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substrate Product List and Ranking from 581 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  2. スクリーンプロセス Kanagawa//others
  3. ユメックス Saitama//Electronic Components and Semiconductors
  4. 4 沖電気工業 産業営業本部　産業営業統括室 Tokyo//Information and Communications
  5. 5 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
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substrate Product ranking

Last Updated： Aggregation Period:Sep 02, 2026～Sep 29, 2026
This ranking is based on the number of page views on our site.

  1. <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  2. Electronic equipment development and production ユメックス
  3. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  4. 4 Difficult-to-weld areas! Even when you're out and about! | High-strength adhesive for metals スリーエム ジャパン
  5. 4 Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社

substrate Product List

1891～1920 item / All 1956 items

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Railway Power Supply Circuit Board Design Handbook

Railway Power Supply Circuit Board Design Handbook

Condensing the know-how of power supply board design that supports the safety of railway systems.

In the railway industry, the reliability of power supply boards is extremely important for ensuring safety. Particularly in signal systems and control systems, which influence the stability of operations, design flaws in power supply boards can lead to serious accidents. This document explains the key points of board layout to maximize the performance of power ICs and contribute to safe railway operations. 【Usage Scenarios】 * Railway signal systems * Operation management systems * Emergency power supply systems 【Benefits of Implementation】 * Improved system reliability * Reduced accident risk * Realization of stable railway operations

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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Power Supply Circuit Design Handbook for Wearable Devices

Power Supply Circuit Design Handbook for Wearable Devices

Free technical documentation to support the miniaturization and high performance of wearable devices!

In the wearable device industry, miniaturization and power efficiency are critical challenges. In particular, a circuit board layout that maximizes the performance of power ICs is required within limited space. Improper pattern design can lead to noise generation and reduced efficiency, potentially adversely affecting device performance and battery life. Our "Key Points of Pattern Design in Power Boards" provides specific know-how to address these challenges based on case studies specialized in the design of wearable devices. This material will assist power design engineers in achieving optimal circuit board layouts for wearable device design. 【Usage Scenarios】 * Small wearable devices * Battery-powered devices * High-density mounted circuit boards 【Benefits of Implementation】 * Improved device stability through noise countermeasures * Extended battery life through improved power efficiency * Achieving both miniaturization and high performance

  • Switching Power Supply
  • Circuit board design and manufacturing
  • Technical and Reference Books
  • substrate

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[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

[Problems with Aluminum-Backed Boards] I want to adopt them, but the commercially available ones do not match the specifications.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using our unique method of bonding the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting with reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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[Concerns about Device Assembly] The circuit board is too thick and is warping.

[Concerns about Device Assembly] The circuit board is too thick and is warping.

Achieve grounding of the aluminum section! This improves the usability and design flexibility of the aluminum part. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing the thickness of aluminum or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum part ■ Dramatically improves the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Thick copper busbar substrates and coil substrates for ships.

Thick copper busbar substrates and coil substrates for ships.

Contributing to the control of ship propulsion! Improving reliability and efficiency through substrate technology for high current applications.

In ship propulsion control systems, the reliability and efficiency of components handling high currents are essential. In particular, complex wiring and high-voltage control can lead to issues such as miswiring troubles and space constraints. To address these challenges, by integrating busbars and coils into a substrate, we can achieve high insulation and simplify wiring, contributing to the construction of a safe and efficient propulsion control system. 【Application Scenarios】 - Consolidation of high-current circuits in propulsion control systems - Implementation of power devices (IGBT, SiC, etc.) - Effective utilization of onboard space 【Benefits of Implementation】 - Reduction in assembly labor and risk of miswiring - Space-saving and miniaturization of the entire device - Improved reliability due to high insulation performance

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

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Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Introduction of overseas expansion case in West Virginia, USA: Factory expansion and development in Mexico.

Responding to large new orders! Strengthening the production system for transformer-reactor components and control boards.

We would like to introduce a case where Diamond Electric Holdings (Japan) expanded its business in the automotive and air conditioning markets by establishing a presence in the United States and Mexico. In 2021, the company expanded its subsidiary, Diamond Electric Manufacturing (WV) in the United States, and in 2023, it established a subsidiary in Mexico as a subsidiary of Diamond Electric Manufacturing in the U.S., strengthening the production system from transformer reactor components to control boards. The reason for the expansion is to respond to large new orders from several domestic automobile manufacturers in the U.S. [Case Overview (Partial)] ■ Location: Eleanor, WV ■ Area: 37,000 sqft. ■ Expansion Investment Amount: $3.74 million ■ New Equipment Investment Amount: $18.61 million *For more details, please refer to the PDF document or feel free to contact us.

