminar to master heat resistance, moisture resistance, impact resistance, and curing speed to meet the required characteristics of sealing materials, adhesives, electronic substrates, and composite materials.

【Lecturers】 1. Shigeki Inatomi, Technical Advisor (Former Asahi Kasei Fellow), Asahi Kasei Corporation 2. Yoshio Tanioka, Team Leader, Structural Materials Section, Electrical Structural Materials Department, Nagase ChemteX Corporation 3. Masahiko Yamanaka, Group Leader, Senior Researcher, Research and Development Division, Shin Nippon Rika Co., Ltd. 4. Masaki Yoshii, Chief Researcher, Semiconductor Materials Division, Hitachi Chemical Company, Ltd. 【Venue】Industrial Promotion Hall, Room 2【Kawasaki Station, Kanagawa】 【Date and Time】November 25, 2010 (Thursday) 10:00 AM - 4:30 PM 【Capacity】30 people *Registration will close once full. Please apply early.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
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Low viscosity UV-curable resin TRU-0201K

Low viscosity UV-curable resin TRU-0201K

It is a radical-type UV-curable resin. It has anaerobic and heat-curing properties. It is a low-viscosity type.

TRU-0212 Radical-type UV curable resin Features: Low viscosity, heat resistance, moisture resistance, anaerobic curing, heat curing Applications: Protection of small motors and sensors *Anaerobic curing is only applicable when the substrate is metal 【Specifications (excerpt)】 ■Viscosity: 25℃ 280 (mPa·s) ■Glass transition temperature: 14℃ ■Shear adhesive strength: 9.0 (MPa) AL/AL 25℃ 9.0 (MPa) 85℃/85℃RH after 1000h ■Recommended curing conditions: UV metal halide lamp 3,000mJ/cm² or 80℃ x 2h / Anaerobic curing

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High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

High heat resistance and high thermal conductivity (heat dissipation) liquid epoxy resin series

For potting in motors! High heat-resistant liquid epoxy resin with a Tg of up to 300°C and high thermal conductivity liquid epoxy resin with a maximum of 6.5 W/m·K.

Recently, with the trend towards thinner and more highly integrated electronic devices, the importance of thermal management has significantly increased. Our company offers a wide range of products, including high thermal conductivity liquid epoxy resins with a maximum of 6.5 W/m·K, high heat-resistant liquid epoxy resins with a maximum Tg of 300°C, as well as various grades such as room temperature curing types and flexible types. In addition to our comprehensive catalog, we provide property tables and heat resistance test data for each product number. For more details, please refer to the PDF download below. Although we operate on a made-to-order basis, we can accommodate small quantities as well. We can also provide samples. If you have any questions or concerns, please feel free to contact us.

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Miolex suitable for use as insulation plates for molding machines and molds [machining].

Miolex suitable for use as insulation plates for molding machines and molds [machining].

Thickness tolerance of ±0.01 is possible! A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep rate (%): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) in a temperature-controlled environment using numerous machine tools, 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

General-purpose potting resin TE-7017, high thixotropy, low elasticity modulus product.

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-7017 Two-component heating curing epoxy resin Features: Acid anhydride curing, high thixotropy (T.I 4.5), low elastic modulus, crack resistance Applications: Potting for various electronic components ■ Flexural modulus: 3,800 (MPa) ■ Volume resistivity: >1 x 10¹⁶ (MΩ·m) ■ Recommended curing conditions: 120℃ x 3h + 160℃ x 1h For more details, please download the PDF below or feel free to contact us.

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Coloring agent for urethane resin "ZA Color"

Coloring agent for urethane resin "ZA Color"

Widely usable! Unlike plasticizer-based colorants, there is no impact on physical properties such as bleeding.

"ZA Color" is a paste-like coloring agent that uses a polyether polyol as a toner base and disperses various pigments at a high concentration. The molecular weight of the toner base is 2000, and the OH value is 56. It has excellent long-term storage stability, and the pigments selected do not have issues with weather resistance. It can be widely used as a coloring agent for urethane-based flooring materials, waterproofing materials, and foamed products. 【Features】 ■ Easy to mix into the resin, providing excellent workability ■ Excellent long-term storage stability ■ No impact on physical properties such as bleeding compared to plasticizer-based coloring agents ■ Pigments selected do not have issues with weather resistance ■ Custom color matching is also possible upon request *For more details, please refer to the PDF document or feel free to contact us.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0500K2

One-component UV-curable urethane acrylate resin. Suitable for substrate coating. Excellent workability with low viscosity of 550 mPa·s and quick curing for mass production.

