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resin(100) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Mar 04, 2026～Mar 31, 2026
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resin Product List

241～270 item / All 315 items

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-7820FR3

High Tg × Flame Retardant V-0 × Improved Copper Adhesion! Suitable for Power Device Encapsulation.

The "TE-7820FR3" is a two-component, heat-curing epoxy resin developed for power device encapsulation applications. With an easy-to-handle mixing ratio of 100/100, it achieves excellent filling properties due to its low viscosity and high workability. It features high heat resistance with a glass transition temperature of 174°C and flame retardancy equivalent to UL94 V-0 (2mm thickness). Additionally, it has been designed to improve adhesion to copper, enhancing the reliability of bonding with copper substrates and conductors. This makes it suitable for applications requiring thermal, electrical, and mechanical performance, such as semiconductor packages and power modules. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100/100) ■ High strength and high heat resistance (Tg = 174°C) ■ Excellent thermal cycle resistance with a low coefficient of thermal expansion (20ppm/K) ■ Flame retardancy: UL94 V-0 equivalent (2mm thickness) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity 4.0×10^16Ω·cm) *For more details, the product's specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

[New Development] Two-component Room Temperature Curing Epoxy Resin TE-1006-2

Room temperature curing × high adhesion × high moisture resistance! Epoxy resin for small motors and sensors. Cures at room temperature, energy-saving high-performance epoxy.

The TE-1006-2 is a two-component, room temperature curing epoxy resin developed for preventing liquid leakage in small motors and sensor components. It can cure without the need for heating, at 25°C for 24 hours or at 100°C for 30 minutes, contributing to improved work efficiency and energy savings on-site. This product exhibits a shear adhesive strength of 21 MPa (SUS/SUS, 25°C), ensuring high adhesive reliability. Furthermore, it is designed to have high heat and humidity resistance, maintaining performance even in harsh environments. With its high thixotropic properties, it excels in workability, making it easy to apply and build up in targeted areas, thus accommodating a wide range of applications such as sealing small motors, sensors, and electronic components. **Features** - Two-component, room temperature curing epoxy resin (mixing ratio 100:12) - High adhesion with a shear adhesive strength of 21 MPa - High heat and humidity resistance design ensures long-term reliability *For more details, the product's specification sheet is available for download as a PDF below, or you can contact us for more information.* *Samples are also available, so please contact us if needed.*

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DuPont™ Bespoke® SP-1 for solving vacuum process problems.

DuPont™ Bespoke® SP-1 for solving vacuum process problems.

100% polyimide. It has excellent strength, heat resistance, and electrical properties.

If the materials for processing are in stock, same-day shipping is possible. The size chart is available on our website. Please take a look.

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DCPD hydrocarbon resin

DCPD hydrocarbon resin

Free samples available! For the replacement of C5 petroleum resin!

It is cheaper than C5 petroleum resin, allowing for cost reduction. - Good compatibility with rubber. - Can be used as a modifier for paints and lacquers. - Improves color development, gloss, and drying properties of inks.

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[Research Material] Global Market for PE Pipe Resin

[Research Material] Global Market for PE Pipe Resin

World Market for PE Pipe Resin: PE 100, PE 80, Others, Water Supply Pipes, Sewer and Drainage Pipes, Oil and Gas Pipes, Agricultural Pipes, Others

This research report (Global PE Pipe Resin Market) investigates and analyzes the current status and outlook for the global PE pipe resin market over the next five years. It includes information on the overview of the global PE pipe resin market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the PE pipe resin market include PE 100, PE 80, and others, while the segments by application cover water supply pipes, sewage and drainage pipes, oil and gas pipes, agricultural pipes, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of PE pipe resin. The report also includes the market share of major companies in the PE pipe resin sector, product and business overviews, and sales performance.

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TE-7814V for Robot Precision Equipment

TE-7814V for Robot Precision Equipment

Improving the reliability of robotic precision equipment with high thermal conductivity and high Tg.

