Printed circuit board "HDI board"
Supports a variety of specifications, including compatibility with multiple impedance control specifications!
The "HDI substrate" is a printed circuit board created by forming copper circuit wiring on the surface of a resin board, stacking multiple layers, and then heating and bonding them together. It can accommodate a variety of specifications, including 4 to 54 layers, thicknesses from 0.5mm to 6.3mm, and multiple impedance control specifications. There are multilayer structures such as "IVH substrates," which use vias that connect only specific layers, and "build-up substrates," which create multilayer printed circuit boards by laminating each layer, laser drilling, and forming wiring and vias repeatedly. 【Features of IVH substrates】 ■ A method for producing multilayer printed circuit boards using vias that connect only specific layers. ■ Can improve integration density. *For more details, please refer to the PDF materials or feel free to contact us.
- Company:モリマーエスエスピー 本社
- Price:Other