The 『TRU-0500K2』 is a one-component UV-curable urethane acrylate resin developed for moisture-proof coating applications on electronic circuit boards. Its one-component design, which requires no mixing, makes it easy to handle, and it allows for rapid curing through UV irradiation (1,500mJ/cm²), making it suitable for energy-efficient and effective mass production processes. This product features a low viscosity design of 550mPa·s (25°C), providing excellent workability and making it easy to coat complex part shapes and narrow areas. The cured material has a Shore D hardness of 58, balancing flexibility and strength. Additionally, it boasts excellent insulation properties with a dielectric breakdown strength of 30kV/mm and a volume resistivity of 2×10^15Ω·cm, supporting the long-term reliability of electronic devices. The appearance is transparent, allowing for use without compromising the aesthetics of circuit boards and electronic components. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Low viscosity (550mPa·s) for good workability ■ High moisture resistance (water absorption rate of 0.3%), ensuring long-term reliability *For more details, a product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

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[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

[New Development] One-component Heat and UV Curing Epoxy Resin TE-5111K2

This is a one-component heat-curing and UV-curing epoxy resin for new development. It has a low curing shrinkage rate, a relatively high Tg point, and a fast curing time. [Properties table available]

TE-5111K is an epoxy resin with a low curing shrinkage rate, fast curing time, and a relatively high glass transition temperature of 153°C. It can cure using either heat or UV light, providing flexibility in work options. It can be used for sealing electrical and electronic components. One-component heat-curing, UV-curing white epoxy resin Features: low coefficient of thermal expansion, low shrinkage, high workability (relatively low viscosity), high heat resistance, short curing time *For details, we have published a product specification sheet, so please download the PDF from the link below or contact us. *Samples are also available, so please contact us if needed.

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[Book] Development of Biodegradable Biomass Plastics (2050 BOD)

[Book] Development of Biodegradable Biomass Plastics (2050 BOD)

【Technical Specialist Books】★ Case studies on measures against marine plastic waste and the transition to renewable resources!

Book Title: Biodegradation, Development and Application of Biomass Plastics －－－－－－－－－－－－－－－－－－－－－－－－－－ ★ Achieving 'Strength, Heat Resistance', 'Workability', and 'Cost' that can compete with conventional materials! Balancing the conflicting 'Weather Resistance / Degradability'! －－－－－－－－－－－－－－－－－－－－－－－－－－ ● Publication Date: March 31, 2020 ● Authors: 60 people ● Format: A4 size, 560 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-782-4 　　↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available 　　　　　 Price: 44,000 yen (tax included) ISBN: 978-4-86104-889-0 　　　　　 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－

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Molding and Processing: Miorex PGX-595 (HG)

Molding and Processing: Miorex PGX-595 (HG)

A highly reliable grade with excellent heat resistance, mechanical strength, and dimensional stability!

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PGX-595(HG) (Basic Grade)】 Heat resistance temperature (°C): 400 Compression creep (％): 0.08 Bending strength (MPa): 120–130 Compression strength (MPa): 420–480 Impact strength (J/cm): 2.5 Thermal expansion rate (1/°C): 2.3×10^5 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1=10^15, FW,★2=10^13 Water absorption rate: 0.1 Specific gravity: 2.0–2.1 Our company performs precision machining of PGX-595(HG) using numerous machine tools in a temperature-controlled environment 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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[Newly Developed Product] UV-Curable Epoxy Acrylate TRU-0153K

[Newly Developed Product] UV-Curable Epoxy Acrylate TRU-0153K

UV-curable urethane acrylate that balances transparency and durability. It has low viscosity and low hardness, providing flexibility and is effective for stress relief.