In the robot precision equipment industry, high operational accuracy and long lifespan are required. In particular, precise electronic components face the risk of performance degradation and failure due to heat generation. The TE-7814V addresses these issues with its high thermal conductivity, enhancing the reliability of the equipment. 【Application Scenarios】 - Electronic circuit boards for precision robots - Sensor modules - Actuators 【Benefits of Implementation】 - Suppression of malfunction due to thermal runaway - Extension of equipment lifespan - Achievement of stable operation

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Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Newly Developed Product: Two-Component Heat-Curing Epoxy Resin TE-6000

Low viscosity for thorough filling of details! An epoxy resin that can also be considered as a varnish alternative. Cures at room temperature and contributes to energy savings.

The "TE-6000" is a low-viscosity, high-strength epoxy resin suitable for encapsulating electronic and electrical components. It is a two-component system with a mixing ratio of 100:30, making it easy to handle, and it has low-temperature curing properties, allowing it to cure at 70°C for 3 hours or at room temperature. Additionally, it enhances flexibility in the production process and contributes to energy savings. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:30) ■ Low viscosity with excellent filling properties and workability ■ Low-temperature curing (70°C for 3 hours, room temperature curing also possible) ■ High strength (flexural strength 110 MPa, elastic modulus 3,000 MPa) ■ High insulation properties (dielectric breakdown strength 30 kV/mm, volume resistivity 1×10^16 Ω·cm) *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please contact us if needed.

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High-reliability epoxy resin TE-7814V for communication equipment

High-reliability epoxy resin TE-7814V for communication equipment

Contributes to stable operation of communication devices with high thermal conductivity and high Tg.

In the telecommunications industry, stable operation over a long period is required. Particularly for electronic components that are susceptible to temperature changes and external influences, heat dissipation measures and high insulation properties are essential. The TE-7814V addresses these challenges and contributes to the reliability improvement of communication equipment. 【Application Scenarios】 - Base stations - Servers - Communication modules 【Benefits of Implementation】 - Extended lifespan of components due to improved heat dissipation - Realization of stable operation through high insulation properties - Reduction of equipment downtime

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TE-7820FR3 for semiconductors

TE-7820FR3 for semiconductors

High Tg, flame retardant, improved copper adhesion! Ideal for power device encapsulation.

In the semiconductor industry, particularly in fields that require high reliability, the performance of encapsulation materials for power devices is crucial. To withstand temperature changes and vibrations, and to ensure long-term reliability, excellent heat resistance, flame retardancy, and high adhesion to substrates are essential. TE-7820FR3 has been developed to address these challenges and enhance the performance and reliability of power devices. 【Application Scenarios】 - Power modules - Semiconductor packages 【Benefits of Implementation】 - Improved thermal, electrical, and mechanical performance - Assurance of long-term product reliability

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[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

[Newly Developed Product] Two-Component Heat-Curing Epoxy Resin TE-7130

General-purpose epoxy resin for encapsulating electrical and electronic components. Suitable for encapsulating motors, coils, and more.

"TE-7130" is a general-purpose, two-component, heat-curing epoxy resin for the encapsulation of electrical and electronic components. With a mixing ratio of 100:20, it is easy to handle, and after curing, it becomes an encapsulant that combines high strength and high insulation properties. Its greatest feature is the realization of a low coefficient of linear expansion of 27 ppm/K. This reduces expansion and contraction due to temperature changes, thereby lowering the risk of crack formation. It is resistant to thermal cycling, ensuring long-term reliability for power devices and electronic components. [Features] - Two-component heat-curing epoxy resin (mixing ratio 100/20) - Low coefficient of linear expansion: 27 ppm/K → strong against thermal cycling, crack suppression - High insulation properties (dielectric breakdown strength 33 kV/mm, volume resistivity 1×10^16 Ω·cm) - High strength (flexural strength 141 MPa, flexural modulus 10,000 MPa) - Low water absorption rate of 0.1% ensures long-term stability *For more details, the product specification sheet is available for download as a PDF from the link below, or please contact us. *Samples are also available, so please contact us if needed.