  • Other Auto Parts
  • substrate

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[Case Study] Request for substrate repair from a major chemical manufacturing plant.

[Case Study] Request for substrate repair from a major chemical manufacturing plant.

Leave all your substrate troubles to us! [On-site support available]

Here is a case study of our response to a circuit board repair request from a major chemical manufacturing plant! 【Situation at the time of request】 The production line was halted due to a malfunctioning circuit board. 【Inquiry details】 The customer had identified the location of the issue and requested a circuit board repair. 【Response】 Since the faulty circuit board was already known, it was sent to us for analysis. We conducted a failure diagnosis, repaired the circuit board, and then mailed it back to the customer for them to confirm its operation. *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • substrate

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[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

[Case Study] Request for duplication of a circuit board that cannot receive manufacturer support.

We also support circuit board repairs for discontinued products (EOS/EOSL products)!

We would like to introduce a case where we handled a request for the duplication of a circuit board that could not receive manufacturer support due to bankruptcy! 【Inquiry Details】 We received a request for a spare circuit board for a production line circuit board from a manufacturer that has already gone bankrupt and can no longer provide support. 【Response】 The circuit board was sent to us, and we used PinPoint in-house to analyze and restore the circuit board. We completed this in approximately one month! If you have any concerns, please feel free to contact us first.

  • Printed Circuit Board
  • substrate

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Impedance control board

Impedance control board

Impedance control board

We will design to match the necessary impedance values and ensure compatibility during the circuit board manufacturing process.

  • others
  • substrate

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IVH substrate

IVH substrate

IVH substrate

In prototype boards, the IVH method may be cheaper and have shorter lead times than build boards. We can provide a proposal in the quotation materials.

  • others
  • substrate

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Electrode growth substrate

Electrode growth substrate

Electrode growth substrate

It is a substrate that allows the terminal area on the substrate to grow thicker and taller than other terminals.

  • others
  • substrate

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Copper inlay substrate

Copper inlay substrate

Copper inlay substrate

By pressing copper directly under the heat-generating component, a significant heat dissipation effect can be achieved.

  • others
  • substrate

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Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

Tester board (performance/probe/semiconductor evaluation)

We have a track record of various custom boards for semiconductor testers.

  • others
  • substrate

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Ultra-low transmission loss substrate (MEGTRON6)

Ultra-low transmission loss substrate (MEGTRON6)

Ultra-Low Transmission Loss Substrate (MEGTRON6)

Design will be conducted using high-frequency substrates and high-speed transmission substrates.

  • others
  • substrate

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Prototyping and implementation achievements of various charger-related printed circuit boards.

Prototyping and implementation achievements of various charger-related printed circuit boards.

We would like to introduce our achievements in the production of various charger-related printed circuit boards. *For waterproof and dustproof measures for mounted boards!

Our company has a wealth of experience in manufacturing handheld processing equipment, charger circuit boards, memory card charger circuit boards, EV charging device control circuit boards, and more. Tojo Manufacturing offers one-stop total support from prototype printed circuit boards to final assembly. Please feel free to consult us if you have any concerns regarding delivery times or quality. 【Manufacturing Achievements】 ■ Handheld processing equipment and charger circuit boards ■ Memory card charger circuit boards ■ EV charging device control circuit boards, etc. *For more details, please refer to the external link page or feel free to contact us.

  • Printed Circuit Board
  • Processing Contract
  • substrate

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Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Puriken Co., Ltd. - Printed Circuit Board Design Resources and Achievements

Achievements in high-speed transmission lines, analog, and power-related areas! We also introduce CAD tools for design resources.

We would like to introduce our company's "Design Resources and Achievements." We have design achievements in high-speed transmission lines such as USB 3.0, SDI, HDMI, and LAN, as well as analog systems for various sensors, inverter boards for three-phase motors for electric bikes, UPS, and power supplies like AC adapters. Additionally, our design resources include CAD tools "CR-8000 Design Force" and "CR-5000 Board Designer." 【Design Resources (Partial)】 ■ CAD Tools ・CR-8000 Design Force ・CR-5000 Board Designer ・Options *For more details, please feel free to contact us.

  • Circuit board design and manufacturing
  • substrate

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Technical Document on Solder Resist Formation for Drones

Technical Document on Solder Resist Formation for Drones

Presenting technical documentation on solder resist technology that contributes to improving the environmental resistance of drones!