"TRU-0153K" is a one-component UV-curable urethane acrylate resin developed for the coating of electronic components. It can be cured in a short time using metal halide lamp irradiation (1,500 mJ/cm²), demonstrating high productivity even in mass production processes. This product has a low viscosity of 1,300 mPa·s and low hardness (Shore A35), providing flexible properties that relieve stress and prevent crack formation. Furthermore, it shows no change in hardness even after high-temperature testing at 150°C for 1,000 hours and 1,000 cycles of thermal cycling between -40°C and 150°C, exhibiting excellent moisture and heat resistance and durability. It balances high insulation and flexibility. 【Features】 ■ One-component UV-curable urethane acrylate resin ■ Short curing time (UV: 1,500 mJ/cm²) ■ Low viscosity and low hardness (Shore A35) with flexibility, effective for stress relief ■ No change in hardness after 150°C for 1,000 hours and -40°C to 150°C for 1,000 cycles *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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Molding and Processing: Miorex PMX-561/562

Molding and Processing: Miorex PMX-561/562

It has high heat resistance and cost-effectiveness, along with a versatility that allows it to be used in a wide range of applications.

The Miolex series is a product that combines excellent thermal insulation, mechanical strength, outstanding dimensional stability, exceptional cost performance, safety without the use of asbestos, electrical insulation, and machinability. 【PMX-561(HR-1) (Basic Grade)】 Heat resistance temperature (°C): 500 Compression creep (％): 0.27 Bending strength (MPa): 44–55 Compression strength (MPa): 120–150 Impact strength (J/cm): 1.1 Thermal expansion rate (1/°C): 9.0×10^6 Thermal conductivity (W): 0.3 Volume resistivity (Ω-cm): FW,★1 = 10^14, FW,★2 = 10^9 Water absorption rate: 4.0–0.6 Specific gravity: 2.0–2.2 At our company, we perform precision machining of PMX-561(HR-1) and PMX-562(HR-2) using a variety of machine tools in a temperature-controlled environment managed 24 hours a day. *For more details, please refer to the PDF document or feel free to contact us.

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Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

Development and Evaluation/Test Methods of High-Pressure Hydrogen Tanks for Fuel Cell Vehicles

What non-metal materials are required for the development of lightweight hydrogen containers at high pressures of 70 MPa!?

High-Pressure Hydrogen Tanks for Fuel Cell Vehicles: R&D, Safety Inspection, Regulatory Trends, etc. ★Will regulatory relaxation be implemented as a national policy!? What non-metallic materials are required for the development of lightweight hydrogen containers at 70 MPa!? 【Venue】 Kawasaki City International Exchange Center, 2nd Floor, Conference Room 5【Kanagawa, Kawasaki】 Date and Time August 23, 2013 (Friday) 11:00-16:00

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
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[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

[Newly Developed Product] UV-Curable Epoxy Resin TRU-0251FR

Easy to handle with one-component UV curing, high Tg epoxy resin equivalent to flame retardant V-0. Low viscosity of 1,300 mPa·s allows for penetration into fine details, ensuring reliable protection of electronic components.

"TRU-0251FR" is a one-component UV-curable epoxy resin suitable for coating and sealing applications of electronic components. It requires no mixing process, making it easy to handle, and allows for rapid curing through metal halide lamp irradiation (3,000mJ/cm²), significantly contributing to productivity improvements in mass production processes. This product has a low viscosity of 1,300 mPa·s, providing excellent workability and making it easy to apply to narrow spaces and complex-shaped parts. The cured material exhibits excellent mechanical properties with a Shore D hardness of 85, a bending strength of 50 MPa, and a bending modulus of elasticity of 1,400 MPa, along with a glass transition temperature of 91°C, demonstrating stable thermal characteristics. Its flame retardancy and low water absorption rate of 0.5% also ensure excellent moisture and heat resistance and safety. [Features] - One-component UV-curable epoxy resin - Rapid curing with UV irradiation (3,000mJ/cm²), suitable for mass production processes - Good workability with low viscosity (1,300 mPa·s) *For more details, a product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please reach out if needed.

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Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Fundamentals and Applications of Micronization of Polyimide Resin with Heat Resistance and Weather Resistance

Is there a technology that can micronize high heat-resistant polyimide? I will teach you a method to mass-produce uniform polyimide microparticles with consistent particle size.