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TE-7814V for semiconductor packaging

TE-7814V for semiconductor packaging

Improving the reliability of semiconductor devices with high thermal conductivity and high Tg.

In the semiconductor industry, as devices become smaller and more high-performance, ensuring thermal management and long-term reliability has become an important challenge. Encapsulation materials require high thermal conductivity and heat resistance, and it is essential to maximize the performance of the devices. TE-7814V was developed to address these challenges. 【Application Scenes】 - Power modules - Electronic devices - Heat dissipation encapsulation for electronic components that generate heat 【Benefits of Implementation】 - Achieves effective heat dissipation with a thermal conductivity of 2.5W/mK - Ensures reliability in high-temperature environments with a high Tg of 185°C - Low viscosity design allows for compatibility with complex component shapes

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Two-component heat-curing epoxy resin for automotive use TE-7814V

Two-component heat-curing epoxy resin for automotive use TE-7814V

High thermal conductivity 2.5 W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the automotive industry, reliable adhesion of components is essential to achieve both safety and durability. Particularly in areas exposed to high temperatures and vibrations, such as the engine compartment and vehicle structure, the performance of adhesives is crucial. Improper adhesion can lead to component detachment or performance degradation. TE-7814V offers high reliability in the adhesion of automotive parts, featuring high thermal conductivity and excellent heat resistance. 【Application Scenarios】 - Adhesion of engine components - Adhesion of vehicle structural components - Fixing of electronic components 【Benefits of Implementation】 - High adhesive strength - Excellent heat resistance - Assurance of long-term reliability

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Two-component heat-curing epoxy resin for electronic devices TE-7814V

Two-component heat-curing epoxy resin for electronic devices TE-7814V

High thermal conductivity 2.5W/mK × high Tg 185°C high-reliability low-viscosity epoxy resin

In the electronics industry, high insulation is required to ensure the long-term reliability of products. Particularly for electronic components exposed to temperature changes and vibrations, maintaining insulation performance is essential for preserving product performance. Inadequate insulation can lead to component failure or performance degradation. TE-7814V has high insulation properties, ensuring the long-term reliability of electronic devices. 【Usage Scenarios】 - Insulation of electronic devices - Insulation of power modules 【Benefits of Implementation】 - Improved long-term reliability of electronic devices - Maintenance of product performance - Reduced risk of component failure

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High Durability Epoxy Resin for Home Appliances TE-7814V

High Durability Epoxy Resin for Home Appliances TE-7814V

Achieving long-term reliability of home appliances with high thermal conductivity and high Tg.

In the home appliance industry, long-term reliability of products is required, and protecting electronic components, especially those exposed to heat and vibration, is crucial. The TE-7814V addresses these challenges with its high thermal conductivity and high Tg, contributing to the durability of home appliances. 【Usage Scenarios】 - Heat dissipation measures for electronic components prone to heating, such as motors and coils - Protection of electronic devices used in high-temperature environments - Extending the lifespan of products 【Effects of Implementation】 - Suppression of component degradation due to heat - Reduction of product failure risks - Improvement of long-term product reliability

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Two-component heat-curing epoxy resin for home appliances TE-7820FR3

Two-component heat-curing epoxy resin for home appliances TE-7820FR3

High Tg and flame retardant to improve the safety of electrical appliances.

