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substrate Product List and Ranking from 576 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. スクリーンプロセス Kanagawa//others
  2. 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  3. 共立エレックス Saga//Ceramics
  4. 4 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  5. 5 アイン 本社工場 Nagano//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Ceramic substrate for firing setters 共立エレックス
  3. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  4. 4 PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  5. 5 Wrist Frequency Correction Vibration Acceleration Effective Value Measuring Instrument 'TVHP-001' 吉川電機製作所

substrate Product List

631～660 item / All 1969 items

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Bandata Industrial Co., Ltd. Business Introduction

Bandata Industrial Co., Ltd. Business Introduction

Technology that makes people happy, the potential of circuit boards. Aiming to create trusted people, products, and companies.

Our company is equipped with all the necessary facilities for design, manufacturing, and shipping as a circuit board manufacturer, ensuring high quality and precision. The circuit boards demanded by the times are "small and high-performance," with the mainstream moving towards "multi-layer" (multi-layer boards). By increasing the number of layers, we achieve space-saving, faster signal transmission, and reduced noise. Currently, Kunita can accommodate types ranging from 2 to 6 layers, contributing to the field of multi-layer boards used in high-power computers. We provide detailed services that leverage the advantages of being an independent company, not participating in large manufacturers. Please feel free to consult us with your requests. 【Sales Items】 ■ Printed circuit boards (single-sided, double-sided) ■ Various through-hole boards ■ Flexible boards ■ Flash boards ■ Aluminum base boards ■ Multi-layer boards, etc. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • substrate

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ADC substrate "ADC-SiTCP V2"

ADC substrate "ADC-SiTCP V2"

Compact design! This product can be connected to any analog circuit board using an 80-pin FX2 connector!

The "ADC-SiTCP V2" is an ADC board capable of digitizing 16-channel balanced analog inputs at a maximum of 80MSPS. Signals converted at high speed by a 12-bit ADC are measured at the timing from two LEMO connectors and output via "100BASE-TX." Since data taking using Ethernet is possible, a compact DAQ system can be configured with a PC and this board. 【Features】 ■ Compact design of 90x120mm ■ 100BASE-TX/10BASE-T Ethernet ■ ADC with a maximum of 80MSPS (standard 40MSPS) ■ Data taking using Ethernet is possible ■ Control of the analog board is also possible from this board *For more details, please refer to the PDF materials or feel free to contact us.

  • Other machine elements
  • substrate

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[Hardware Development Achievements] 64ch FPIX Board

[Hardware Development Achievements] 64ch FPIX Board

The created histogram is transferred to the PC via SiTCP! It has a structure with a heat-dissipating aluminum block placed at the bottom.

We assisted with KEK's FPIX project. This is a substrate developed in the measurement instrument development room to collect signals from a Si-APD chip, where the signals are sampled at 0.5 ns by an FPGA and histogrammed within the FPGA. The created histogram is transferred to a PC via SiTCP. To efficiently dissipate heat from components like the FPGA, most of the components are placed on the underside, and a heat-dissipating aluminum block is structured on the bottom. 【Overview of Achievements】 ■ Service: Hardware Development ■ Client: High Energy Accelerator Research Organization ■ Location: KEK PF *For more details, please refer to the related link page or feel free to contact us.

  • Other embedded systems (software and hardware)
  • Embedded system design service
  • substrate

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LED signal light circuit board unit 'MR1105-80ABG' 110φ teal

LED signal light circuit board unit 'MR1105-80ABG' 110φ teal

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-80ABG'. It is a best-selling product from our company, which specializes in LED signal light circuit board units for over 10 years. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V, also available in DC24V specification ■ Dimensions: 135mm square ■ Inner diameter: 110φ ■ Number of LEDs: 80 ■ Emission color: blue-green *For more details, please refer to the PDF document or feel free to contact us.