In the drone industry, high durability and reliability are required, making the environmental performance of circuit boards crucial. In particular, circuit boards that can withstand harsh environments such as temperature changes, vibrations, and humidity are essential. The proper selection and formation of solder resist contribute to solving these challenges. Our materials on solder resist formation technology are helpful in improving the reliability of drones. 【Usage Scenarios】 - Outdoor flight - Environments with significant temperature fluctuations - Environments with high vibrations 【Benefits of Implementation】 - Improved protection performance of circuit boards - Extended product lifespan - Reduced risk of failure

  • Printed Circuit Board
  • substrate

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[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction

  • Printed Circuit Board
  • substrate

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【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

【For Medical Devices】Understand in 3 Minutes! A Substrate That Releases Heat Faster

Explanation of the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling material inside the TH!

In the field of medical devices, there is a simultaneous demand for miniaturization and high performance. In particular, it is necessary to pack many electronic components into a limited space, making the heat dissipation performance of the circuit board crucial. Inadequate heat dissipation can lead to equipment malfunctions and a decrease in lifespan. Our materials on "circuit boards that dissipate heat faster" address these challenges. 【Application Scenarios】 - Miniature medical devices - Portable medical devices - High-density mounted circuit boards 【Effects of Implementation】 - Improved reliability of devices - Extended product lifespan - Achieving miniaturization

  • Printed Circuit Board
  • substrate

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【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

【For Home Appliances】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the home appliance industry, there is a demand for longer product lifespans. In particular, heat is one of the major factors that accelerate the deterioration of electronic components. High heat dissipation performance substrates enhance product reliability and contribute to longevity. Our "faster heat-dissipating substrate" addresses this challenge. 【Usage Scenarios】 * Design of home appliances * Improvement of product reliability * Longevity 【Effects of Implementation】 * Reduced risk of product failure * Improved product durability * Increased customer satisfaction

  • Printed Circuit Board
  • substrate

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A substrate that dissipates heat faster for industrial robots.

A substrate that dissipates heat faster for industrial robots.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Contributing to high precision.

In the industrial robot industry, thermal management of circuit boards is crucial for achieving high-precision movements. In particular, densely mounted electronic components tend to generate heat, which poses risks of performance degradation and failure due to heat. If thermal management is insufficient, the accuracy of the robot's movements may decline, negatively impacting product quality and production efficiency. Our "faster heat-dissipating circuit board" provides materials explaining the structural comparison of thermal vias and copper pins, as well as the effects of changing TH fillers, supporting the high precision of industrial robots by offering high thermal conductivity circuit boards. 【Usage Scenarios】 - Robot arms requiring high-precision positioning - Welding robots needing precise control - Conveying robots requiring high-speed operation 【Benefits of Implementation】 - Solving thermal issues of circuit boards to achieve stable robot operation - Improving product quality and yield - Reducing maintenance costs

  • Printed Circuit Board
  • substrate

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A substrate that dissipates heat faster for power electronics.

A substrate that dissipates heat faster for power electronics.

Presentation of thermal via and copper pin thermal conductivity comparison materials! Supporting high output.

In the power electronics industry, increasing output power is essential for improving product performance and miniaturization. However, with higher output power, the heat dissipation performance of the substrate becomes a challenge. Inadequate heat dissipation raises the risk of performance degradation and failure due to temperature rise in the device. Our products provide materials that explain the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material within the thermal vias, supporting the design of substrates with high heat dissipation. This contributes to improved product reliability and longevity. 【Usage Scenarios】 - High-output power devices - High-density mounting substrates - Use in high-temperature environments 【Benefits of Implementation】 - Improved heat dissipation performance - Enhanced product reliability - Increased device longevity

  • Printed Circuit Board
  • substrate

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【For Wearable Devices】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

【For Wearable Devices】Understand in 3 Minutes! A Circuit Board That Releases Heat Faster

Explaining the comparison of thermal conductivity between thermal vias and copper pins! Materials are being distributed.

In the wearable device industry, miniaturization and lightweight design are important challenges. With the enhancement of device performance, heat dissipation measures for the circuit board are essential, and thermal design significantly affects the reliability and performance of the product. Poor heat dissipation can lead to device malfunctions and reduced lifespan. The materials we provide regarding "circuit boards that dissipate heat faster" explain the structural comparison of thermal vias and copper pins, as well as the effects of changing the filling material in through-holes, contributing to the miniaturization and high performance of wearable devices. 【Usage Scenarios】 - High-density mounted circuit boards - Devices requiring miniaturization - Electronic equipment needing thermal management 【Benefits of Implementation】 - Improved heat dissipation - Enhanced device reliability - Extended product lifespan

  • Printed Circuit Board
  • substrate

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【For Game Consoles】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

【For Game Consoles】Understand in 3 Minutes! A Circuit Board that Dissipates Heat Faster

Explanation of the comparison of thermal conductivity between thermal vias and copper pins, as well as the effects of changing the filling material inside the TH!