In the home appliance industry, the safety and reliability of products are of utmost importance. Especially for products used in high-temperature environments, flame-retardant materials are essential. In the event of a fire, it is necessary to prevent the spread of flames and protect consumer safety. The TE-7820FR3 is equipped with flame retardancy equivalent to UL94 V-0, enhancing the safety of home appliances. 【Application Scenarios】 - Power units - Motors - Heaters 【Benefits of Implementation】 - Improved safety due to high flame retardancy - Increased product reliability - Enhanced customer satisfaction

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TE-7820FR3 for electronic devices

TE-7820FR3 for electronic devices

High Tg, flame retardant, improved copper adhesion! Enhancing the reliability of small electronic devices.

In the electronics industry, as products become smaller, the high-density mounting of components is advancing, leading to increased thermal and electrical stress. As a result, encapsulants are required to have high heat resistance, flame retardancy, and strong adhesion to copper substrates. TE-7820FR3 addresses these challenges and contributes to the reliability improvement of compact electronic devices. 【Application Scenarios】 - Power modules - Semiconductor packages - High-density mounting boards 【Benefits of Implementation】 - Improved product lifespan due to high heat resistance - Enhanced safety due to flame retardancy - Long-term reliability ensured by improved copper adhesion

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Room temperature short-term curing epoxy resin TE-6011K

Room temperature short-term curing epoxy resin TE-6011K

A two-component epoxy resin that cures in 4 hours at room temperature! The reduction in curing time leads to cost savings.

TE-6011K 2-component fast-curing epoxy resin Features: Cures in 4 hours at room temperature Applications: Insulation and protection of electrical and electronic components 【Specifications (excerpt)】 ■Mixing viscosity: 19,500 (mPa·s) at 25℃ ■Glass transition temperature: 40℃ ■Cured density: 1.65 (water displacement method) ■Mixing ratio R/H: 100/38 ■Curing conditions: 25℃ x 4h

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Impregnating sealant "Resinol 90C"

Impregnating sealant "Resinol 90C"

Leave it to us for gaps of 10μm to 100μm. We seal voids and cavities in powder metallurgy and die casting!

"Resinol 90C" is a sealing agent suitable for filling voids in powder metallurgy and pits in castings and die castings. Due to these voids and pits, powder metallurgy and die casting cannot undergo surface treatment and cannot be used for pressure applications, leading to usage restrictions. By using our impregnation sealing agent, "Resinol 90C," these issues will be resolved. 【Basic Properties】 ■ Material Acrylic resin ■ Heat Resistance -40℃ to 150℃ 【Target Materials】 ■ Powder metallurgy ■ Castings ■ Die castings ■ MIM ■ Pressed powders

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Special synthetic resin "Toughurea"

Special synthetic resin "Toughurea"

Forms a film of over 1mm with a single spray! A special synthetic resin that allows the use of sprayed products in 6 hours.

Tafurea is a special resin that excels in impact resistance, abrasion resistance, weather resistance, chemical resistance, waterproofing, and rust prevention. It can be coated over various materials, including metals, plastics, concrete, and wood. 【Features】 ■ Absorbs shocks due to high elasticity ■ Prevents scratches on products caused by friction ■ Usable with common chemical substances ■ Withstands harsh outdoor environments ■ Prevents moisture intrusion and rust ■ Reduces work time through spray application ■ 0% VOC (volatile organic compounds) content *For more details, please download the catalog or feel free to contact us.

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PBT Natural

PBT Natural

Features: A resin material with excellent electrical insulation properties over a wide temperature range, as well as high chemical resistance and abrasion resistance.

"PBT Natural" has excellent electrical properties and insulation over a wide temperature range, making it suitable for electronic device connectors, housings, and more. It has low water absorption and excellent dimensional stability. It is used in EV components, pulley parts, fan parts, and components related to electric vehicle development. 【Features】 ■ Polybutylene Terephthalate resin ■ Excellent electrical properties and chemical resistance ■ High strength and excellent dimensional stability ■ Weak against strong alkalis *Please feel free to contact us for more details about the material.

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Selection Table: Teflon Fluororesin PTFE

Selection Table: Teflon Fluororesin PTFE

Total production from design and manufacturing to construction and service! Introduction of the selection table.