  • LED Module
  • substrate

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LED signal light circuit board unit 'MR1105-80AY' 110φ yellow

LED signal light circuit board unit 'MR1105-80AY' 110φ yellow

Wide-angle ultra-high brightness signal light board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1105-80AY'. It is a best-selling product from our company, a specialized manufacturer of LED signal light circuit board units, with over 10 years of experience. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply voltage: AC100V (DC24V version is also available) ■ Dimensions: 135mm square ■ Inner diameter: 110φ ■ Number of LEDs: 80 ■ Emission color: Yellow *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • substrate

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LED signal light circuit board unit 'MR1505-24CBG' 150φ blue-green

LED signal light circuit board unit 'MR1505-24CBG' 150φ blue-green

Wide-angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit, 'MR1505-24CBG,' which we handle. This product has been a best-seller for over 10 years as a specialized manufacturer of LED signal light circuit board units. Please feel free to contact us if you have any inquiries. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Cyan *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • substrate

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LED signal light circuit board unit 'MR1505-24CR' 150φ red

LED signal light circuit board unit 'MR1505-24CR' 150φ red

Wide beam angle ultra-high brightness signal light circuit board unit equipped with 5φ bullet-type LED.

We would like to introduce our LED signal light circuit board unit 'MR1505-24CR' that we handle. It is a best-selling product from a specialized manufacturer of LED signal light circuit board units for over 10 years. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Supply Voltage: DC24V ■ Dimensions: 180mm square ■ Inner Diameter: 150φ ■ Number of LEDs: 100 ■ Emission Color: Red *For more details, please refer to the PDF document or feel free to contact us.

  • Signal lights and rotating lights
  • substrate

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Prototype circuit board support

Prototype circuit board support

We will respond to prototype production, handle each process individually, and accommodate all aspects of a single prototype with a short delivery time.

Our company offers support for prototype circuit boards, with individual responses for each process, and we handle all aspects of a single prototype with a short lead time. 【Features】 ■ Support starting from one prototype ■ Quick response and short lead time ■ Comprehensive support from design to implementation, with individual process handling *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Wabou Electronics Co., Ltd. Business Introduction

Wabou Electronics Co., Ltd. Business Introduction

Creating products that leverage 40 years of experience in printed circuit board assembly and high-density mounting technology.

Wabou Electronics Co., Ltd. is a company that specializes in manufacturing and selling printed circuit board products, acting on behalf of manufacturers in the field of manufacturing. We handle everything from design to prototyping and mass production of printed circuit boards, including substrates and flip chips. We have developed departments for circuit design, small-lot and diverse manufacturing, high-density mounting, domestic manufacturing, and overseas manufacturing, establishing a production system that ensures high-level quality control and short delivery times. 【Business Activities】 ■ Manufacturing and sales of printed circuit board products ■ Processing and sales of solar power generation cells ■ Manufacturing of electronic components ■ Design, production, and sales of precision instruments *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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"FA Equipment" Comprehensive Catalog

"FA Equipment" Comprehensive Catalog

Leave it to us for FA equipment such as cleaning devices and warpage inspection machines.

This catalog is the product catalog of FTM Technical Services, a manufacturer of FA equipment that develops, designs, manufactures, and sells printed circuit board manufacturing equipment. It mainly features cleaning devices such as the MC series, equipped with dust-free advanced functions, and the GT series, which has a sales record of over 800 units. Additionally, we offer a rich lineup including warpage inspection machines, laminators, and drilling machines. [Contents] ■ MC Series ■ GT Series ■ RB Series ■ ST Series ■ DH Series *For more details, please download the PDF or contact us.

  • Other inspection equipment and devices
  • Other machine tools
  • Other industrial robots
  • substrate

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H.I. Systec Co., Ltd. Introduction to Various Semiconductor Testing Services

H.I. Systec Co., Ltd. Introduction to Various Semiconductor Testing Services

Leave it to us for all your semiconductor testing-related products.