In the gaming console industry, as performance increases, heat dissipation measures for circuit boards have become an important issue. Particularly when performing high-load processing, it is essential to mitigate the risks of performance degradation and failure due to heat. Our "circuit board that dissipates heat faster" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the effects of changing the filling material within through-holes, supporting the realization of high heat-dissipating circuit boards. This material will help understand the key points in circuit board design aimed at enhancing the performance of gaming consoles. 【Usage Scenarios】 - Development of high-performance gaming consoles - Circuit board design requiring heat management 【Benefits of Implementation】 - Reduces the risk of performance degradation due to heat - Improves product reliability - Streamlines circuit board design

  • Printed Circuit Board
  • substrate

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A substrate that dissipates heat faster for EV chargers.

A substrate that dissipates heat faster for EV chargers.

Presentation of thermal conductivity comparison materials between thermal vias and copper pins! For thermal management of rapid chargers.

In the EV charger industry, heat generation during rapid charging is a significant issue. Particularly during high-power charging, the heat dissipation performance of the substrate becomes a crucial factor that affects charging efficiency and product lifespan. Inadequate heat dissipation can lead to component degradation or failure, potentially compromising the reliability of the charger. Our "faster heat-dissipating substrate" provides materials that explain the structural comparisons of thermal vias and copper pins, as well as the differences in thermal conductivity due to variations in TH fillers, supporting thermal management for EV chargers. 【Usage Scenarios】 - Rapid chargers - High-power charging - Electronic devices requiring thermal management 【Benefits of Implementation】 - Improved heat dissipation - Extended product lifespan - Enhanced charging efficiency

  • Printed Circuit Board
  • substrate

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Presentation of substrate materials for electrical characteristic measurement for automobiles.

Presentation of substrate materials for electrical characteristic measurement for automobiles.

We present materials for a measurement substrate that contributes to improving the reliability of automobiles!

In the automotive industry, the reliability of electronic components is extremely important. In areas related to vehicle safety, particularly high quality is required. Measurement boards for electrical characteristics are necessary to evaluate important factors for ensuring reliability, such as impedance management and measurement method compatibility. Our materials explain the differences between measurement boards and general boards, as well as key points for matching impedance. This material will help improve the quality and ensure the reliability of automotive electronic components. 【Usage Scenarios】 - Design and development of in-vehicle electronic devices - Inspections in quality control departments - Evaluations at component manufacturers 【Effects of Implementation】 - Increased efficiency in electrical characteristic measurements - Improved accuracy in reliability evaluations - Shortened product development periods

  • Printed Circuit Board
  • substrate

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Data sheet for electrical characteristic measurement boards for medical devices.

Data sheet for electrical characteristic measurement boards for medical devices.

Presentation of materials for measurement boards that enhance the safety of medical devices!

In the medical device industry, product safety is the top priority. Accurate measurement of electrical characteristics is essential to ensure the reliability of devices and protect patient safety. Measurement errors can lead to incorrect diagnoses or treatments, potentially causing serious issues. Our documentation on electrical characteristic measurement boards provides information to enhance safety, including error factors in impedance management and the differences between measurement boards and standard boards. We encourage you to download and read it. 【Usage Scenarios】 - Electrical characteristic evaluation of medical devices - Confirmation of compliance with safety standards - Quality control in product development 【Benefits of Implementation】 - Improved safety through accurate measurements - Development of reliable medical devices - Compliance with regulations

  • Printed Circuit Board
  • substrate

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Data sheet for electrical characteristic measurement board for high-speed communication.

Data sheet for electrical characteristic measurement board for high-speed communication.

Presentation of materials for substrates used in electrical characteristic measurements supporting high-speed communication!

To meet the demand for higher speeds in the telecommunications industry, accurate electrical characteristic measurements are essential. Particularly when dealing with high-frequency signals, impedance matching and signal integrity significantly affect performance. Measurement errors can lead to system malfunctions or performance degradation. Our materials on electrical characteristic measurement boards explain the importance of impedance management and how to utilize measurement boards, supporting the development of high-speed communication systems. 【Usage Scenarios】 * Development of high-speed communication devices * High-frequency circuit design * Systems requiring impedance matching 【Benefits of Implementation】 * Improved system performance through accurate electrical characteristic measurements * Ensured signal integrity through optimized impedance management * Enhanced development efficiency through information provided in the materials

  • Printed Circuit Board
  • substrate

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