At Nippon Sakas Co., Ltd., the Platech Division conducts a comprehensive operation from the manufacturing of precision plastic parts to bonding, welding, and assembly. This is a selection table for "Teflon Fluororesin PTFE," which excels in chemical resistance, heat resistance, and self-lubrication. It is used in a wide range of applications. 【Features】 ■ Chemical resistance and heat resistance ■ Self-lubrication ■ Used in a wide range of applications ■ Non-absorbent *For more details, please refer to the catalog or feel free to contact us.

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General-purpose potting resin TE-3106 low viscosity/high strength product

General-purpose potting resin TE-3106 low viscosity/high strength product

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

TE-3106 Two-component heating curing epoxy resin Features: Acid anhydride curing, low viscosity, high strength, crack resistance Applications: Potting for various electronic components ■ Mixing viscosity: 1,800 at 25℃ ■ Flexural strength: 150 (MPa) ■ Recommended curing conditions: 80℃ for 2 hours + 100℃ for 4 hours *For more details, please download the PDF below or feel free to contact us.

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Polystyrene resin "PSJ-Polystyrene G9001"

Polystyrene resin "PSJ-Polystyrene G9001"

Like regular GPPS, it can be molded by injection and extrusion! It is a heat-resistant grade product.

"PSJ-Polystyrene G9001" is a transparent heat-resistant styrene-based copolymer with a Vicat softening temperature approximately 15°C higher compared to high heat-resistant GPPS. Like regular GPPS, it can be processed by injection and extrusion molding. It is recommended for applications that require heat resistance, such as microwave containers. For more details about other products, please contact us. 【Features】 ■ Heat-resistant grade ■ Has heat resistance between GPPS and polycarbonate ■ Approximately 15°C higher Vicat softening temperature compared to high heat-resistant GPPS *For more details, please refer to the PDF document or feel free to contact us.

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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)

Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.

Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.

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[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

[New Development] Two-component Heat-Curing Epoxy Resin TE-7000

Fills in detail with low viscosity! A highly reliable epoxy resin that can also be considered as a varnish alternative. Flexible response to work plans with a usable time of 24 hours.

The "TE-7000" is a two-component, heat-curing epoxy resin suitable for sealing applications in electrical and electronic components. Its low viscosity design allows for excellent filling of details and can accommodate complex part shapes. This product has a long pot life of 24 hours (at 60°C), ensuring stable sealing operations while providing ample time for work processes. Additionally, it has a proven track record of passing high-temperature tests at 180 degrees and thermal tests at -40°C and 180°C. 【Features】 ■ Two-component heat-curing epoxy resin (mixing ratio 100:60) ■ Excellent filling properties and workability due to low viscosity ■ Long pot life of 24 hours (at 60°C) ■ High insulation properties (dielectric breakdown strength over 25kV/mm, volume resistivity > 1×10^16Ω·cm) ■ Flexural strength of 81MPa and flexural modulus of 2,400MPa ■ Low water absorption rate of 0.3% for improved reliability *For more details, the product's specification sheet is available for download as a PDF from the link below, or you can contact us for more information. *Samples are also available, so please contact us if needed.

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TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

TE-7172K3 for electronic devices: Balancing insulation and heat dissipation.

Insulating epoxy resin with room temperature curing, high thermal conductivity, and flexibility.

In the electronics industry, as product miniaturization and high performance progress, ensuring insulation performance while addressing heat dissipation has become an important challenge. In particular, densely mounted electronic components have a high risk of performance degradation and failure due to heat generation, necessitating reliable insulating materials. TE-7172K3 achieves both high insulation and thermal conductivity, addressing these challenges. 【Application Scenarios】 - Insulation of electronic components - Electronic devices requiring heat dissipation measures - Areas where stress relief is needed 【Benefits of Implementation】 - Reduction of failure risk due to insulation defects - Extension of product lifespan through improved heat dissipation performance - Prevention of cracks in substrates and modules

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Stability confirmation test of the electrical property modification of composite olefin resin.