H.I. Systec Co., Ltd. designs and manufactures various semiconductor-related test boards, including burn-in boards. We respond to customer specifications from design to production for all semiconductor testing processes (wafer, burn-in, final) related boards. Additionally, we provide reliable products with a better inspection system. 【Products】 ■ Burn-in boards ■ Front-end test boards ■ Conversion boards ■ Performance boards, etc. *For more details, please download the PDF or feel free to contact us.

  • Semiconductor inspection/test equipment
  • substrate

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Miyami Electronics Industry Co., Ltd. Business Introduction

Miyami Electronics Industry Co., Ltd. Business Introduction

Leave the manufacturing of printed circuit boards to us.

Mikami Electronics Co., Ltd. is engaged in the manufacturing and sales of printed circuit boards. We respond to needs from prototypes to mass production with our in-house developed equipment born from the production site. Additionally, we have a monthly production capacity of 8,000 m² and can accommodate various small quantity products and short delivery times. 【Features】 ■ Thin board support: from 0.5mm ■ Established line/space support (100μm/100μm) ■ Gerber data support (film, plates, routers, NC holes, checkers, Aol) *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Are you giving up on the quality of overseas-made circuit boards? We can support you with our proven track record in major automotive circuit boards.

Are you giving up on the quality of overseas-made circuit boards? We can support you with our proven track record in major automotive circuit boards.

Attention those struggling with substrate quality, cost reduction, and delivery times! We offer thorough quality control at overseas factories with over 10 years of experience. Special substrates like thick copper are also acceptable.

If you are looking for cost reduction and shorter delivery times for printed circuit boards but are worried about the many defects and troubles with overseas products, this is a must-read! Please consult with our company, which has 10 years of experience in automotive printed circuit boards for major manufacturers. 【Do you have any of these concerns?】 ■ Defects occurred with overseas products. The response from the overseas factory was poor, and in the end, we had to re-inspect and re-package domestically, resulting in unnecessary costs... ■ Despite multiple business trips to overseas factories, we were unable to produce satisfactory products... ■ Unexpected defects arose due to differences in temperament and language barriers with overseas partners... ■ I want to change the factory I order from, but I can't move forward due to many concerns... and more. Our engineers provide total support from design to printed circuit board assembly, inspection, and packaging as needed. We also accept orders for small quantities of various types, mass-produced boards, and special boards, starting from a single prototype sample. (Domestic manufacturing boards are also available.) *For more details, please feel free to contact us or download from the PDF.

  • Circuit board design and manufacturing
  • substrate

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Introduction to PLD Universal Circuit Board Manufacturing by Estacy Co., Ltd.

Introduction to PLD Universal Circuit Board Manufacturing by Estacy Co., Ltd.

We can meet the demand for low prices in small-scale production.

Estec Co., Ltd. has been receiving orders and producing custom checkers and control devices for many years, and among these, we manufacture PLD universal boards to meet short delivery times. Since we utilize PLD, complex operational circuits other than the input/output interface can be configured on a single chip. Additionally, in custom equipment, hardware design and PLD software design can proceed concurrently, allowing us to meet demands for short delivery times. 【Features】 ■ Capable of responding to low-cost demands in small-scale production ■ Flexible response to function additions and changes due to the use of PLD *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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LANC control board completed unit

LANC control board completed unit

This is a product for controlling a video deck or video camera with a LANC control terminal.

Introducing the "LANC Control Board Complete Unit." This product allows remote control of devices equipped with a LANC control terminal, such as video cameras and video decks. Since it can be controlled via contact input, it has a wide range of applications and is suitable for connecting controllers and other devices. Of course, it can also be used independently as a wired remote control. 【Features】 ■ Power is supplied from the LANC device, so no additional power source is needed. ■ The recording key operates with a single press. ■ Its contact input allows for broad applications, making it ideal for connecting controllers and other devices. *For any electrical-related inquiries or further details, please feel free to contact us.