Speaker Dr. Takayuki Ishizaka, Researcher, Compact Chemical Systems Research Center, National Institute of Advanced Industrial Science and Technology (AIST) Target Audience: Engineers, researchers, and beginners interested in polymer microparticles and polyimide technology Venue: Tekno Kawasaki, 4th Floor Exhibition Hall [Kanagawa, Kawasaki City] 5-minute walk from Tokyu Mizonokuchi Station East Exit or JR Musashi-Mizonokuchi Station Date and Time: October 26, 2011 (Wednesday) 13:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 participants from one company *Limited to Tech-Zone members who apply by October 12. Membership registration is free. *After October 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company. ◆If 3 participants from the same organization apply, the fee will be 69,300 yen.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • resin

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Fundamentals of Optical Transparent Resins, Property and Structure Control, and Application Technologies

Fundamentals of Optical Transparent Resins, Property and Structure Control, and Application Technologies

Balancing transparency and functionality: PMMA, polycarbonate, glass alternatives

★ How to maintain transparency while having functionalities such as shock resistance and heat resistance!? ☆ What are the key points to enhance the functionality of optical resins, such as refractive index and birefringence!? ★ Trends towards expanding applications such as displays and lenses, and the shift from glass to resin!? 【Instructors】 Part 1: Prof. Toshiaki Ogasawara, Department of Materials Science, Graduate School of Science and Engineering, Tokyo Institute of Technology (Ph.D. in Engineering) Part 2: Shu Kirihara, Technical Advisor at AndTech Co., Ltd. (Concurrent position: Technical Advisor at Chemical Co., Ltd., former Director of Bayer MaterialScience Innovation Center) Part 3: Jun Miyapo, Director of Kyoto Technical Center, Arkema Co., Ltd. (Ph.D. in Engineering) 【Venue】Tekuno Kawasaki, 1st Floor, Room 1 【Date and Time】Tuesday, May 20, 2014, 11:00 AM - 4:00 PM

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • resin

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General-purpose potting resin TE-6302 low viscosity/high strength product

General-purpose potting resin TE-6302 low viscosity/high strength product

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

TE-6302 Two-component hardening epoxy resin Features: Amine curing (can cure at room temperature), low viscosity, high strength Applications: Sealing and molding for various electrical and electronic components ■Mixing viscosity: 25℃ 1,600 (mPa·s) ■Bending strength: 116 (MPa) ■Recommended curing conditions: 60℃ x 5h (can also cure at room temperature)

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  • Other polymer materials
  • Other consumables
  • resin

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Transparent casting resin ER-400×EH-10 <Sample available>

Transparent casting resin ER-400×EH-10 <Sample available>

This is a transparent casting resin that can be used for resin tables and similar applications. It is a product designed to minimize discoloration caused by ultraviolet light.

This is a transparent casting resin that can be used for resin tables and similar applications. It is a two-component mixing type, and by mixing the main agent and hardener according to the specified ratio, it can cure without the need for special equipment. The reaction proceeds slowly, resulting in low heat generation, and due to the properties of epoxy resin, it has minimal shrinkage during curing. It is designed to counteract discoloration (yellowing) due to ultraviolet light, allowing it to maintain its color for an extended period. It is easy to color, and adding a light blue tint will help maintain a beautiful color for a longer time. It is designed to have low viscosity, making stirring and degassing easy. Its ultra-low viscosity provides good degassing properties even with natural degassing. If bubbles remain, increasing the liquid temperature using methods like a water bath can further enhance degassing. Bubbles floating on the surface can be eliminated by warming them with a hairdryer or similar device. If you have a vacuum degassing machine, it can easily remove bubbles. If bubbles are coming from porous inclusions like wood, you can prevent bubble formation by sealing the surface of the inclusions with resin beforehand.

  • Coating Agent
  • others
  • resin

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[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

[Newly Developed Product!] Room Temperature Curing Liquid Epoxy Resin TE-6420

This is a two-component, room temperature curing liquid epoxy resin for new product development. It has high toughness and high heat resistance, making it easy to use with room temperature short curing times. [Properties table available!]

TE-6420 is an epoxy resin with high toughness (crack resistance) and high heat resistance. It can be used for bonding, fixing, and sealing in areas where crack resistance is required. Being filler-free, it has low viscosity and excellent workability. Two-component, room temperature curing epoxy resin Features: Room temperature short curing time, high heat resistance, high toughness (crack resistance: high bending strength and high bending modulus), low viscosity *For details, we have published the product characteristics table, so please download the PDF from the link below or contact us. *Samples are also available, so if you need a sample, please contact us.

  • Other polymer materials
  • glue
  • Other electronic parts
  • resin

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