Stability confirmation test of the electrical property modification of composite olefin resin.

This is the test result confirming the stability of the electrical properties modification of composite olefin resin.

Olefin resins, which are non-polar plastics made only from carbon and hydrogen, are represented by polyethylene (PE) and polypropylene (PP), both of which are produced in large quantities as materials through addition polymerization and are utilized in various molded products that benefit our daily lives. PE is adjusted for density and undergoes post-processing stretching treatments to change its crystallinity for different applications; generally, it is soft and commonly known for low-temperature injection molded products and packaging films. In contrast, PP, with a melting point of 165°C and a density of 0.9, has high crystallinity and excellent chemical resistance, as well as toughness that allows it to withstand long-term use under conditions of over 100°C with applied pressure. A wide variety of durable products are made from it, ranging from injection molded items like large containers to extruded products such as various industrial functional films and bags, as well as hollow molded products like bottles. For more details, please contact us or refer to the catalog.

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Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests on the electrical property modification of composite olefin resins.

Results of stability confirmation tests for the electrical property modification of composite olefin resins.

Olefin resins, which are non-polar plastics made only from carbon and hydrogen, are represented by polyethylene (PE) and polypropylene (PP). Both are produced in large quantities as materials through addition polymerization and are used in various molded products that benefit our daily lives. PE is adjusted for density and undergoes stretching treatment in post-processing to change its crystallinity for different applications; generally, it is soft and commonly known for low-temperature injection molded products and packaging films. In contrast, PP, with a melting point of 165°C and a density of 0.9, has high crystallinity and excellent chemical resistance. It is not only tough enough to withstand prolonged use at temperatures above 100°C under pressure but also produces a wide variety of durable products, ranging from injection molded items like large containers to extruded functional films and bags for various industries, as well as hollow molded products like bottles. For more details, please contact us or refer to our catalog.

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Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

Newly Developed Product: UV-Curable Epoxy Acrylate TRU-0220FR

UV-curable epoxy acrylate that balances transparency and high strength. Suitable for applications requiring reliability equivalent to UL94 V-0.

"TRU-0220FR" is a one-component UV-curable epoxy acrylate resin developed for the coating of electronic components. It allows for rapid curing under UV irradiation from a metal halide lamp (1,500mJ/cm²), contributing to improved productivity in mass production processes. This product features low viscosity (2,100mPa·s), making it easy to work with and suitable for filling and coating complex part shapes. It is flame-retardant (equivalent to UL94 V-0 at 5mm thickness) and can be adapted for use in fields where safety is a concern. It balances transparency and high hardness, with a low water absorption rate of 0.3%, providing excellent moisture and heat resistance. Suitable applications include electronic component coatings, transparent protective materials, and areas requiring heat resistance and flame retardancy. 【Features】 ■ One-component UV-curable epoxy acrylate resin ■ High reactivity with rapid curing (UV: 1,500mJ/cm²) ■ Excellent workability due to low viscosity *For more details, the product specification sheet is available for download as a PDF below, or please contact us. *Samples are also available, so please reach out if needed.

  • Other polymer materials
  • resin

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300℃ High Heat Resistant Resin TE-2107

300℃ High Heat Resistant Resin TE-2107

It is a heat-curing acrylic resin with high solder heat resistance of over 300℃.

TE-2107 is a heat-curable acrylic resin with high heat resistance. 【Features】 ■ High peel strength ■ High solder heat resistance (over 300℃) ■ High toughness resin ■ Non-silicone, non-fluorine type 【Applications】 ■ Adhesive for bonding sheets for FPC (Flexible Printed Circuit Boards) ■ Components requiring high heat resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Printed Circuit Board
  • Other electronic parts
  • resin

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