  • Printed Circuit Board
  • substrate

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20-second recording and playback board completed unit

20-second recording and playback board completed unit

Even if the power is turned off, the message does not disappear! It can be used as a voice memo or built-in recording and playback board.

Introducing the "20-Second Recording and Playback Board - Complete Unit." The recorded content does not disappear even when the power is turned off. Additionally, since it records to a semiconductor, there is no degradation in sound quality no matter how many times it is played back. It features a circuit suitable for clear audio recording and playback. Recording occurs while the record button is pressed, and pressing the playback button will play back the recorded content. It can be used as a voice memo or an embedded recording and playback board. 【Features】 ■ Messages do not disappear even when the power is turned off ■ Capable of recording and playback for up to 20 seconds ■ No degradation in sound quality due to recording on a semiconductor ■ Clear sound with a circuit suitable for audio recording and playback ■ A board with an additional interface for external control can also be designed *Please feel free to contact us for any electrical-related issues or for more details.

  • Printed Circuit Board
  • substrate

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Large high multi-layer, large, long-length substrate

Large high multi-layer, large, long-length substrate

Motherboards for information and communication devices, capable of producing super-large sizes for BTB applications!

We can manufacture large circuit boards for motherboard, backboard, and server applications. We support up to 24 layers with dimensions of 750mm × 1,100mm. 【Features】 ■ Maximum product size: 1050 × 570mm ■ Capable of core processing with copper thickness of 300–400μm ■ Maximum total thickness: t5.0–6.0mm *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Printed circuit board "HDI board"

Printed circuit board "HDI board"

Supports a variety of specifications, including compatibility with multiple impedance control specifications!

The "HDI substrate" is a printed circuit board created by forming copper circuit wiring on the surface of a resin board, stacking multiple layers, and then heating and bonding them together. It can accommodate a variety of specifications, including 4 to 54 layers, thicknesses from 0.5mm to 6.3mm, and multiple impedance control specifications. There are multilayer structures such as "IVH substrates," which use vias that connect only specific layers, and "build-up substrates," which create multilayer printed circuit boards by laminating each layer, laser drilling, and forming wiring and vias repeatedly. 【Features of IVH substrates】 ■ A method for producing multilayer printed circuit boards using vias that connect only specific layers. ■ Can improve integration density. *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Metal core substrate

Metal core substrate

A board that connects the metal core and the normal substrate ground through through-hole plating. It achieves both improved heat dissipation characteristics and EMI countermeasures that were not present in conventional designs.

Our company handles "thick copper and special substrates." One of our recommended products is the metal substrate (outer type). 【Features】 This substrate dissipates heat from heated components through the metal by bonding metal to the substrate. ■ Metal core substrate - The metal core part is bonded to the substrate with TH plating. - Compatible with many metals such as aluminum and copper. - Effective for improving thermal conductivity, high-frequency response, and EMI countermeasures. *For more details, please refer to the PDF materials or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMC countermeasure products
  • substrate

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Microcircuit "High-Density Substrate"

Microcircuit "High-Density Substrate"

Stable peel strength can be achieved regardless of the substrate type! The semi-additive method accommodates fine patterns.

Our "High-Density Substrate" utilizes a semi-additive process to accommodate fine patterns. We employ a 5μm copper foil known as UTC for primary copper, achieving stable peel strength regardless of substrate type, and preventing abnormal gold plating due to palladium residue. Additionally, by adopting via-fill plating for electro-copper plating, we minimize variations in plating thickness and accommodate filled vias. With an any-layer stack structure and multi-stage build-up wiring boards at its core, we respond to various substrate needs from double-sided boards to multilayer boards. 【Features】 ■ Peel strength of 10N/cm or more ■ Adoption of via-fill plating for electro-copper plating *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Ultra-thin substrate

Ultra-thin substrate

Introducing products suitable for those looking to produce a small quantity of ultra-thin rigid substrates!

