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substrate Product List and Ranking from 31 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

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  5. 5 スクリーンプロセス Kanagawa//others
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substrate Product ranking

Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
This ranking is based on the number of page views on our site.

  1. Introduction to the Functional Ceramic Products Division of Nikko Corporation for the 2025 fiscal year.
  2. Ideal for thermal print heads! A glaze substrate with excellent surface smoothness.
  3. 5 Examples of EMS/OEM/ODM Development in Electronic Devices! [Case Study Materials Available]
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Aluminum foil etched circuit board

substrate Product List

301～315 item / All 1407 items

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Have you ever been turned down for special substrate manufacturing?

Have you ever been turned down for special substrate manufacturing?

Accurate technical advice is possible! By introducing advanced equipment, we can accommodate a wide range of specialized substrates.

Our company is capable of handling a wide range of special substrates by creatively utilizing various equipment available in-house, starting with advanced DI (Direct Imaging) equipment. Additionally, since over 90% of our staff are full-time employees, we have accumulated extensive knowledge and know-how regarding substrates by inheriting past experiences, enabling us to provide accurate technical advice to our customers. Please feel free to consult us regarding any special substrates. 【Special substrates we can handle】 ■ Build-up substrates ■ Heat dissipation substrates ■ Impedance control substrates ■ Rigid-flex and multilayer flex substrates ■ Cavity substrates ■ Fine patterns *For more details, please refer to the PDF document or feel free to contact us.

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Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Are you struggling with medium lot manufacturing (500 to 2,000 pieces)?

Same manufacturing line as trial production! A 100% equipment utilization rate enables short delivery times for medium lot production.

Our company is equipped with large-capacity facilities as a prototype manufacturer, allowing us to produce not only small lots but also medium-lot prototypes and medium-volume production with short lead times. Thanks to the 100% operating rate of our large-capacity equipment, we can handle urgent requests without any issues, even for large quantities. We have secured sufficient inventory even during periods when material procurement was difficult, ensuring there are no delays in delivery. 【Features】 - Capable of producing small lots as well as medium-lot prototypes and medium-volume production with short lead times - 100% equipment operating rate - Sufficient inventory secured, with no delivery delays - Initial costs do not become excessively high - Capable of handling special substrates such as flexible and rigid-flex boards *For more details, please refer to the PDF document or feel free to contact us.

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Are you having trouble with substrate manufacturing and component mounting?

Are you having trouble with substrate manufacturing and component mounting?

We respond to various requests! We can handle everything from circuit board design to component assembly in one go.

We design conversations with our customers with care and create simple and easy-to-understand printed circuit boards. We have various experiences in board design, including power supply, analog, and high-frequency boards, and we respond to various requests for component mounting based on quantity and requirements. Since our assembly factories also have their areas of expertise, we partner with over 10 factories and coordinate according to the project needs. We can also accommodate requests for ultra-short delivery times along with board manufacturing. 【Board Design】 ■PADS ■Quadcept ■CR8000 ■CR5000 *For more details, please refer to the PDF document or feel free to contact us.

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NI-X expansion FPGA board

NI-X expansion FPGA board

Expansion FPGA board for National Instruments X Series

The NI-X expansion FPGA board is used in combination with National Instruments' X series boards. (It can also be used independently.)

  • Board materials
  • Other electric meters
  • Printed Circuit Board

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COB for optical communication

COB for optical communication

We propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. 【Features】 ○ Excellent high-frequency characteristics Optimal material selection, layer composition, and L/S can be determined through simulation, allowing for high consistency in control. ○ High-precision contour processing High-precision CCD processing can be performed to match the position of the patterns. ○ Highly reliable surface treatment Reliable plating processes for electrolytic and electroless wire bonding with gold and Ni/Pd/Au are available. *Detailed information such as "specifications" is available in the catalog. *For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Technical Introduction: "High-Frequency Technology"

Technical Introduction: "High-Frequency Technology"

Introducing high-frequency technology! We provide substrates that match the impedance of mounted components and the circuit board.

At Sato-Sen Co., Ltd., we can achieve the desired impedance matching and noise reduction through circuit design for high frequency, material selection, layer configuration, and impedance simulation based on patterns. Furthermore, we provide quality assurance with impedance measurement substrates. We also have design simulation capabilities for high frequency and a long history of mass production in the gigahertz range. 【Features】 - We offer substrates that match the impedance of mounted components and the board, which is required due to the increasing speed of transmission signals. - Using our in-house simulation software, we provide high-frequency printed circuit boards that meet your satisfaction through optimal material selection, layer configuration, and circuit design. → High-precision impedance control is possible due to our extensive database. - Impedance measurement can be conducted using our measurement equipment (TDR) with test coupons. → Compatible with Z0±7%, and prototypes can be made with ±5%. Please contact us for more details.

  • Printed Circuit Board

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Single-sided flexible printed circuit board (single-sided FPC)

Single-sided flexible printed circuit board (single-sided FPC)

The most standard specifications at a low cost.

This is the most basic structure of an FPC with a conductor pattern formed only on one side.

  • Printed Circuit Board

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Component Mounting Flexible Circuit Board (Component Mounting FPC)

Component Mounting Flexible Circuit Board (Component Mounting FPC)

Support for component mounting is also available.

This is an FPC with electronic components mounted.

  • Printed Circuit Board

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[Processing Results] Large-scale LBO Single Crystal Substrate

[Processing Results] Large-scale LBO Single Crystal Substrate

The distortion of the wavefront achieved an excellent polishing precision of 0.26μm! We have successfully processed the polishing of LBO single crystal substrates.

This is an introduction to the polishing processing results of the "large LBO single crystal substrate" (100×100×1.5mm). The disturbance of the transmitted wavefront achieves an excellent polishing accuracy of 0.26μm. We have successfully polished the LBO single crystal substrate, which is used in the LFEX laser. 【Overview】 ■ Shape accuracy: PV0.26μm, Measurement device: Zygo Verifire ATZ ■ Surface roughness: Sa0.44nm, Measurement device: Zygo NewView 8300 ■ Substrate size: 100×100×1.5mm *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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