We would like to introduce our "Ultra-thin Substrate" that we handle. Detailed designs tailored to customer requirements are possible through layer composition, copper foil thickness, and lamination methods. It has become an ultra-thin printed circuit board while maintaining the characteristics of rigid substrates. It can accommodate a wide range of methods, including build-up processes and through-hole technology, and unlike flexible substrates, it possesses both the electrical characteristics and strength of rigid substrates. 【Features】 ■ Innovative substrate materials and methods for 4-layer and 6-layer designs ■ Detailed designs tailored to customer requirements through layer composition, copper foil thickness, and lamination methods ■ Accommodates a wide range of methods, including build-up processes and through-hole technology ■ An ultra-thin printed circuit board that maintains the characteristics of rigid substrates ■ Unlike flexible substrates, it combines the electrical characteristics and strength of rigid substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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Introduction to the SMT-A Line for M Size Line of Printed Circuit Board Surface Mounting

Introduction to the SMT-A Line for M Size Line of Printed Circuit Board Surface Mounting

The equipment specifications and facilities for the surface mount technology (SMT-A line) process of printed circuit boards have been updated.

We handle everything from prototype production to small-lot, multi-variety printed circuit board assembly and finished product packaging, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-A Line ◆ Target PCB Dimensions: 50(W)×50(L) to 250-330mm ◆ Target Component Dimensions: 0402 to 120x90mm, minimum 0.3mm pitch ◆ Target Component Height: up to 30mm ◆ Target Component Variety: 280 types (equivalent to 8mm tape) 【Equipment】 Laser Marker: LMC-3000 (Juts) Printer: SGP2 (Panasonic) linked with SPI SPI: VP-9000M (CKD) with 3D inspection function Mounting Machine: VM101 (Panasonic) Mounting Machine: VM102 (Panasonic) Mounting Machine: VM101 (Panasonic) for irregular components, with tray changer N2-compatible Reflow Oven: TNV-M508CR (Tamura Manufacturing) *For details, please download and view the materials.

  • Contract manufacturing
  • substrate

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Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

Implementation of L-size substrates is possible!! Here is a list of equipment specifications and facilities for the surface mount technology (SMT-B line) process of printed circuit boards.

We handle everything from small lot multi-variety printed circuit board assembly for L-size substrates to the assembly and packaging of finished products, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-B Line ◆ Target Substrate Dimensions: 50(W)×50(L) to 390–460mm ◆ Target Component Dimensions: 0402 to 120×90mm, minimum 0.4mm pitch ◆ Target Component Height: up to 28mm ◆ Target Component Variety: 280 varieties (equivalent to 8mm tape) 【Equipment】 Printer: SPG2 (Panasonic) with 2D solder inspection + coating function Mounting Machine: AM100 (Panasonic) Mounting Machine: AM100 (Panasonic) with tray changer N2 Compatible Reflow Oven: TNV-N568CR-P (Tamura Manufacturing) *For details, please download and view the materials.

  • Contract manufacturing
  • substrate

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Sapphire product "Sapphire substrate (for semiconductors)"

Sapphire product "Sapphire substrate (for semiconductors)"

We can provide 6-inch substrates stably at high quality and low price.

We offer "sapphire substrates (for semiconductors)" made from sapphire, which has excellent electrical insulation properties. Additionally, we have started growing single-crystal sapphire in the Republic of Lithuania, a nation known for its diligent and outstanding technical skills among the Baltic States. We are also producing high-quality, low-cost 6-inch substrates with a thickness of 1mm (TTV≦5μm, BOW≦10μm, warpage≦15μm). Please feel free to consult us if you have any requests. 【Features of Sapphire】 ■ Excellent electrical insulation and very good thermal conductivity ■ Chemically and thermally stable, with hardness close to that of diamond *For more details, please feel free to contact us.

  • Other electronic parts
  • Ceramics
  • substrate

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Fujigijutsu Co., Ltd. Business Introduction

Fujigijutsu Co., Ltd. Business Introduction

Leave the design and manufacturing of printed circuit boards to us.

Fujitech Co., Ltd. is engaged in the design of printed circuit board patterns and the sale of printed circuit boards. We have experienced first-class printed circuit board manufacturing design engineers on staff, capable of handling products in all fields, whether consumer goods or industrial products. Additionally, through partnerships with affiliated companies, we can manufacture circuit boards with extremely short lead times. Please feel free to contact us with your requests. 【Business Activities】 ■ Printed Circuit Board Design ■ Printed Circuit Board Manufacturing ■ Component Assembly *For more details, please download the PDF or contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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DBC substrate (Direct Bonded Copper)

DBC substrate (Direct Bonded Copper)

Ion migration risk is reduced! Insulation substrate for power modules.

The "DBC substrate (Direct Bonded Copper)" is an insulating substrate for power modules that can reduce the risk of ion migration. In the manufacturing of thick copper insulating substrates, conventional technology uses Ag bonding materials containing active metals such as titanium for the bonding of copper and ceramics. However, when high voltage is applied in a high humidity environment after pattern formation, the silver contained in the bonding material can grow in spots or protrusions between the electrodes, posing a risk of short-circuiting due to ion migration. Our DBC substrate reduces the risk of ion migration by bonding copper and ceramics without silver, significantly improving the reliability as an insulating substrate for power modules. 【Features】 ■ Excellent heat dissipation and heat resistance ■ Excellent electrical insulation ■ High strength ■ Low thermal expansion ■ Excellent wetting and solderability *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • substrate

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Printed circuit board "copper inlay board"

Printed circuit board "copper inlay board"

Achieves high heat dissipation! It can be relatively easily changed from the current substrate!

The "copper inlay substrate" is a printed circuit board that improves heat dissipation characteristics in specific areas by press-fitting copper pins directly beneath heat-generating components. By directly contacting heat-generating components with copper, which has high thermal conductivity, it achieves excellent heat dissipation and can be relatively easily modified from existing substrates. It enhances heat dissipation performance, which was insufficient with thermal vias that only have through holes. Additionally, it can suppress cost and weight increases associated with heat dissipation, and since it can directly apply the existing printed wiring board structure, it allows for relatively easy adaptation in printed circuit board design. 【Features】 ■ Partially improves heat dissipation characteristics ■ Relatively easy to modify from existing substrates ■ Enhances heat dissipation performance ■ Can suppress cost and weight increases related to heat dissipation ■ Can directly apply the existing printed wiring board structure, allowing for relatively easy adaptation in printed circuit board design *For more details, please refer to the PDF document or feel free to contact us.

  • Company：HNS
  • Price：Other
  • others
  • Printed Circuit Board
  • substrate

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Eco Assist Co., Ltd. Business Introduction

Eco Assist Co., Ltd. Business Introduction

Free collection of circuit boards, silicon, non-ferrous metals, and used computers in Imabari City, Ehime Prefecture is available at our company.

Eco Assist Co., Ltd. is promoting a recycling business for non-ferrous metals, precious metals, and rare metals. We can collect everything, including items that are no longer in use or have broken down. All collected products will be recycled and reused, so there will be no costs incurred for disposal. 【Business Activities】 ■ Purchasing and processing of OA equipment, purchasing and selling of non-ferrous metals ■ Purchasing and selling of plastics ■ Purchasing, processing, and selling of circuit boards ■ Purchasing and selling of metal silicon *For more details, please download the PDF or contact us.

  • Used goods purchase
  • Other services
  • substrate

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Support for creating non-eligible certificates for smartphones.

Support for creating non-eligible certificates for smartphones.

Export smartphones to China. Export the main circuit board of smartphones to China. Determine the applicability regarding the Foreign Exchange and Foreign Trade Act's security trade export control.

We will create a non-applicability determination parameter sheet based on the export order and foreign exchange order.

  • Legal
  • substrate

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